H262-PC2
HCI Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS
- 2U 4-node rear access server system
- 3rd Gen Intel® Xeon® Scalable Processors
- Dual processor per node, 10nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- Supports Intel® Optane™ Persistent Memory 200 series
- Dual ROM Architecture
- Intel® C621A Chipset
- 4 x Dedicated management ports
- 1 x CMC port
- 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 3.0 Gen4 x16 slots
- Dual 2200W 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MH62-HD2
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W
Please leave one PCIe slot empty if using processor with 270W TDP
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Dual processor per node, 10nm technology
CPU TDP up to 270W
Please leave one PCIe slot empty if using processor with 270W TDP
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS add-on card
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Total:
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Total:
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x COM header
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
AMI MegaRAC SP-X Solution Web interface
AMI MegaRAC SP-X Solution Web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C*
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 27.2 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-PC2
8 x CPU heatsinks
1 x 3-Section Rail kit
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262PC2MR-00-1*
- Motherboard: 9MH62HD2NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320U-M1R/25ST1-44320V-M1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- LAN board - CLBH020: 9CLBH020NR-00
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262PC2SR-RMA-A100
- Motherboard: 9MH62HD2NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320U-M1R/25ST1-44320V-M1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- LAN board - CLBH020: 9CLBH020NR-00
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262PC2SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
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SATA RAID/AHCI
SATA RAID/AHCI
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Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.5.0.1991
4.17 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.5.0.1991
23.93 MB
Sep 08, 2021
作業系統: Windows Server 2016 64bit,Windows Server 2019
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.7.0.1273
7.07 MB
Apr 25, 2022
作業系統: Windows Server 2022
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.7.0.1273
23.58 MB
Apr 25, 2022
作業系統: Windows Server 2022
BIOS
說明
版本
檔案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.09
123.77 MB
Sep 05, 2024
英語
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
說明
版本
檔案大小
日期
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