H231-G20
High Density Server - 2nd/1st Gen Intel® Xeon® Scalable - 2U 2-Node DP 2 x PCIe Gen3 GPUs
- Supports up to 2 x Dual slot Gen3 GPUs
- NVIDIA® validated GPU platform; Supports for NVIDIA® Tesla® GPUs
- 2U 2-node rear access server system
- Dual 2nd/1st Gen Intel® Xeon® Scalable Processors per node
- 6-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 4 x 10Gb/s LAN ports via Intel® X550-AT2
- 1 x CMC port
- 4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
- 20 x 2.5" SATA/SAS hot-swappable bays
- 2 x LP PCIe Gen3 x16 slots
- 2 x LP PCIe Gen3 x8 slots
- 2 x OCP Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87 x 820
440 x 87 x 820
Motherboard
MH61-HD3
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 3647
Total:
4 x LGA 3647
Socket P
2 x LGA 3647
Total:
4 x LGA 3647
Socket P
Chipset
Intel® C621
Memory
Per node:
16 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
*Ambient temperature 35°C
*2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
*DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
16 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
*Ambient temperature 35°C
*2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
*DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
2 x 10Gb/s LAN ports (1 x Intel® X550-AT2)
Support NCSI function (by switch)
1 x 10/100/1000 Mbps Management port
Total:
4 x 10Gb/s LAN ports (4 x Intel® X550-AT2)
Support NCSI function (by switch)
2 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port
*Omni-Path is supported in option.
2 x 10Gb/s LAN ports (1 x Intel® X550-AT2)
Support NCSI function (by switch)
1 x 10/100/1000 Mbps Management port
Total:
4 x 10Gb/s LAN ports (4 x Intel® X550-AT2)
Support NCSI function (by switch)
2 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port
*Omni-Path is supported in option.
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip in CMC board:
Integrated in Aspeed® AST1250
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip in CMC board:
Integrated in Aspeed® AST1250
Storage
Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays
1 x Broadcom SAS35x24R expander
Default configuration supports:
2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays
2 x Broadcom SAS35x24R expander
Default configuration supports:
4 x U.2 and 0 x SAS/SATA drives
SAS card is required to enable the drive bays
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays
1 x Broadcom SAS35x24R expander
Default configuration supports:
2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays
2 x Broadcom SAS35x24R expander
Default configuration supports:
4 x U.2 and 0 x SAS/SATA drives
SAS card is required to enable the drive bays
RAID
For SATA drives:
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1
Note: VROC module is for Intel® SSD only.
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1
Note: VROC module is for Intel® SSD only.
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots
2 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Note: For the latest GPU QVL, please contact your GIGABYTE representative.
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots
2 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth
Note: For the latest GPU QVL, please contact your GIGABYTE representative.
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
4 x USB 3.0
2 x VGA
4 x RJ45
2 x MLAN
2 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
4 x USB 3.0
2 x VGA
4 x RJ45
2 x MLAN
2 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000
- Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Hardware information
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Fan profiles
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019 (x64)
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019 (x64)
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019 (x64)
For Cascade Lake processors:
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019 (x64)
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Weight
30 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H231-G20
4 x CPU heatsinks
1 x Rail kit
1 x VROC module
4 x Non-Fabric CPU carriers
4 x CPU heatsinks
1 x Rail kit
1 x VROC module
4 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH231G20MR-00*
- Motherboard: 9MH61HD3NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
- Motherboard: 9MH61HD3NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2019
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver and Utility
Version : 23.5
487.48 MB
Apr 18, 2019
作業系統: Windows Server 2012 R2 64bit,Linux,Windows Server 2016 64bit,Windows Server 2019
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
作業系統: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
公用程式
BIOS
說明
版本
檔案大小
日期
Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE- 2023-45237.
Version : R20
19.27 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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工具程式
說明
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
BMC Firmware (AST1250) for CMC module
NOTE: For System Part Number -100/-A00, please download this file for AST1250 controller
NOTE: For System Part Number -100/-A00, please download this file for AST1250 controller
Version : 1.36
30.83 MB
Jul 22, 2020
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - BIOS setup manual (Intel Purley platform)
Version : 1.0
19.52 MB
Aug 17, 2017
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