R182-N20

Rev. 100

Rack Server - 3rd Gen Intel^® Xeon^® Scalable - 1U DP 10-Bay Gen4 NVMe/SATA/SAS

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Dual 3rd Gen Intel^® Xeon^® Scalable Processors
8-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
Supports GRAID SupremeRAID NVMe/NVMe-oF RAID Card
2 x 1Gb/s LAN ports via Intel^® I350-AM2
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x 2.5" SATA/SAS hot-swappable bays
2 x FHHL PCIe Gen4 x16 slots
1 x OCP 3.0 Gen4 x16 slot
1 x OCP 2.0 Gen3 x8 mezzanine slot
1+1 1300W 80 PLUS Platinum redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 780

Motherboard

MR92-FS1

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4189
Socket P+

Chipset

Intel^® C621A

Memory

32 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 3200/2933/2666 MT/s

LAN

Rear side:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front side:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x 2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRS101E:
- 1 x PCIe x16 (Gen4 x16) FHHL slot, from CPU_0

Riser Card CRS101G:
- 1 x PCIe x16 (Gen4 x16) FHHL slot, from CPU_1

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth, from CPU_1
Supports NCSI function

Internal I/O

2 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector

Front I/O

1 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 1300W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 6.5A

DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12V/ 105.4A
+12Vsb/ 3A

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

System Fans

8 x 40x40x56mm (29,700rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 13.6 kg
Gross Weight: 23.4 kg

Packaging Dimensions

985 x 588 x 250 mm

Packaging Content

1 x R182-N20
2 x CPU heatsinks
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR182N20MR-00-1*
- Motherboard: 9MR92FS1NR-00
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-453204-M1R
- Backplane board - CBP10A5: 9CBP10A5NR-00
- Riser card - CRS101E: 9CRS101ENR-00
- Riser card - CRS101G: 9CRS101GNR-00
- Fan module: 25ST2-405623-A0R
- Power supply: 25EP0-213002-F3S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
- GRAID SupremeRAID Core Software Module License
a) SupremeRAID License: 25FC1-SR1000-AFS (4-native NVMe RAID)
- RMA packaging: 6NR182N20SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

R182-N20

SPECIFICATIONS

SUPPORT

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R182-N20 (Rev. 100)