S451-3R0
已停產
4U 38-Bay Dual Processors Storage Server (Intel)
- 2nd Gen. Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
- 6-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 2 x 10Gb/s SFP+ and 2 x 1Gb/s LAN ports
- 1 x dedicated management port
- 36 x 3.5" SATA/SAS hot-swap HDD/ SSD bays
- 2 x 2.5" SATA hot-swap SSD bays for booting device
- SAS expander with 12Gb/s transfer speed
- 4 x PCIe Gen3 expansion slots
- Aspeed® AST2500 remote management controller
- Dual 1200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband EDR and Ethernet 100G products
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
482.6 x 177 x 625
482.6 x 177 x 625
Motherboard
CPU
2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 3647
Socket P
CPU TDP up to 145W
Socket P
CPU TDP up to 145W
Chipset
Intel® C621 Chipset
Memory
16 x DIMM slots
DDR4 memory supported only
6-channel memory per processor architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 145W (Max.)
* DCPMM 256GB x4 pcs
DCPMM installation locations:
DIMM_P0_(A1, D1)
DIMM_P1_(G1, J1)
NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
DDR4 memory supported only
6-channel memory per processor architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 145W (Max.)
* DCPMM 256GB x4 pcs
DCPMM installation locations:
DIMM_P0_(A1, D1)
DIMM_P1_(G1, J1)
NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN
2 x 10Gb/s SFP+ LAN ports (QLogic® QL41102)
2 x 1Gb/s LAN ports
1 x 10/100/1000 management LAN
2 x 1Gb/s LAN ports
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
Front side: 24 x 3.5" or 2.5" SATA/SAS hot-swappable HDD/SSD bays
Rear side: 12 x 3.5" or 2.5" SATA/SAS hot-swappable HDD/SSD bays
Rear side booting device bay: 2 x 2.5" hot-swappable SSD bays*
NOTE:
* For rear side 2.5" bays support Solid State Drives only due to thermal consideration
2 x Broadcom SAS3x36R expanders
Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s per port
Default configuration supports:
2 x SAS/SATA drives on rear side
SAS card is required to enable the drive bays
Suggested 12Gb/s SAS cards:
CRA4648
CSA4648
Rear side: 12 x 3.5" or 2.5" SATA/SAS hot-swappable HDD/SSD bays
Rear side booting device bay: 2 x 2.5" hot-swappable SSD bays*
NOTE:
* For rear side 2.5" bays support Solid State Drives only due to thermal consideration
2 x Broadcom SAS3x36R expanders
Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s per port
Default configuration supports:
2 x SAS/SATA drives on rear side
SAS card is required to enable the drive bays
Suggested 12Gb/s SAS cards:
CRA4648
CSA4648
SATA
2 x 7-pin SATA III 6Gb/s with SATA DOM supported
SAS
Depends on SAS add-on Card
RAID
Depends on SAS add-on Card
Peripheral Drives
N/A
Expansion Slots
Slot_7 (PCIe_4): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_6 (PCIe_3): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_5 (PCIe_2): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_4 (PCIe_1): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_0
1 x Mezzanine card slot:
- PCIe Gen3 x16 (x8+x8)
- From CPU_0
- Optional for OCP mezzanine card with low profile type
Slot_6 (PCIe_3): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_5 (PCIe_2): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_1
Slot_4 (PCIe_1): 1 x PCIe x16 (Gen3 x16 bus) slot from CPU_0
1 x Mezzanine card slot:
- PCIe Gen3 x16 (x8+x8)
- From CPU_0
- Optional for OCP mezzanine card with low profile type
Internal I/O
2 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x TPM header
1 x VROC connector
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x System status LED
4 x LAN activity LEDs
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x System status LED
4 x LAN activity LEDs
Rear I/O
2 x USB 3.0
1 x VGA
2 x SFP+
2 x RJ45
1 x MLAN
1 x ID button with LED
2 x LAN activity LEDs
1 x VGA
2 x SFP+
2 x RJ45
1 x MLAN
1 x ID button with LED
2 x LAN activity LEDs
Backplane Board
Bandwidth: SATAIII 6Gb/s or SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
2 x 1200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input: - 240Vdc/ 6A DC Output: - Max 1000W/ 100-240V~ +12V/ 80.5A +12Vsb/ 3A - Max 1200W/ 200-240V~ or 240Vdc input +12V/ 97A +12Vsb/ 3A
