H273-Z85-AAW1

Rev. 3.x

High Density Server - AMD EPYC™ 9005/9004 - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 3000W

# 高效能運算伺服器 # 超融合伺服器 # 私有雲/混和雲伺服器

2U 4-node rear access server system
Dual AMD EPYC™ 9005/9004 Series Processors per node
12-Channel DDR5 RDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 877

Motherboard

MZ83-HD2

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, cTDP up to 300W
- At ambient 25°C, cTDP up to 400W with optional heatsink and air shroud^[1][2]

^[1]Please refer to the QVL on the support page or contact our sales representatives for verified CPU SKUs.
^[2]The optional heatsink and air shroud are set as defaults in the ACx barebone. Please check the part number or contact our sales representatives to confirm the included components.

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s

LAN

Rear (I/O board - CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_1)
- (SATA from CPU_0)

Optional internal M.2 (CMTP192 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

PCIe Expansion Slots

Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLBH160 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS / BMC / CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,900rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H273-Z85-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit

Part Numbers

- Barebone package (cTDP 400W): 6NH273Z85DR000ACW1*
- Barebone package (EPYC 9005/9004): 6NH273Z85DR000ABW1*
- Barebone package (EPYC 9004): 6NH273Z85DR000AAW1*
- Motherboard: 9MZ83HD2UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320Y-A0R/25ST1-453216-A0R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888022-A0R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- CPU heatsink (400W, 25°C ambient, Front): 25ST1-253212-A0R
- Air shroud (400W, 25°C ambient): 25HA8-H27330-G1R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

H273-Z85-AAW1

SPECIFICATIONS

SUPPORT

RESOURCES

H273-Z85-AAW1 (Rev. 3.x)