XV23-VC0-AAJ1
NVIDIA MGX™ Arm Server - NVIDIA Grace™ CPU Superchip - 2U DP 4 x PCIe Gen5 GPUs
- Supports up to 4 x Dual slot Gen5 GPUs
- High-performance CPU for HPC and cloud computing
- NVIDIA MGX™ modular server design
- NVIDIA Grace™ CPU Superchip
- 900GB/s NVIDIA® NVLink®-C2C Interconnect
- Up to 960GB CPU LPDDR5X ECC memory
- Compatible with NVIDIA BlueField®-3 DPUs
- 2 x 2.5" Gen5 NVMe hot-swap bays
- 2 x M.2 slots with PCIe Gen5 x4 interface
- 4 x FHFL PCIe Gen5 x16 slots for GPUs
- 2 x FHFL PCIe Gen5 x16 slots for add-in cards
- 2+2 2000W 80 PLUS Titanium redundant power supplies
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
438 x 87 x 900
438 x 87 x 900
Motherboard
MVC3-MG0
Superchip
NVIDIA Grace™ CPU Superchip:
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 500W (CPU + memory)
- 2 x NVIDIA Grace™ CPUs
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 500W (CPU + memory)
Memory
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
Memory bandwidth up to 1TB/s
LAN
Front:
1 x 10/100/1000 Mbps Management LAN
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front hot-swap:
2 x 2.5" Gen5 NVMe
- (NVMe from CPU_0)
Internal M.2:
2 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1
2 x 2.5" Gen5 NVMe
- (NVMe from CPU_0)
Internal M.2:
2 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 6:
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 1 x FHFL x16 (Gen5 x16), from CPU_0
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
- 1 x FHFL x16 (Gen5 x16), from CPU_1
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 1 x FHFL x16 (Gen5 x16), from CPU_0
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
- 1 x FHFL x16 (Gen5 x16), from CPU_1
Front I/O
I/O board - CFPX040:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
- Optional TPM2.0 kit: CTM012
Power Supply
2+2 2000W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 13A, 50-60Hz
- 200-220V~/ 10A, 50-60Hz
- 220-240V~/ 10A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1800W/ 200-220V~
+12.2V/ 148A
+12.2Vsb/ 3A
- Max 2000W/ 220-240V~ or 240Vdc Input
+12.2V/ 164A
+12.2Vsb/ 3A
AC Input:
- 100-127V~/ 13A, 50-60Hz
- 200-220V~/ 10A, 50-60Hz
- 220-240V~/ 10A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1800W/ 200-220V~
+12.2V/ 148A
+12.2Vsb/ 3A
- Max 2000W/ 220-240V~ or 240Vdc Input
+12.2V/ 164A
+12.2Vsb/ 3A
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (15,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1195 x 740 x 455 mm
Packaging Content
1 x XV23-VC0-AAJ1
1 x Mini-DP to D-Sub cable
1 x DPU power cable (2x PCIe 8pin, 520mm)
2 x GPU power cables (12VHPWR, 450mm)
2 x GPU power cables (12VHPWR, 750mm)
1 x 3-Section Rail kit
1 x Mini-DP to D-Sub cable
1 x DPU power cable (2x PCIe 8pin, 520mm)
2 x GPU power cables (12VHPWR, 450mm)
2 x GPU power cables (12VHPWR, 750mm)
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NXV23VC0DR000AAJ1*
- Motherboard: 9MVC3MG0UR-000*
- 3-Section Rail kit: 25HB2-T76100-K0R
- Backplane board - CBPX060: 9CBPX060NR-00*
- Fan module: 25ST2-888024-D0R
- I/O board - CFPX040: 9CFPX040NR-00*
- DC-SCM board - CDCX100: 9CDCX100NR-00*
- Mini-DP to D-sub cable: 25CRN-200801-K1R
- DPU power cable (2x PCIe 8pin, 520mm): 25CRI-5201B0-Y4R
- GPU power cable (12VHPWR, 450mm): 25CRI-4500B0-Y4R
- GPU power cable (12VHPWR, 750mm): 25CRI-7500B0-Y4R
- Power supply: 25EP0-22000P-G1S
- Motherboard: 9MVC3MG0UR-000*
- 3-Section Rail kit: 25HB2-T76100-K0R
- Backplane board - CBPX060: 9CBPX060NR-00*
- Fan module: 25ST2-888024-D0R
- I/O board - CFPX040: 9CFPX040NR-00*
- DC-SCM board - CDCX100: 9CDCX100NR-00*
- Mini-DP to D-sub cable: 25CRN-200801-K1R
- DPU power cable (2x PCIe 8pin, 520mm): 25CRI-5201B0-Y4R
- GPU power cable (12VHPWR, 450mm): 25CRI-4500B0-Y4R
- GPU power cable (12VHPWR, 750mm): 25CRI-7500B0-Y4R
- Power supply: 25EP0-22000P-G1S
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
Firmware
OS
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