DC Input: - 240Vdc/ 6A DC Output: - Max 1000W/ 100-240V~ +12V/ 80.5A +12Vsb/ 3A - Max 1200W/ 200-240V~ or 240Vdc input +12V/ 97A +12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
For Skylake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
7 x 80x80x38mm (9,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 29.5kg
Gross Weight: 53 kg
Gross Weight: 53 kg
Packaging Dimensions
843 x 610 x 290 mm
Packaging Content
1 x S451-3R0
2 x CPU heatsinks
1 x Rail kit
2 x Non-Fabric CPU carriers
2 x CPU heatsinks
1 x Rail kit
2 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NS4513R0MR-00
- Motherboard: 9MD61SC2NR-00
- Rail kit: 25HB2-3A6803-I0R
- CPU heatsink: 25ST1-353105-T1R
- Back plane board_Front_24-port: 25FBZ-RS4240-I1R
- Back plane board_Rear_12-port: 25FBZ-RS2121-I1R
- Back plane board_Rear_2*2.5"-port: 25FBZ-RA1020-I1R
- Fan module: 25ST2-88382C-D0R
- 1200W power supply: 25EP0-212002-F3S
- 1600W power supply: 25EP0-216007-L0S (optional)
- Rail kit: 25HB2-3A6803-I0R
- CPU heatsink: 25ST1-353105-T1R
- Back plane board_Front_24-port: 25FBZ-RS4240-I1R
- Back plane board_Rear_12-port: 25FBZ-RS2121-I1R
- Back plane board_Rear_2*2.5"-port: 25FBZ-RA1020-I1R
- Fan module: 25ST2-88382C-D0R
- 1200W power supply: 25EP0-212002-F3S
- 1600W power supply: 25EP0-216007-L0S (optional)
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2019
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Ubuntu 16.04.2 LTS x64
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- RHEL 7.3 x64
- RHEL 6.9 x64
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
網路介面
網路介面
版本
檔案大小
日期
QLogic LAN Driver
Version : 18.80.1.2
8.43 MB
Aug 21, 2017
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit
QLogic LAN Driver
Version : 8.18.16.0
12.27 MB
Aug 21, 2017
作業系統: SLES 11.4 x64,RHEL 7.3 x64,SLES 12.2 x64,Ubuntu 16.04.2 LTS x64,Ubuntu 14.04.5 LTS x64,RHEL 6.9 x64
Intel® LAN Driver and Utility
Version : 23.5
487.48 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Linux,Windows Server 2016 64bit,Windows Server 2019
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
公用程式
BIOS
說明
版本
檔案大小
日期
1) Includes multiple security updates:
- CVE-2024-28047, CVE-2024-28956
- CWE-190, iSCSI Remote Memory Corruption and Dos.
- CWE-269, UEFI Variable Access - PlatformLang and Timeout.
2) Includes multiple feature updates.
Version : R24
20.28 MB
Nov 27, 2024
Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE-
2023-45237.
Version : R22
20.27 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
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工具程式
說明
版本
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手冊
說明
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檔案大小
日期
User Guide - BIOS setup manual (Intel Purley platform)
Version : 1.0
19.52 MB
Aug 17, 2017
英語
說明
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日期
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私有雲的需要與必要:如何評估企業的雲端部署
雲端運算盛行的當下,想必「私有雲」和「公有雲」對讀者來說不是第一次聽到。很有可能,在您的日常生活中,您已經受惠於這兩種雲端服務,但您真的了解兩者之間的差異嗎?如果有必要,您能幫您的工作場所建構「私有雲」嗎?技嘉科技是伺服器技術和雲端運算解決方案的知名品牌,發表本篇《科技指南》,目的是說明私有雲和公有雲的差別,並且介紹私有雲的種種優勢與限制;最後,本篇文章將推薦適合用來建造私有雲的技嘉科技伺服器產品,讓您有機會享用專屬於您的私有雲。
Tech Guide | January 11, 2022
了解叢集(Cluster)、叢集運算(Cluster Computing)與分散式運算
叢集運算是分散式運算的一種,類似平行運算或網格計算;差別在於,叢集運算在高可用性、負載平衡、高效能運算HPC等各方面擁有獨特優勢,因此自成一格。技嘉科技是高性能伺服器產品業界領袖,發表本篇《科技指南》文章,企圖解釋叢集運算的由來,以及它的優勢,並推薦給您適當的伺服器解決方案,讓您有機會建造自己的叢集運算系統。
Tech Guide | January 10, 2022
什麼是HPC高效能運算? 技嘉科技《科技指南》系列文章
隨著伺服器解決方案變得更為普及,常有人提起高效能運算(HPC);內行人把這個字掛在嘴邊,好像只要是伺服器產品,就應該提供HPC功能,HPC可以解決所有運算問題……您可能想要知道,HPC真正的優勢是什麼?您能如何應用? 技嘉科技是高性能伺服器產品的業界領袖,本次發表《科技指南》文章,目的是清楚解釋HPC定義,並透過真實世界HPC成功案例介紹,希望能夠幫您評估,HPC是否符合您的需求?如果需要HPC,技嘉科技能為您提供什麼服務?
Cloud | June 02, 2020
資料儲存系統是永續經營鏈中極為重要的一環
在科技越來越進步的時代,如何避免重要資料不小心被因人為因素導致遺失,或遭人蓄意破壞甚至盜取,是企業重要的一門課題,也是企業永續經營的關鍵。
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Video | July 28, 2021
Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
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Phoronix | June 04, 2019
GIGABYTE S451-3R0 Storage Server Offers A Great Xeon Scalable Platform With Up To 38 Drives
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