GIGABYTE NVMe SSD 512GB

GP-GSM2NE3512GNTD / G3NVME512G

產品規格

  • Interface
  • PCI-Express 3.0 x4, NVMe 1.4
  • Form Factor
  • M.2 2280
  • Total Capacity
  • 512GB
  • NAND
  • 3D TLC NAND Flash
  • External DDR Cache
  • N/A
  • Sequential Read speed
  • Up to 1,700 MB/s
  • Sequential Write speed
  • Up to 1,550MB/s
  • Dimension
  • 80 x 22 x 2.3 mm
  • Mean time between failure (MTBF)
  • 1.5 million hours
  • Max. Operating Power
  • Read : 3.3W; Write : 2.8W
  • Power Consumption (Idle, PS3)
  • 35mW
  • Power Consumption(PS4, L1.2)
  • 5mW
  • Temperature (Operating)
  • 0°C to 70°C
  • Temperature (Storage)
  • -40°C to 85°C
  • Warranty
  • 1. Limited 5-years or 800TBW.
    2. Limited warranty based on 5 years or 800TBW, whichever comes first. (*TBW is evaluated by JEDEC workload standard. )

    *TBW (Terabyte Written): Terabytes Written is the total amount of data that can be written into a SSD before it is likely to fail.


    3. When the usage of an NVME SSD as indicated by the "Percentage Used" (SMART ID: 05) in SMART page of "GIGABYTE SSD toolbox" reaches 100 means out of warranty. (A new unused product will show the number of 0)
  • Note
  • • Test system configuration: configuration may vary by models, we will choose the latest platform for verification.
    • Performance may vary based on SSD's firmware version and system hardware & configuration. Sequential performance measurements based on CrystalDiskMark and IOmeter 1.1.0.
    • Speeds based on internal testing. Actual performance may vary.
    • 1GB = 1 billion bytes. Actual useable capacity may vary.
Interface
Form Factor
Total Capacity
NAND
External DDR Cache
Sequential Read speed
Sequential Write speed
Dimension
Mean time between failure (MTBF)
Max. Operating Power
Power Consumption (Idle, PS3)
Power Consumption(PS4, L1.2)
Temperature (Operating)
Temperature (Storage)
Warranty
Note
PCI-Express 3.0 x4, NVMe 1.4
M.2 2280
512GB
3D TLC NAND Flash
N/A
Up to 1,700 MB/s
Up to 1,550MB/s
80 x 22 x 2.3 mm
1.5 million hours
Read : 3.3W; Write : 2.8W
35mW
5mW
0°C to 70°C
-40°C to 85°C
1. Limited 5-years or 800TBW.
2. Limited warranty based on 5 years or 800TBW, whichever comes first. (*TBW is evaluated by JEDEC workload standard. )

*TBW (Terabyte Written): Terabytes Written is the total amount of data that can be written into a SSD before it is likely to fail.


3. When the usage of an NVME SSD as indicated by the "Percentage Used" (SMART ID: 05) in SMART page of "GIGABYTE SSD toolbox" reaches 100 means out of warranty. (A new unused product will show the number of 0)
• Test system configuration: configuration may vary by models, we will choose the latest platform for verification.
• Performance may vary based on SSD's firmware version and system hardware & configuration. Sequential performance measurements based on CrystalDiskMark and IOmeter 1.1.0.
• Speeds based on internal testing. Actual performance may vary.
• 1GB = 1 billion bytes. Actual useable capacity may vary.
PCI-Express 3.0 x4, NVMe 1.4
M.2 2280
512GB
3D TLC NAND Flash
N/A
Up to 1,900 MB/s
Up to 1,200MB/s
80 x 22 x 2.3 mm
1.5 million hours
Read : 3.2W; Write : 3.2W
35mW
5mW
0°C to 70°C
-40°C to 85°C
1. Limited 3-years or 160TBW.
2. Limited warranty based on 3 years or 160TBW, whichever comes first. (*TBW is evaluated by JEDEC workload standard. )

*TBW (Terabyte Written): Terabytes Written is the total amount of data that can be written into a SSD before it is likely to fail.


3. When the usage of an NVME SSD as indicated by the "Percentage Used" (SMART ID: 05) in SMART page of "GIGABYTE SSD toolbox" reaches 100 means out of warranty. (A new unused product will show the number of 0)
• Test system configuration: configuration may vary by models, we will choose the latest platform for verification.
• Performance may vary based on SSD's firmware version and system hardware & configuration. Sequential performance measurements based on CrystalDiskMark and IOmeter 1.1.0.
• Speeds based on internal testing. Actual performance may vary.
• 1GB = 1 billion bytes. Actual useable capacity may vary.
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

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