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- 企業應用
- GPU 協同運算伺服器
- G262-ZL0
- CPU+GPU Direct liquid cooling solution
- Liquid cooled NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs
- NVIDIA® NVLink® technology
- Up to 600GB/s GPU to GPU interconnection
- AMD EPYC™ 7003 Series processors
- AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
- Dual processor, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
- 2 x 1Gb/s LAN ports (Intel® I350-AM2)
- 1 x Dedicated management port
- 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 3 x M.2 slots with PCIe Gen4 x4 interface
- 5 x LP PCIe Gen4 x16 slots
- 1 x OCP 3.0 Gen4 x16 slot
- Dual 3000W 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 86.8 x 800
448 x 86.8 x 800
Motherboard
MZ62-HD5 Rev. 3.0
CPU
AMD EPYC™ 7003 Series processors
AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
Dual processor, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
Dual processor, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
Socket
2 x LGA 4094
Socket SP3
Socket SP3
Chipset
System on Chip
Memory
16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200/2933 MHz
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200/2933 MHz
LAN
Front side:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 management LAN
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- (NVMe from PEX88096, SATA from CPU_0)
SAS card is required for SAS devices support
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- (NVMe from PEX88096, SATA from CPU_0)
SAS card is required for SAS devices support
SAS
Depends on SAS add-on card
RAID
N/A
Expansion Slots
Liquid cooled NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs
Front side:
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen4 x16) low-profile slots, from PEX88096
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW
1 x M.2 slot: (Onboard)
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
2 x M.2 slots (CMTP072):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2242/2260/2280/22110 cards
Front side:
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen4 x16) low-profile slots, from PEX88096
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW
1 x M.2 slot: (Onboard)
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
2 x M.2 slots (CMTP072):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2242/2260/2280/22110 cards
Internal I/O
3 x M.2 slots
1 x TPM header
1 x Front panel header
1 x TPM header
1 x Front panel header
Front I/O
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s
PCIe Gen4 x4 or SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Platinum redundant power supply
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage/Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
2 x 60x60x76mm (21,700rpm)
2 x 80x80x80mm (17,000rpm)
2 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions
1077 x 679 x 300 mm
Packaging Content
1 x G262-ZL0
1 x CPU liquid cooling kit
1 x L-shape Rail kit
1 x CPU liquid cooling kit
1 x L-shape Rail kit
Part Numbers
- Barebone w/ 40GB module: 6NG262ZL0MR-00-A*
- Motherboard: 9MZ62HD5NR-00
- CPU liquid cooling kit: 25ST7-200006-C4R
- GPU liquid cooling kit: 25ST7-3000G3-C4R
- L-shape Rail kit: 25HB2-A86102-K0R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R/25ST2-808035-S1R
- Power supply: 25EP0-230003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262ZL0SR-RMA-A100
- Motherboard: 9MZ62HD5NR-00
- CPU liquid cooling kit: 25ST7-200006-C4R
- GPU liquid cooling kit: 25ST7-3000G3-C4R
- L-shape Rail kit: 25HB2-A86102-K0R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R/25ST2-808035-S1R
- Power supply: 25EP0-230003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262ZL0SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
晶片組
晶片組
版本
檔案大小
日期
AMD Chipset Driver
For AMD EPYC 7002/ 7003
For AMD EPYC 7002/ 7003
Version : 2.10.09.156
17.22 MB
Mar 05, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Broadcom PCIe Switch Driver
Version : F18
3.56 MB
Dec 15, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
網路介面
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
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日期
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.83.50
104.38 MB
Sep 27, 2024
英語
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RESOURCES
Success Case
Articles
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Success Case | June 06, 2023
CSR、ESG實踐案例:技嘉助攻成功大學 勇奪亞太HPC-AI電腦競賽冠軍
技嘉科技是高性能伺服器解決方案的知名品牌,並且長期投入企業社會責任(CSR),環境、社會和企業治理(ESG)等永續經營目標。2020年,技嘉提供四台G482-Z50伺服器產品給台灣成功大學的超級電腦團隊,協助同學在當年的亞太地區「高速運算暨人工智慧(HPC-AI)學生競賽」上榮獲冠軍。技嘉伺服器的平行運算能力,伺服器之間的高效率資料傳輸,及長時間運作也不會出錯的穩定特性,讓這些伺服器能扮演參賽同學的神隊友。技嘉促進新一代HPC與AI人才培育,同時藉此機會回饋社會,透過高科技產品增進人類福祉。
Success Case | May 25, 2023
技嘉ARM伺服器發威 協助台大「高精準車流模型」開發效率提升200%
台灣大學施吉昇教授率領的研究團隊,使用技嘉科技G242-P32伺服器及Arm HPC Developer Kit,開發能夠準確模擬路況的「高精準車流模型」。尖端科技加持的智慧交通解決方案,可用來測試即將上市的自駕車,也能用來觀察易肇事路段,找出引發事故的背後因素。以ARM處理器做為基石的這套開發平台,讓科學家工作效率提升200%,成功因素包括:「雲端原生」處理器和路測裝置使用相同的「指令語法」,減少裝置間溝通的延遲;Ampere® Altra®處理器內含八十顆核心,適合進行平行運算;CPU和GPU間可發揮異質運算的綜效,提升運算效率。ARM產品符合ISO 26262標準要求,這表示台大推出的電腦模型可以快速應用於車廠和政府機關,協助開創智慧型運輸的大未來。
Tech Guide | May 31, 2022
私有雲的需要與必要:如何評估企業的雲端部署
雲端運算盛行的當下,想必「私有雲」和「公有雲」對讀者來說不是第一次聽到。很有可能,在您的日常生活中,您已經受惠於這兩種雲端服務,但您真的了解兩者之間的差異嗎?如果有必要,您能幫您的工作場所建構「私有雲」嗎?技嘉科技是伺服器技術和雲端運算解決方案的知名品牌,發表本篇《科技指南》,目的是說明私有雲和公有雲的差別,並且介紹私有雲的種種優勢與限制;最後,本篇文章將推薦適合用來建造私有雲的技嘉科技伺服器產品,讓您有機會享用專屬於您的私有雲。
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