R263-S30- AAH2

Rack Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U UP 12-Bay SATA/SAS Titanium

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Single 5th/4th Gen Intel^® Xeon^® Scalable Processors
Single Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 16 x DIMMs
Dual ROM Architecture
1 x 1Gb/s LAN port via Intel^® I210-AT
12 x 3.5"/2.5" SATA/SAS hot-swap bays
1 x M.2 slot with PCIe Gen3 x4 interface
4 x FHHL PCIe Gen5 x16 and x8 slots
2 x OCP NIC 3.0 Gen5 x16 slots
1+1 1300W 80 PLUS Titanium redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 710

Motherboard

MS33-DC0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Single processor, TDP up to 350W

Socket

1 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

16 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

LAN

Rear:
1 x 1Gb/s LAN (1 x Intel^® I210-AT)
- Supports NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
12 x 3.5"/2.5" SATA/SAS^[1]

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from PCH

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5
Onboard VROC key header

Support optional RAID add-in cards

PCIe Expansion Slots

Riser Card CRS201C:
- 1 x FHHL x16 (Gen5 x16)
- 1 x FHHL x16 (Gen5 x8)

Riser Card CRS201D:
- 1 x FHHL x16 (Gen5 x16)
- 1 x FHHL x16 (Gen5 x8)

2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

Front I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x RJ45 port
1 x MLAN port
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 1300W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 7A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12.2V/ 106A
+12.2Vsb/ 3A

^[Note]GIGABYTE offers PSUs with various efficiency ratings and power outputs. Full redundancy may depend on your server configuration, and alternative PSU options may be needed. Please contact our sales representatives for the best power solution.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
VMware ESXi 8.0 (for 4400/3400 series)
VMware ESXi 8.0 (for 6400/5400 series)
VMware ESXi 8.0 (for 8400 series)
VMware ESXi 8.0 (for 4500/3500 series)
VMware ESXi 8.0 (for 4500/3500 series)
VMware ESXi 8.0 (for 6500/5500 series)
VMware ESXi 8.0 (for 8500 series)
Windows Server 2022

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 26 kg
Gross Weight: 28 kg

Packaging Dimensions

989 x 594 x 279 mm

Packaging Content

1 x R263-S30-AAH2
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
3 x Carriers
1 x 2-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NR263S30DR000ABH2*
- Barebone package (4th Gen): 6NR263S30DR000AAH2*
- Motherboard: 9MS33DC0UR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-323208-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP2001: 9CFP2001NR-00*
- Backplane board - CBP20C5: 9CBP20C5NR-00*
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201C: 9CRS201CNR-00*
- Riser card - CRS201D: 9CRS201DNR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21300C-G1S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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驅動程式
BIOS
工具程式
Firmware

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支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

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Windows Server 2022
Windows Server 2019
Linux

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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R263-S30-AAH2

R263-S30- AAH2