H252-3C0

Rev. 100

HCI Server - 3rd Gen Intel^® Xeon^® Scalable - 2U 4-Node UP 12-Bay SATA/SAS

# 超融合伺服器 # 私有雲/混和雲伺服器

2U 4-node rear access server system
3rd Gen Intel^® Xeon^® Scalable Processors
Single processor per node, 10nm technology
8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
Intel^® C621A Chipset
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
1 x CMC port
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
8 x LP PCIe Gen4 x16 slots
4 x OCP 2.0 Gen3 x8 mezzanine slots
Dual 1600W 80 PLUS Platinum redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 695

Motherboard

MH12-HD0

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Single processor per node, 10nm technology
CPU TDP up to 270W

Socket

Per Node:
1 x LGA 4189

Total:
4 x LGA 4189

Socket P+

Chipset

Intel^® C621A Chipset

Memory

Per node:
8 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
3 x 3.5"/2.5" SATA/SAS hot-swappable bays

Total:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel^® SATA RAID 0/1/5

Expansion Slots

Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)

Internal I/O

Per node:
1 x USB 3.0 header
1 x SATA DOM
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID button with LED
4 x Status LED
4 x Reset buttons
1 x CMC status LED
1 x CMC Reset button

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Backplane Board

Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10.0A, 50-60Hz

DC Input:
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+ 12V/ 81.5A
+ 12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A
+ 12Vsb/ 2.5A

System Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

4 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 22.2 kg
Gross Weight: 37.22 kg

Packaging Dimensions

1167 x 700 x 309 mm

Packaging Content

1 x H252-3C0
4 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH2523C0MR-00-1*
- Motherboard: 9MH12HD0NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453213-M1R
- Backplane board - CBPH0C3: 9CBPH0C3NR-00
- Fan module: 25ST2-883828-D0R
- CMC Lan card - CLBH020: 9CLBH020NR-00
- Riser card - CRSH01D: 9CRSH01DNR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Power Supply: 25EP0-216008-L0S

Optional parts:

- Ring topology kit: 6NH23NR48SR-00
- RMA packaging: 6NH2523C0SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

H252-3C0

SPECIFICATIONS

SUPPORT

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H252-3C0 (Rev. 100)