High Density Server - AMD EPYC™ 7002/7001 - 2U 4-Node DP 24-Bay SATA
- 2U 4-node with rear access server system
- Dual AMD EPYC™ 7002/7001 Series Processors per node
- 8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 1 x CMC port
- 24 x 2.5" SATA hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 8 x LP PCIe Gen3 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87 x 820
440 x 87 x 820
Motherboard
MZ61-HD0
CPU
AMD EPYC™ 7002 Series Processors
AMD EPYC™ 7001 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 200W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 7001 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 200W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200*/2933 MT/s
*Follow BIOS setting and memory QVL if running 3200 MT/s.
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200*/2933 MT/s
*Follow BIOS setting and memory QVL if running 3200 MT/s.
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 CMC port
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 CMC port
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x 2.5" SATA hot-swappable bays
or
4 x 2.5" SATA/SAS hot-swappable bays with SAS RAID Card
Total:
24 x 2.5" hot-swappable bays
SAS card is required for SAS devices support
6 x 2.5" SATA hot-swappable bays
or
4 x 2.5" SATA/SAS hot-swappable bays with SAS RAID Card
Total:
24 x 2.5" hot-swappable bays
SAS card is required for SAS devices support
RAID
Depends on SAS add-in cards
Expansion Slots
Per node:
2 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
Total:
8 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
2 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
Total:
8 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s
SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000
- Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
For AMD EPYC™ 7002 Series processors
Citrix Hypervisor 8.1.0 or later
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP4 (x64) or later
SUSE Linux Enterprise Server 15 SP1 (x64) or later
Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019 (x64)
For AMD EPYC™ 7001 Series processors
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Citrix Hypervisor 8.1.0 or later
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP4 (x64) or later
SUSE Linux Enterprise Server 15 SP1 (x64) or later
Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019 (x64)
For AMD EPYC™ 7001 Series processors
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
35 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H261-Z60
8 x CPU heatsinks
1 x Rail kit
8 x CPU heatsinks
1 x Rail kit
Part Numbers
- Barebone package: 6NH261Z60MR-00-A*
- Motherboard: 9MZ61HD0NR-00-2*
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH0O0: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
- Motherboard: 9MZ61HD0NR-00-2*
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH0O0: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
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晶片組
晶片組
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AMD Chipset Driver
Version : 1.07.12.1102
17.05 MB
Aug 06, 2019
作業系統: Windows Server 2016 64bit,Windows Server 2019
網路介面
網路介面
版本
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Intel® LAN Driver and Utility
Version : 24.0
542.58 MB
Aug 06, 2019
作業系統: Windows Server 2016 64bit,Windows Server 2019
顯示介面
顯示介面
版本
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ASPEED Graphic Driver
Version : 1.06
1.78 MB
Aug 06, 2019
作業系統: Windows Server 2016 64bit,Windows Server 2019
BIOS
說明
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日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
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檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
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Success Case
Articles
Success Case | June 02, 2023
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Tech Guide | July 18, 2023
如何挑選適當的伺服器冷卻方案? 技嘉科技《科技指南》系列文章
隨著科技進步,新一代的處理器使用更多電力、產出更多熱能。選購伺服器時,應當留意溫控問題,好的冷卻方案可確保伺服器正常運作,且不至於太耗電、或是需要頻繁的維修。 技嘉科技是高性能伺服器的領導品牌,本篇《科技指南》針對市面上廣泛使用的三種散熱方法(氣冷式、液冷式和浸沒式)逐一說明,並介紹技嘉的相關產品,協助您挑選最適合的解決方案。
Tech Guide | May 31, 2022
私有雲的需要與必要:如何評估企業的雲端部署
雲端運算盛行的當下,想必「私有雲」和「公有雲」對讀者來說不是第一次聽到。很有可能,在您的日常生活中,您已經受惠於這兩種雲端服務,但您真的了解兩者之間的差異嗎?如果有必要,您能幫您的工作場所建構「私有雲」嗎?技嘉科技是伺服器技術和雲端運算解決方案的知名品牌,發表本篇《科技指南》,目的是說明私有雲和公有雲的差別,並且介紹私有雲的種種優勢與限制;最後,本篇文章將推薦適合用來建造私有雲的技嘉科技伺服器產品,讓您有機會享用專屬於您的私有雲。
Tech Guide | March 16, 2022
淺談大數據分析應用,掌握先機的關鍵鑰匙
「大數據big data」或許不是陌生的名詞,但是,您知道它的原理和運用方法嗎?您是否聽說過「大數據的5V原則」?還有,您是否熟悉「做好大數據的三個基礎步驟」?更關鍵的是,如果您想使用大數據,您是否擁有適合的工具?技嘉科技是尖端科技解決方案的知名品牌,發表本篇《科技指南》,目的是介紹大數據的基本知識,淺談大數據所蘊藏的無限商機,並且推薦適用於大數據的技嘉科技伺服器產品,讓您能掌握大數據,解決生活和工作上所遇到的問題。
Tech Guide | February 11, 2022
ARM架構處理器的由來與優勢:從智慧型手機到超級電腦
ARM架構處理器是主流x86處理器架構以外的不同選擇,原本在行動裝置上穩居市占龍頭,如今,也逐漸在伺服器和資料中心產品中出現。技嘉科技是高性能伺服器產品的知名品牌,發表本篇《科技指南》文章,回顧ARM處理器的發展過程,介紹ARM產品的優勢與特性,並且推薦適用於不同領域的技嘉科技伺服器解決方案,協助您解決在工作上可能遇到的問題。
Tech Guide | January 11, 2022
了解叢集(Cluster)、叢集運算(Cluster Computing)與分散式運算
叢集運算是分散式運算的一種,類似平行運算或網格計算;差別在於,叢集運算在高可用性、負載平衡、高效能運算HPC等各方面擁有獨特優勢,因此自成一格。技嘉科技是高性能伺服器產品業界領袖,發表本篇《科技指南》文章,企圖解釋叢集運算的由來,以及它的優勢,並推薦給您適當的伺服器解決方案,讓您有機會建造自己的叢集運算系統。
Tech Guide | January 10, 2022
什麼是HPC高效能運算? 技嘉科技《科技指南》系列文章
隨著伺服器解決方案變得更為普及,常有人提起高效能運算(HPC);內行人把這個字掛在嘴邊,好像只要是伺服器產品,就應該提供HPC功能,HPC可以解決所有運算問題……您可能想要知道,HPC真正的優勢是什麼?您能如何應用? 技嘉科技是高性能伺服器產品的業界領袖,本次發表《科技指南》文章,目的是清楚解釋HPC定義,並透過真實世界HPC成功案例介紹,希望能夠幫您評估,HPC是否符合您的需求?如果需要HPC,技嘉科技能為您提供什麼服務?
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Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
Video | March 25, 2021
60秒小科普:看懂什麼是 Data Center 資料中心
數據中心是什麼? 數據中心(Data Center)是容納組織中IT設備的設施,包括伺服器、儲存、網路設備(如交換機、路由器和防火牆),以及組織和 ...
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