R281-3C1
Rack Server - 2nd/1st Gen Intel® Xeon® Scalable - 2U DP 12+2-Bay SATA/SAS
- Dual 2nd/1st Gen Intel® Xeon® Scalable Processors
- 6-Channel DDR4 RDIMM/LRDIMM, 24 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 2 x 1Gb/s LAN port via Intel® I350-AM2
- 12 x 3.5"/2.5" SATA/SAS hot-swappable bays
- 2 x 2.5" SATA hot-swappable bays
- Onboard 12Gb/s SAS expander
- 6 x FHHL PCIe Gen3 x16 and x8 slots
- 2 x LP PCIe Gen3 x16 and x8 slots
- 2 x OCP Gen3 x16 mezzanine slots
- Dual 1200W 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
438 x 87.5 x 730
438 x 87.5 x 730
Motherboard
MR91-FS0
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor, TDP up to 205W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Intel® Xeon® Scalable Processors
Dual processor, TDP up to 205W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 3647
Socket P
Socket P
Chipset
Intel® C621
Memory
24 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable Processors 205W (Max.)
* DCPMM 256GB x12 pcs
DCPMM installation locations:
DIMM_P0_(A1, B1, C1)
DIMM_P0_(D1, E1, F1)
DIMM_P1_(G1, H1, I1)
DIMM_P1_(J1, K1, L1)
Note:
1. 2933 MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable Processors 205W (Max.)
* DCPMM 256GB x12 pcs
DCPMM installation locations:
DIMM_P0_(A1, B1, C1)
DIMM_P0_(D1, E1, F1)
DIMM_P1_(G1, H1, I1)
DIMM_P1_(J1, K1, L1)
Note:
1. 2933 MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Rear side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
- 1 x VGA port
- 1 x VGA port
Storage
Front side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
SAS card is required to enable the drives
Rear side:
2 x 2.5" SATA hot-swappable bays connected to onboard SATA ports#
#SATA supported only due to thermal concern.
LSI SAS35x24R expander
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
Default configuration supports:
2 x SATA drives
Suggested 12Gb/s SAS cards:
CRA4448
CRA4548
CRAO438
CRAO558
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
SAS card is required to enable the drives
Rear side:
2 x 2.5" SATA hot-swappable bays connected to onboard SATA ports#
#SATA supported only due to thermal concern.
LSI SAS35x24R expander
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
Default configuration supports:
2 x SATA drives
Suggested 12Gb/s SAS cards:
CRA4448
CRA4548
CRAO438
CRAO558
SATA
2 x 7-pin SATA 6Gb/s with SATA DOM supported
By using pin_8 or external cable for power function
By using pin_8 or external cable for power function
SAS
Depends on SAS add-in cards
RAID
Depends on SAS add-in cards
Expansion Slots
Riser Card CRS2131:
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0
Riser Card CRS2132:
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot, from CPU_1
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot, from CPU_1
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0
Riser Card CRS2124:
- 1 x PCIe x8 (Gen3 x0 or x8) low-profile slot, from CPU_1
- 1 x PCIe x16 (Gen3 x16 or x8) low-profile slot, from CPU_1
1 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_0
1 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_1
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot, from CPU_0
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0
Riser Card CRS2132:
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot, from CPU_1
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot, from CPU_1
- 1 x PCIe x8 (Gen3 x8) FHHL slot, from CPU_0
Riser Card CRS2124:
- 1 x PCIe x8 (Gen3 x0 or x8) low-profile slot, from CPU_1
