H262-P61
High Density Arm Server - Ampere® Altra® Max - 2U 4-Node 8-Bay SATA
- 2U-4 node rear access server system
- Hardware-level root of trust support
- Ampere® Altra® Max or Altra® Processors
- Dual processor, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 x CMC port
- 8 x 2.5" SATA hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 3.0 Gen4 x16 slots
- Dual 2200W (240V) 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MP62-HD0
CPU
Ampere® Altra® Max or Altra® Processor
Dual processor, 7nm technology
Up to 128-core per processor, TDP up to 250W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Dual processor, 7nm technology
Up to 128-core per processor, TDP up to 250W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4926
Total:
8 x LGA 4926
2 x LGA 4926
Total:
8 x LGA 4926
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 256GB supported
LRDIMM modules up to 256GB supported
Up to 4TB of memory capacity supported per processor
Memory speed: Up to 3200 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 256GB supported
LRDIMM modules up to 256GB supported
Up to 4TB of memory capacity supported per processor
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" SATA hot-swappable bays
Total:
8 x 2.5" SATA hot-swappable bays
2 x 2.5" SATA hot-swappable bays
Total:
8 x 2.5" SATA hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
NOTE: Gen4 x16 available for Ampere Altra Max processors only
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
NOTE: Gen4 x16 available for Ampere Altra Max processors only
Internal I/O
Per node:
1 x M.2 slot
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x M.2 slot
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*Only one CMC status LED per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN
Total:
8 x USB 3.2 Gen1
4 x Mini DP
8 x RJ45
4 x RJ45 MLAN
*1 x CMC port
*Only one CMC port per system
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN
Total:
8 x USB 3.2 Gen1
4 x Mini DP
8 x RJ45
4 x RJ45 MLAN
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Red Hat Enterprise Linux 8.3 (aarch64) or later
Red Hat Enterprise Linux 8.5 (aarch64) or later
SUSE Linux Enterprise Server 15 SP2 (aarch64) or later
SUSE Linux Enterprise Server 15 SP3 (aarch64) or later
Ubuntu 18.04.5 LTS (aarch64) or later
Ubuntu 20.04.1 LTS (aarch64) or later
Fedora Server 33-1.2 (aarch64) or later
Fedora Server 35-1.2 (aarch64) or later
OracleLinux R8 U2
OracleLinux R8 U5
Debian 10.9 (Buster)
Debian 11.1
Red Hat Enterprise Linux 8.5 (aarch64) or later
SUSE Linux Enterprise Server 15 SP2 (aarch64) or later
SUSE Linux Enterprise Server 15 SP3 (aarch64) or later
Ubuntu 18.04.5 LTS (aarch64) or later
Ubuntu 20.04.1 LTS (aarch64) or later
Fedora Server 33-1.2 (aarch64) or later
Fedora Server 35-1.2 (aarch64) or later
OracleLinux R8 U2
OracleLinux R8 U5
Debian 10.9 (Buster)
Debian 11.1
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-P61
8 x CPU heatsinks
1 x 3-Section Rail Kit
8 x CPU heatsinks
1 x 3-Section Rail Kit
Part Numbers
- Barebone package: 6NH262P61MR-00-1*
- Motherboard: 9MP62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-45320B-A3R/25ST1-45320C-C1R
- Backplane board - CBPH080: 9CBPH080NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Motherboard: 9MP62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-45320B-A3R/25ST1-45320C-C1R
- Backplane board - CBPH080: 9CBPH080NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
BIOS
工具程式
Firmware
QVL
BIOS
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Ubuntu Server for ARM 22.04.1 LTS
(Including installation guide)
Ubuntu Server for ARM 22.04.1 LTS
(Including installation guide)
Version : 2.5
226.76 MB
Oct 14, 2022
作業系統: Ubuntu
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說明
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日期
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.10
123.4 MB
Dec 18, 2024
英語
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
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User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
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