H262-NO1

Rev. 100

High Density Server - 3rd Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS

# 超融合伺服器 # 私有雲/混和雲伺服器

2U 4-node rear access server system
Dual 3rd Gen Intel^® Xeon^® Scalable Processors per node
8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
1 x CMC port
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x LP PCIe Gen4 x16 slots
4 x OCP 3.0 Gen4 x16 slots
Dual 2200W 80 PLUS Platinum redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MH62-HD2

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Chipset

Intel^® C621A

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
1 x CMC port

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x VGA ports

Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1/5/10

Expansion Slots

Per node:
Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth

Total:
Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs

*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP.

Weight

Net Weight: 27.8 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-NO1
8 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH262NO1MR-00-1*
- Motherboard: 9MH62HD2NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320S-M1R/25ST1-44320T-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP160: 9CMTP160NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO1SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

H262-NO1

SPECIFICATIONS

SUPPORT

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H262-NO1 (Rev. 100)