E263-S30- AAV1

Edge Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U UP 2 x PCIe Gen5 GPUs Titanium

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Supports up to 2 x Dual slot Gen5 GPUs
Single 5th/4th Gen Intel^® Xeon^® Scalable Processors
Single Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 16 x DIMMs
Dual ROM Architecture
1 x 1Gb/s LAN port via Intel^® I210-AT
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
1 x M.2 slot with PCIe Gen3 x4 interface
2 x FHFL PCIe Gen5 x16 slots for GPUs
2 x OCP 3.0 Gen5 x16 slots
1+1 1600W 80 PLUS Titanium redundant power supplies

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 520

Motherboard

MS33-DC0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor, TDP up to 350W

Socket

1 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel^® Xeon^®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel^® Xeon^® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Rear side:
1 x 1Gb/s LAN port (1 x Intel^® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Rear Side:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1

Expansion Slots

Riser Card CRS201C:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs

Riser Card CRS201D:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs

2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH
- Supports 2280/22110 cards

Internal I/O

1 x TPM header
1 x VROC connector

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 1600W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-240V~/ 12-9.5A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 9.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 131.2A
+12Vsb/ 3A

Note: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 18 kg
Gross Weight: 21 kg

Packaging Dimensions

732 x 588 x 285 mm

Packaging Content

1 x E263-S30-AAV1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x PCIe 8pin, 350mm)
1 x GPU power cable (2x PCIe 8pin, 480mm)
3 x Carriers

Note: Rail kit not included. Please refer to optional parts for compatible rail kit.

Part Numbers

- Barebone package (5th/4th Gen): 6NE263S30DR000ABV1*
- Barebone package (4th Gen): 6NE263S30DR000AAV1*
- Motherboard: 9MS33DC0UR-000
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP2022: 9CBP2022NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201C: 9CRS201CNR-00
- Riser card - CRS201D: 9CRS201DNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (2x PCIe 8pin, 350mm): 25CRI-350305-Y4R
- GPU power cable (2x PCIe 8pin, 480mm): 25CRI-480300-Y4R
- Power supply: 25EP0-21600E-L0S

Optional parts:

- 2-Section Rail kit (385-480mm): 25HB2-3A0204-K0R (MOQ: 500)
- 2-Section Rail kit (660-840mm): 25HB2-3A0203-K0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

RESOURCES

E263-S30-AAV1

E263-S30- AAV1