G262-IR0

已停產

Rev. 100 Rev. 800

HPC/AI Server - 3rd Gen Intel^® Xeon^® Scalable - 2U DP HGX™ A100 40GB 4-GPU

Supports NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs
Supports NVIDIA^® NVLink^® technology
Up to 600GB/s GPU to GPU interconnection
3rd Gen Intel^® Xeon^® Scalable Processors
Dual processor, 10nm technology
8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
Intel^® C621A Chipset
Dual ROM Architecture
1 x Dedicated management port
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
6 x LP PCIe Gen4 x16 slots
1 x OCP 3.0 Gen4 x16 slot
Dual 3000W 80 PLUS Platinum redundant power supply

* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
448 x 86.8 x 800

Motherboard

MH62-HD2

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 4189
Socket P+

Chipset

Intel^® C621A Chipset

Memory

16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Front side:
1 x 10/100/1000 management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX88096

SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

NVIDIA HGX™ A100 40GB with 4 x SXM4 GPUs

1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_1
4 x PCIe x16 (Gen4 x16) low-profile slots on rear side, from PEX88096

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function by onboard NCSI_SW

Internal I/O

1 x TPM header
1 x Front panel header
1 x OCP 3.0 slot

Front I/O

2 x USB 3.0
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x HDD access LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Platinum redundant power supply

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-240V~/ 15.8A, 50-60Hz

DC Input:
- 240Vdc/ 14A

DC Output:
- Max 1200W/ 100-127V~
+ 54V/ 95.6A
+ 12Vsb/ 3.5A
- Max 3000W/ 200-240V~
+ 54V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later

Citrix Hypervisor 8.2.0 or later

System Fans

2 x 60x60x76mm (21,700rpm)
5 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 25 kg

Packaging Dimensions

1077 x 679 x 300 mm

Packaging Content

1 x G262-IR0
2 x CPU fansinks
1 x L-shape Rail kit

Part Numbers

- Barebone w/ 40GB module: 6NG262IR0DR-00-1*
- Motherboard: 9MH62HD2NR-00
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU fansink: 25ST1-453100-M1R/25ST1-453101-M1R
- GPU heatsink: 25ST1-2532G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-667630-S1R
- Fan module: 25ST2-808034-S1R
- Fan module: 25ST2-808035-S1R
- Riser card - CRSG230: 9CRSG230NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- PCIe extension board - CPBG740: 9CPBG740NR-00
- Power supply: 25EP0-230003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG262IR0SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

G262-IR0

SPECIFICATIONS

SUPPORT

RESOURCES

G262-IR0 (Rev. 100)