- 1 x PCIe x16 (Gen3 x16 or x8) low-profile slot, from CPU_1
1 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_0
1 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4, K2, K3), from CPU_1
Internal I/O
2 x Power supply connectors
4 x SlimSAS connectors
2 x SATA 7-pin connectors
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
4 x SlimSAS connectors
2 x SATA 7-pin connectors
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.0
1 x VGA
1 x COM (RJ45)
2 x RJ45
1 x MLAN
1 x ID button with LED
1 x VGA
1 x COM (RJ45)
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
Front side - CBP21C0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2020: SATA 6Gb/s
Front side - CBP21C0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2020: SATA 6Gb/s
TPM
1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000
- Optional TPM2.0 kit: CTM000
Power Supply
Dual 1200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc Input
+12V/ 97A
+12Vsb/ 3A
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc Input
+12V/ 97A
+12Vsb/ 3A
System Management
Aspeed® AST2500 Baseboard Management Controller
Avocent® MergePoint IPMI 2.0 web interface:
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Hardware information
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Fan profiles
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.4 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.4 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
28 kg with full packaging
Packaging Dimensions
982 x 588 x 268 mm
Packaging Content
1 x R281-3C1
2 x CPU heatsinks
1 x Rail kit
2 x Non-fabric CPU carriers
2 x CPU heatsinks
1 x Rail kit
2 x Non-fabric CPU carriers
Part Numbers
- Barebone package: 6NR2813C1MR-00-3*
- Motherboard: 9MR91FS0NR-00
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-353105-T1R
- Non-fabric CPU carrier: 12KRC-0F3647-50R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP21C0: 9CBP21C0NR-00
- Backplane board - CBP2020: 9CBP2020NR-00
- Fan module: 25ST2-883829-D0R
- Riser card - CRS2131: 9CRS2131NR-00
- Riser card - CRS2132: 9CRS2132NR-00
- Riser card - CRS2124: 9CRS2124NR-00
- SAS cable for PCIe type SAS card: 25CFM-800821-A4R
- Cable for rear HDD to expander: 25CFM-05K820-A4R
- Power supply: 25EP0-212002-F3S
Optional parts:
- SAS cable for OCP type SAS card: 25CFM-850820-A4R
- RJ45 type COM cable: 25CR0-200400-Y4R
- Motherboard: 9MR91FS0NR-00
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-353105-T1R
- Non-fabric CPU carrier: 12KRC-0F3647-50R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP21C0: 9CBP21C0NR-00
- Backplane board - CBP2020: 9CBP2020NR-00
- Fan module: 25ST2-883829-D0R
- Riser card - CRS2131: 9CRS2131NR-00
- Riser card - CRS2132: 9CRS2132NR-00
- Riser card - CRS2124: 9CRS2124NR-00
- SAS cable for PCIe type SAS card: 25CFM-800821-A4R
- Cable for rear HDD to expander: 25CFM-05K820-A4R
- Power supply: 25EP0-212002-F3S
Optional parts:
- SAS cable for OCP type SAS card: 25CFM-850820-A4R
- RJ45 type COM cable: 25CR0-200400-Y4R
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
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Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
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Intel® LAN Driver and Utility
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487.48 MB
Apr 18, 2019
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Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
