H252-Z12
HCI Server - AMD EPYC™ 7003 - 2U 4-Node UP 12-Bay SATA
- 2U 4-node rear access server system
- AMD EPYC™ 7003 Series processors
- AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
- Single processor per node, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 x CMC port
- 12 x 3.5" SATA hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x LP PCIe Gen3 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Aspeed® AST2500 remote management controller
- Dual 1600W (240V) 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
440 x 87.5 x 695
Motherboard
MZ12-HD8 Rev. 3.0
CPU
AMD EPYC™ 7003 Series processors
AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
Single processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
Compatible with AMD EPYC™ 7002 Series processors
AMD EPYC™ 7003 Series processors with AMD 3D V-Cache™ Technology
Single processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
Compatible with AMD EPYC™ 7002 Series processors
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
NCSI function supported
4 x Dedicated management ports
1 x CMC port
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
NCSI function supported
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
3 x 3.5" SATA hot-swappable bays
Total:
12 x 3.5" SATA hot-swappable bays
3 x 3.5" SATA hot-swappable bays
Total:
12 x 3.5" SATA hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slot
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
2 x M.2 slots
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slot
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
1 x CMC status LED
1 x CMC Reset button
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
1 x CMC status LED
1 x CMC Reset button
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Platinum redundant power supply
AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz
DC Input:
- 240Vdc/ 10A
DC Output: - Max 1000W/ 100-120V~ + 12V/ 81.5A + 12Vsb/ 2.5A - Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A + 12Vsb/ 2.5A
- 240Vdc/ 10A
DC Output: - Max 1000W/ 100-120V~ + 12V/ 81.5A + 12Vsb/ 2.5A - Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A + 12Vsb/ 2.5A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 23.6 kg
Gross Weight: 37.45 kg
Gross Weight: 37.45 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z12
4 x CPU heatsinks
1 x 3-Section Rail kit
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z12MR-00-A02
- Motherboard: 9MZ12HD8NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0C3: 9CBPH0C3NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-216008-L0S
Optional parts:
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH23NR48SR-00
- RMA packaging: 6NH252Z12SR-RMA-A100
- Motherboard: 9MZ12HD8NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0C3: 9CBPH0C3NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-216008-L0S
Optional parts:
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH23NR48SR-00
- RMA packaging: 6NH252Z12SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
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日期
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M19_R33
35.33 MB
Oct 11, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M18_R32
35.32 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
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檔案大小
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BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
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