R183-Z90- LAD1

Rev. 3.x Rev. 1.x

Rack Server - AMD EPYC™ 9005/9004 - 1U DP 4-Bay Gen4 NVMe/SATA/SAS DLC

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Direct liquid cooling solution
Dual AMD EPYC™ 9005/9004 Series Processors
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swap bays
3 x M.2 slots with PCIe Gen3 x4 and x2 interface
1 x FHHL PCIe Gen5 x16 slot
2 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 1600W 80 PLUS Platinum redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 815

Motherboard

MZ93-FS0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 400W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Rear (G-SCM board - CDCR114):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS^[1]
- (NVMe from CPU_1)
- (SATA from CPU_0)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_0
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x2, from CPU_1

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

PCIe Expansion Slots

Riser Card CRS101T:
- 1 x FHHL x16 (Gen5 x16), from CPU_0

1 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Supports NCSI function

1 x OCP NIC 3.0 (Gen5 x16), from CPU_1
- Supports NCSI function

Front I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

G-SCM board - CDCR114:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x ID LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A

^[Note]GIGABYTE offers PSUs with various efficiency ratings and power outputs. Full redundancy may depend on your server configuration, and alternative PSU options may be needed. Please contact our sales representatives for the best power solution.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Red Hat Enterprise Linux 8.6 or later
Red Hat Enterprise Linux 9.0 or later
Windows Server 2022

System Fans

8 x 40x40x56mm (32,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Weight

Net Weight: 24.4 kg
Gross Weight: 26.4 kg

Packaging Dimensions

1086 x 588 x 261 mm

Packaging Content

1 x R183-Z90-LAD1
1 x CoolIT CPU cold plate loop
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit

Part Numbers

- Barebone w/ cold plates: 6NR183Z90DR000LCD1*
- Barebone w/o cold plates: 6NR183Z90DZ000LCD1*
- Motherboard: 9MZ93FS0UR-000-3*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CoolIT CPU cold plate loop: 25ST7-20000G-C4R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00*
- Backplane board - CBP1047: 9CBP1047NR-00*
- Fan module: 25ST2-40562H-A0R
- Riser card - CRS101T: 9CRS101TNR-00*
- G-SCM board - CDCR114: 9CDCR114NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-216008-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- CoolIT Leak sensor board: 6NR183Z90S1000LAD10
- RMA packaging: 6NR183Z90SR-RMA-L10*

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

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SPECIFICATIONS

SUPPORT

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R183-Z90-LAD1 (Rev. 3.x)

R183-Z90- LAD1