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Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
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Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE- 2023-45237.
Version : R27
20.56 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
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0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
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147.89 MB
Sep 27, 2024
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Version : 2.12
926.33 MB
Jan 18, 2023
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Version : 2.5
720.29 MB
Dec 27, 2021
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Aug 17, 2017
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瀚草影視製作影集《2049》,2021年在網飛、台視、東森等平台播出;冉色斯動畫新作《2049+絕處逢聲》,是影集《2049》衍生系列,同步在myVideo首播。精妙絕倫的電腦動畫,使用國研院國網中心算圖農場的技嘉科技高效能運算伺服器渲染製作,透過伺服器搭載的NVIDIA®加速卡,動畫師能駕馭頂尖渲染技術,平行運算功能讓多名用戶能同時使用算圖服務,智慧管理功能則確保服務穩定性。千呼萬喚的台灣卡通巨作問世,《2049+絕處逢聲》受到國內外串流平台高度關注,台灣科技文創業的創意與巧思,期望能被全世界看見。
Success Case | June 01, 2023
泰國公有雲平台NIPA Cloud 用技嘉伺服器跟國際大廠並驅爭先
NIPA Cloud是泰國一家公有雲和私有雲雲端服務供應商。為了發表供企業使用的公有雲服務「NIPA Enterprise Public Cloud」,NIPA Cloud購買技嘉科技R系列機架式伺服器,搭載先進AMD EPYC™處理器和智慧管理功能,滿足客戶對運算效能、可用性及能源效率的需求。泰國市場競爭激烈,NIPA Cloud使用技嘉伺服器再創佳績,與國際雲端大廠AWS、GCP和Microsoft Azure分庭抗禮。
Success Case | May 30, 2023
西班牙IFISC用技嘉伺服器 為新冠肺炎、氣候變遷尋求解方
西班牙跨學科物理和複雜系統研究所,運用技嘉科技的先進伺服器產品,研究影響全人類的重大議題,包括:氣候變遷、環境污染、新冠肺炎。所面對的運算問題複雜且多元,技嘉伺服器使命必達,因為,研究所使用的三款伺服器,適合進行高效能運算、數值模擬、發展人工智慧、管理和分析大數據。
Success Case | April 23, 2023
AI教育遍地開花 新北小學導入人臉辨識「刷臉借書」
教育部大力推廣人工智慧(AI)教育,目標將AI導入學童生活,使傳統校園環境脫胎換骨。新北市數間小學率先導入技嘉智慧臉部辨識解決方案,以「刷臉借書、不用借書證」的智慧借閱系統,一方面推廣閱讀、一方面展現AI的實用案例,讓孩子親身體驗人工智慧的無限潛能。
Tech Guide | July 18, 2023
如何挑選適當的伺服器冷卻方案? 技嘉科技《科技指南》系列文章
隨著科技進步,新一代的處理器使用更多電力、產出更多熱能。選購伺服器時,應當留意溫控問題,好的冷卻方案可確保伺服器正常運作,且不至於太耗電、或是需要頻繁的維修。 技嘉科技是高性能伺服器的領導品牌,本篇《科技指南》針對市面上廣泛使用的三種散熱方法(氣冷式、液冷式和浸沒式)逐一說明,並介紹技嘉的相關產品,協助您挑選最適合的解決方案。
Tech Guide | May 31, 2022
私有雲的需要與必要:如何評估企業的雲端部署
雲端運算盛行的當下,想必「私有雲」和「公有雲」對讀者來說不是第一次聽到。很有可能,在您的日常生活中,您已經受惠於這兩種雲端服務,但您真的了解兩者之間的差異嗎?如果有必要,您能幫您的工作場所建構「私有雲」嗎?技嘉科技是伺服器技術和雲端運算解決方案的知名品牌,發表本篇《科技指南》,目的是說明私有雲和公有雲的差別,並且介紹私有雲的種種優勢與限制;最後,本篇文章將推薦適合用來建造私有雲的技嘉科技伺服器產品,讓您有機會享用專屬於您的私有雲。
Tech Guide | March 16, 2022
淺談大數據分析應用,掌握先機的關鍵鑰匙
「大數據big data」或許不是陌生的名詞,但是,您知道它的原理和運用方法嗎?您是否聽說過「大數據的5V原則」?還有,您是否熟悉「做好大數據的三個基礎步驟」?更關鍵的是,如果您想使用大數據,您是否擁有適合的工具?技嘉科技是尖端科技解決方案的知名品牌,發表本篇《科技指南》,目的是介紹大數據的基本知識,淺談大數據所蘊藏的無限商機,並且推薦適用於大數據的技嘉科技伺服器產品,讓您能掌握大數據,解決生活和工作上所遇到的問題。
Tech Guide | February 11, 2022
ARM架構處理器的由來與優勢:從智慧型手機到超級電腦
ARM架構處理器是主流x86處理器架構以外的不同選擇,原本在行動裝置上穩居市占龍頭,如今,也逐漸在伺服器和資料中心產品中出現。技嘉科技是高性能伺服器產品的知名品牌,發表本篇《科技指南》文章,回顧ARM處理器的發展過程,介紹ARM產品的優勢與特性,並且推薦適用於不同領域的技嘉科技伺服器解決方案,協助您解決在工作上可能遇到的問題。
Tech Guide | January 11, 2022
了解叢集(Cluster)、叢集運算(Cluster Computing)與分散式運算
叢集運算是分散式運算的一種,類似平行運算或網格計算;差別在於,叢集運算在高可用性、負載平衡、高效能運算HPC等各方面擁有獨特優勢,因此自成一格。技嘉科技是高性能伺服器產品業界領袖,發表本篇《科技指南》文章,企圖解釋叢集運算的由來,以及它的優勢,並推薦給您適當的伺服器解決方案,讓您有機會建造自己的叢集運算系統。
Tech Guide | January 10, 2022
什麼是HPC高效能運算? 技嘉科技《科技指南》系列文章
隨著伺服器解決方案變得更為普及,常有人提起高效能運算(HPC);內行人把這個字掛在嘴邊,好像只要是伺服器產品,就應該提供HPC功能,HPC可以解決所有運算問題……您可能想要知道,HPC真正的優勢是什麼?您能如何應用? 技嘉科技是高性能伺服器產品的業界領袖,本次發表《科技指南》文章,目的是清楚解釋HPC定義,並透過真實世界HPC成功案例介紹,希望能夠幫您評估,HPC是否符合您的需求?如果需要HPC,技嘉科技能為您提供什麼服務?
Video
Video | July 28, 2021
Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
Video | March 25, 2021
60秒小科普:看懂什麼是 Data Center 資料中心
數據中心是什麼? 數據中心(Data Center)是容納組織中IT設備的設施,包括伺服器、儲存、網路設備(如交換機、路由器和防火牆),以及組織和 ...
News
News | December 04, 2020
「技嘉新產品介紹暨合作夥伴年會」隆重登場 AMD解決方案成就多項代表性成功案例
EPYC™系列處理器提供高性價比與超強效能 推動高效能運算應用於粒子物理學、太空探索、氣候變遷等研究領域
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