High Density Server - AMD EPYC™ 9005/9004 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS 3000W DLC
- Direct liquid cooling solution
- 2U 4-node rear access server system
- Dual AMD EPYC™ 9005/9004 Series Processors per node
- 12-Channel DDR5 RDIMM, 24 x DIMMs per node
- Dual ROM Architecture
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 877
440 x 87.5 x 877
Motherboard
MZ83-HD0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Dual processor per node, cTDP up to 400W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
AMD EPYC™ 9004 Series Processors
Dual processor per node, cTDP up to 400W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
96 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Rear:
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 4
- 4 x Mini-DP
- 4 x Mini-DP
Storage
Front hot-swap:
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
- (SATA from CPU_0)
Optional internal M.2 (CMTP192):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
- (SATA from CPU_0)
Optional internal M.2 (CMTP192):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
PCIe Expansion Slots
Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
- 4 x LP x16 (Gen5 x16), from CPU_0
4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] If the room's relative humidity exceeds 60%, the inlet water temperature must be set between 40°C and 45°C to avoid condensation and ensure the system continues to operate optimally.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] If the room's relative humidity exceeds 60%, the inlet water temperature must be set between 40°C and 45°C to avoid condensation and ensure the system continues to operate optimally.
Weight
Net Weight: 48.9 kg
Gross Weight: 51.2 kg
Gross Weight: 51.2 kg
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H273-Z80-LAW1
4 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
4 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates: 6NH273Z80DR000LCW1*
- Barebone w/o cold plates: 6NH273Z80DZ000LCW1*
- Motherboard: 9MZ83HD0UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- GIGABYTE CPU cold plate loop: 25H27-3Z80000-E06X (QPA:4)
- GIGABYTE 2U4N manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-20000K-M4R (QPA:4)
- CoolIT leak sensor board: 6NH273Z80S1000LAN11 (QPA: 4)
- RMA packaging: 6NH273Z80SR-RMA-L100
- Barebone w/o cold plates: 6NH273Z80DZ000LCW1*
- Motherboard: 9MZ83HD0UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- GIGABYTE CPU cold plate loop: 25H27-3Z80000-E06X (QPA:4)
- GIGABYTE 2U4N manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motivair CPU cold plate loop: 25ST7-20000K-M4R (QPA:4)
- CoolIT leak sensor board: 6NH273Z80S1000LAN11 (QPA: 4)
- RMA packaging: 6NH273Z80SR-RMA-L100
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Chipset driver for AMD EPYC 9005/9004 series processors
Version : 6.10.07.747
2.82 MB
Oct 29, 2024
作業系統: Windows Server 2019,Windows Server 2022
AMD Chipset Windows Server PSHED Plug-in Device Driver
Version : 6.10.04.235
26.5 MB
Oct 29, 2024
作業系統: Windows Server 2019,Windows Server 2022
網路介面
BIOS
說明
版本
檔案大小
日期
Updated support for AMD EPYC™ 9005 series processors.
Version : R01_F28
44.26 MB
Oct 11, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.09
123.77 MB
Sep 05, 2024
英語
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : R1
0.06 MB
Oct 15, 2024
AMD EPYC™ 9005/9004 Series Processors OS Support List
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