H281-PE0
High Density Server - 2nd/1st Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay SATA/SAS
- Supports 5G network infrastructure
- 2U 4-node front access server system
- Dual 2nd/1st Gen Intel® Xeon® Scalable Processors per node
- 6-Channel DDR4 RDIMM/LRDIMM, 96 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 8 x 10Gb/s LAN ports via Intel® X550-BT2
- 1 x CMC port
- 8 x 2.5" SATA/SAS hot-swappable bays
- 4 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen3 x16 slots on the front side
- 8 x LP PCIe Gen3 x16 slots on the rear side
- 4 x OCP Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Front access
447 x 87 x 902.3
447 x 87 x 902.3
Motherboard
MH81-LM0
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset
Intel® C621
Memory
Per node:
24 x DIMM slots
Total:
96 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Note:
1. 2933 MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
24 x DIMM slots
Total:
96 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Note:
1. 2933 MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
LAN
Per node:
2 x 10Gb/s LAN ports (1 x Intel® X550-BT2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 10Gb/s LAN ports (4 x Intel® X550-BT2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port
2 x 10Gb/s LAN ports (1 x Intel® X550-BT2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 10Gb/s LAN ports (4 x Intel® X550-BT2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Per node:
2 x 2.5" 7mm SATA/SAS hot-swappable bays
Total:
8 x 2.5" 7mm SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
2 x 2.5" 7mm SATA/SAS hot-swappable bays
Total:
8 x 2.5" 7mm SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16) low-profile slot on the front side
2 x PCIe x16 (Gen3 x16) low-profile slots on the rear side
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280 cards
Total:
4 x PCIe x16 (Gen3 x16) low-profile slots on the front side
8 x PCIe x16 (Gen3 x16) low-profile slots on the rear side
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280 cards
1 x PCIe x16 (Gen3 x16) low-profile slot on the front side
2 x PCIe x16 (Gen3 x16) low-profile slots on the rear side
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280 cards
Total:
4 x PCIe x16 (Gen3 x16) low-profile slots on the front side
8 x PCIe x16 (Gen3 x16) low-profile slots on the rear side
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280 cards
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
4 x System status LEDs
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
4 x System status LEDs
Rear I/O
CMC module:
1 x MLAN
1 x MLAN Cascade Port
1 x Status LED
1 x Power on LED
Expansion module:
1 x Power on LED
1 x MLAN
1 x MLAN Cascade Port
1 x Status LED
1 x Power on LED
Expansion module:
1 x Power on LED
Backplane Board
Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s
SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST1250 Chassis Management Controller
Avocent® MergePoint IPMI 2.0 web interface:
Aspeed® AST1250 Chassis Management Controller
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Hardware information
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Fan profiles
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
System Fans
10 x 60x60x38mm (21,700rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
L6 system: 31.5kg
Packaging Dimensions
1167 x 770 x 280 mm
Packaging Content
1 x H281-PE0
8 x CPU heatsinks
1 x Rail kit
8 x Non-Fabric CPU carriers
8 x CPU heatsinks
1 x Rail kit
8 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH281PE0MR-00*
- Motherboard: 9MH81LM0NR-00
- System transfer board: 9CNBH07NR-00
- Backplane board - CBPH020: 9CBPH020NR-00
- CMC board: 9CMBH20NR-00
- Riser card - CRSH012: 9CRSH012NR-00
- Tool-less rail kit: 25HB2-A86102-K0R
- CPU heatsink 1: 25ST1-253206-C1R
- CPU heatsink 2: 25ST1-253207-C1R
- 7mm HDD/SSD tray: 25EK3-H28100-U0R
- Fan module: 25ST2-663821-S0S
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- Motherboard: 9MH81LM0NR-00
- System transfer board: 9CNBH07NR-00
- Backplane board - CBPH020: 9CBPH020NR-00
- CMC board: 9CMBH20NR-00
- Riser card - CRSH012: 9CRSH012NR-00
- Tool-less rail kit: 25HB2-A86102-K0R
- CPU heatsink 1: 25ST1-253206-C1R
- CPU heatsink 2: 25ST1-253207-C1R
- 7mm HDD/SSD tray: 25EK3-H28100-U0R
- Fan module: 25ST2-663821-S0S
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
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Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
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Intel® LAN Driver and Utility
Version : 23.5
487.48 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Linux,Windows Server 2016 64bit,Windows Server 2019
SATA RAID/AHCI
SATA RAID/AHCI
版本
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Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
公用程式
BIOS
說明
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日期
Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE- 2023-45237.
Version : R20
20.63 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
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檔案大小
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BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
使用手冊
說明
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User Guide - BIOS setup manual (Intel Purley platform)
Version : 1.0
19.52 MB
Aug 17, 2017
英語
說明
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