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- GPU 協同運算伺服器
- G262-IR0
HPC/AI Server - 3rd Gen Intel® Xeon® Scalable - 2U DP HGX™ A100 80GB 4-GPU
- NVIDIA HGX™ A100 80GB with 4 x SXM4 GPUs
- NVIDIA® NVLink® technology
- Up to 600GB/s GPU to GPU interconnection
- 3rd Gen Intel® Xeon® Scalable Processors
- Dual processor, 10nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
- Intel® C621A Chipset
- Dual ROM Architecture
- 1 x Dedicated management port
- 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 6 x LP PCIe Gen4 x16 slots
- 1 x OCP 3.0 Gen4 x16 slot
- Dual 3000W 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 86.8 x 800
448 x 86.8 x 800
Motherboard
MH62-HD2
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Dual processor, 10nm technology
CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4189
Socket P+
Socket P+
Chipset
Intel® C621A Chipset
Memory
16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Front side:
1 x 10/100/1000 management LAN
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX88096
SAS card is required for SAS devices support
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX88096
SAS card is required for SAS devices support
SAS
Depends on SAS add-on card
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
NVIDIA HGX™ A100 80GB with 4 x SXM4 GPUs
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_1
4 x PCIe x16 (Gen4 x16) low-profile slots on rear side, from PEX88096
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_1
4 x PCIe x16 (Gen4 x16) low-profile slots on rear side, from PEX88096
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW
Internal I/O
1 x TPM header
1 x Front panel header
1 x OCP 3.0 slot
1 x Front panel header
1 x OCP 3.0 slot
Front I/O
2 x USB 3.0
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Platinum redundant power supply
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
Citrix Hypervisor 8.2.0 or later
System Fans
2 x 60x60x76mm (21,700rpm)
5 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25 kg
Packaging Dimensions
1077 x 679 x 300 mm
Packaging Content
1 x G262-IR0
2 x CPU fansinks
1 x L-shape Rail kit
2 x CPU fansinks
1 x L-shape Rail kit
Part Numbers
- Barebone w/ 80GB module: 6NG262IR0DR-00-8*
- Motherboard: 9MH62HD2NR-00
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU fansink: 25ST1-453100-M1R/25ST1-453101-M1R
- GPU heatsink: 25ST1-2532G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R
- Fan module: 25ST2-808034-S1R
- Fan module: 25ST2-808035-S1R
- Riser card - CRSG230: 9CRSG230NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- PCIe extension board - CPBG740: 9CPBG740NR-00
- Power supply: 25EP0-230003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262IR0SR-RMA-A100
- Motherboard: 9MH62HD2NR-00
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU fansink: 25ST1-453100-M1R/25ST1-453101-M1R
- GPU heatsink: 25ST1-2532G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R
- Fan module: 25ST2-808034-S1R
- Fan module: 25ST2-808035-S1R
- Riser card - CRSG230: 9CRSG230NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- PCIe extension board - CPBG740: 9CPBG740NR-00
- Power supply: 25EP0-230003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262IR0SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.18612.8252
3.08 MB
Jun 10, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Broadcom PCIe Switch Driver
Version : F18
3.56 MB
Dec 15, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18807.8279
3.29 MB
Apr 25, 2022
作業系統: Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver and Utility
Version : 27.0
714.97 MB
Apr 21, 2022
作業系統: Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.5.0.1991
4.17 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.5.0.1991
23.93 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.7.0.1273
7.07 MB
Apr 25, 2022
作業系統: Windows Server 2022
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.7.0.1273
23.58 MB
Apr 25, 2022
作業系統: Windows Server 2022
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
說明
版本
檔案大小
日期
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