R162-ZA2

Rev. A00

Rack Server - AMD EPYC™ 7003 - 1U UP 12-Bay Gen4 NVMe

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Hardware-level root of trust support
AMD EPYC™ 7003 Series processors
Single processor, 7nm technology
8-Channel DDR4 RDIMM/LRDIMM, 16 x DIMMs
2 x 1Gb/s LAN ports (Intel^® I350-AM2)
12 x 2.5" Gen4 NVMe hot-swappable bays
1 x M.2 slot with PCIe Gen4 x4 interface
2 x M.2 slots with PCIe Gen3 x4 interface
2 x FHHL PCIe Gen4 x16 and x8 slots
1 x Internal FHHL PCIe Gen4 x16 slot
1 x OCP 3.0 Gen4 x16 slot
1 x OCP 2.0 Gen3 x8 mezzanine slot
1+1 800W 80 PLUS Platinum redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 780

Motherboard

MZA2-CE0 Rev. 3.0

CPU

AMD EPYC™ 7003 Series processors
AMD EPYC™ 7002 Series processors
Single processor, 7nm technology
Up to 64 cores, 128 threads per processor
cTDP up to 240W

Note: Select 1300W power supply to support cTDP 280W CPU

Socket

1 x LGA 4094
Socket SP3

Chipset

System on Chip

Memory

16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200*/2933 MT/s

*Follow BIOS setting and memory QVL if running 3200 MT/s with 2DPC.

LAN

Rear side:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2500
- 1 x VGA port

Storage

Front side:
12 x 2.5" Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Riser Card CRS1221 x 2:
- 1 x PCIe x16 (Gen4 x16) FHHL slot
- 1 x PCIe x16 (Gen4 x8 or x16) FHHL slot, shared with OCP 2.0

Internal Riser Card CRS101H:
- 1 x PCIe x16 (Gen4 x16) FHHL slot, occupied by CNV3134, 4 x U.2 HBA

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x0 or x8 bandwidth, shared with CRS1221

1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

2 x M.2 slots (CMTP063):
- M-key
- PCIe Gen3 x4
- Supports 2280/22110 cards

Internal I/O

1 x TPM header

Front I/O

1 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 800W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-240V~/ 10-4A, 50-60Hz

DC Input:
- 240Vdc/ 4.5A

DC Output:
- Max 800W
+ 12V/ 66A
+ 12Vsb/ 2.5A

System Management

Aspeed^® AST2500 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

System Fans

4 x 40x40x56mm (29,700rpm)
4 x 40x40x28mm (25,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 14.6 kg

Packaging Dimensions

1038 x 588 x 223 mm

Packaging Content

1 x R162-ZA2
1 x CPU heatsink
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR162ZA2MR-00-A*
- Motherboard: 9MZA2CE0NR-00
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443107-A3R
- Front panel board - CFP1030: 9CFP1030NR-00
- Backplane board - CBP10C0: 9CBP10C0NR-00
- Riser card - CRS1221: 9CRS1221NR-00
- Internal Riser card - CRS101H: 9CRS101HNR-00
- 4-port NVMe card - CNVP142: 9CNVP142NR-00
- Fan module: 25ST2-405622-A0R/25ST2-442828-D0R
- Power supply (800W): 25EP0-208004-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- Power Supply (1300W): 25EP0-213004-F3S
- Power Supply (1300W): 25EP0-213006-F3S
- RMA packaging: 6NR162ZA2SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

AMD Chipset Driver
For AMD EPYC 7002/ 7003

Version : 2.10.09.156

17.22 MB

Mar 05, 2021

R162-ZA2

SPECIFICATIONS

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R162-ZA2 (Rev. A00)