H262-ZL2

Rev. 100

High Density Server - AMD EPYC™ 7003 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA DLC

# 高效能運算伺服器 # 超融合伺服器 # 私有雲/混和雲伺服器

Hardware-level root of trust support
Direct liquid cooling solution
2U 4-node rear access server system
AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
8 x LGA 4094 sockets
8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
1 x CMC port
24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
4 x LP PCIe Gen4 x16 slots
4 x OCP 3.0 Gen4 x16 slots
Dual 2200W (240V) 80 PLUS Platinum redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MZ62-HD4 Rev. 3.0

CPU

AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Compatible with AMD EPYC™ 7002 Series processors

Socket

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

Chipset

System on Chip

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

Total:
24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0

Total:
4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

Internal I/O

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE: System power supply requires C19 power cord

System Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage/Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

4 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.

Packaging Dimensions

1180 x 700 x 465 mm

Packaging Content

1 x H262-ZL2
4 x Liquid cooling kits
1 x 3-Section Rail Kit

Part Numbers

- Barebone package: 6NH262ZL2MR-00-1*
- Motherboard: 9MZ62HD4NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- Liquid cooling kit: 25ST7-200001-C4R (CPU, Memory, Mellanox MCX653106A-ECAT)
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH262ZL2SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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驅動程式

BIOS

工具程式

Firmware

QVL

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Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit

晶片組

版本

檔案大小

日期

AMD Chipset Driver
For AMD EPYC 7002/ 7003

Version : 2.10.09.156

17.22 MB

Mar 05, 2021

H262-ZL2

SPECIFICATIONS

SUPPORT

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H262-ZL2 (Rev. 100)