H274-A81-LAZ1

High Density Server - Intel^® Xeon^® 6 Processors - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 DLC

# 高效能運算伺服器 # 超融合伺服器 # 私有雲/混和雲伺服器

Direct liquid cooling solution with leak detection
2U 4-node rear access server system
Dual Intel^® Xeon^® 6 Processors per node, LGA 7529
12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x LP PCIe Gen5 x16 slots
4 x LP PCIe Gen5 x16 slots (optional)
2 x 3600W 80 PLUS Titanium redundant power supplies

Ordering Numbers:
With cold plates: 6NH274A81DR000LAZ1*
Without cold plates: 6NH274A81DZ000LAZ1*

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[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
447 x 86.8 x 895

Motherboard

MA84-HD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6900-Series Processors

Dual processor per node, TDP up to 500W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 7529
Socket BR

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
MRDIMM supported^[1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

^[1]MRDIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores.

^[Note]When 96GB DIMMs are installed, the maximum ambient temperature is limited to 30℃.

LAN

Rear (I/O board - CLNP319 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in ASPEED^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_1)

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key header

PCIe Expansion Slots

Riser Card CRCH010 x 8:
- 4 x LP x16 (Gen5 x16), from CPU_0
- 4 x LP x16 (Gen5 x16), from CPU_0^[1]

^[1]Enabling the slots requires specific cold plate loops and tubes relocation. Please contact our sales representatives if the feature is needed.

^[Note]When NVIDIA BlueField^®-3 DPUs/SuperNICs or ConnectX^®-7 NICs are installed, the maximum ambient temperature is limited to 30℃.

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLNP319 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID buttons with LED
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)

Power Supply^[#1]

2 x 3600W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 200-240V~/ 20A, 50/60Hz

DC Input:
- 240Vdc/ 20A

DC Output:
- Max 3120W/ 200-207V~
+12.2V/ 255.6A
+12.2Vsb/ 3A
- Max 3600W/ 208-240V~ or 240Vdc Input
+12.2V/ 295.1A
+12.2Vsb/ 3A

^[1]The system power supply requires SDG400 power cord.

System Management

ASPEED^® AST2600 Baseboard Management Controller
ASPEED^® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

1190 x 711 x 423 mm

Packaging Content

1 x H274-A81-LAZ1
4 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
8 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone with cold plates: 6NH274A81DR000LAZ1*
- Barebone without cold plates: 6NH274A81DZ000LAZ1*
- Motherboard: 9MA84HD0UR-000*
- L-shape Rail kit: 25HB2-A86104-K0R
- CoolIT CPU cold plate loop: 25ST7-10000F-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRCH010: 9CRCH010NR-00*
- I/O board - CLNP319: 9CLNP319NR-00*
- CoolIT leak sensor board - CDB81: 9CDB81NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-236003-L0S

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2025
Windows Server 2022
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver
(Intel^® Xeon^® 6 processors with E-cores.)

Version : 10.1.20020.8623

6.17 MB

Mar 13, 2025

H274-A81-LAZ1

SPECIFICATIONS

SUPPORT

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H274-A81-LAZ1