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G593-SD0- LAX1
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP NVIDIA HGX™ H100 8-GPU 4-Root Port DLC
- Liquid-cooled NVIDIA HGX™ H100 8-GPU
- CPU+GPU direct liquid cooling solution
- 900GB/s GPU-to-GPU bandwidth with NVIDIA® NVLink® and NVSwitch™
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA® BlueField®-2 DPUs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 12 x LP PCIe Gen5 x16 slots
- 1 x LP PCIe Gen4 x16 slot
- 4+2 3000W 80 PLUS Titanium redundant power supplies
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
5U
447 x 219.7 x 945
447 x 219.7 x 945
Motherboard
MSB3-G40
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
LAN
Front (I/O board - CDCG120):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89104)
[1] SAS card is required to support SAS drives.
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89104)
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Support optional RAID add-in cards
Support optional RAID add-in cards
Modular GPU
Liquid-cooled NVIDIA HGX™ H100 with 8 x SXM5 GPUs
PCIe Expansion Slots
Extension Board CPBG044 x 2:
- 8 x LP x16 (Gen5 x16), from PEX89104
PCIe Cable x 5:
- 2 x LP x16 (Gen5 x16), from CPU_0
- 2 x LP x16 (Gen5 x16), from CPU_1
- 1 x LP x16 (Gen4 x16), from CPU_0
- 8 x LP x16 (Gen5 x16), from PEX89104
PCIe Cable x 5:
- 2 x LP x16 (Gen5 x16), from CPU_0
- 2 x LP x16 (Gen5 x16), from CPU_1
- 1 x LP x16 (Gen4 x16), from CPU_0
Front I/O
I/O board - CDCG120:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Red Hat Enterprise Linux 8.6 or later
Windows Server 2022
Additional certifications:
Red Hat Enterprise Linux 8.6 or later
Windows Server 2022
System Fans
Motherboard:
2 x 40x40x28mm (25,000rpm)
3 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
4 x 80x80x80mm (17,000rpm)
2 x 40x40x28mm (25,000rpm)
3 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
3 x 40x40x56mm (29,700rpm)
GPU tray:
4 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Weight
Net Weight: 73.3 kg
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-SD0-LAX1
6 x Carriers
1 x L-shape Rail kit
6 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module (5/4th Gen): 6NG593SD0DR000LBX1*
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000LAX1*
- Motherboard: 9MSB3G40NR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: 25ST7-100009-C4R
- CoolIT GPU cold plate loop: 25ST7-3000G5-C4R
- CoolIT Switch cold plate loop: 25ST7-3000Z6-C4R
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- I/O board - CDCG120: 9CDCG120UR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG900: 9CPBG900NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-23000J-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- Barebone w/ NVIDIA module (4th Gen): 6NG593SD0DR000LAX1*
- Motherboard: 9MSB3G40NR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: 25ST7-100009-C4R
- CoolIT GPU cold plate loop: 25ST7-3000G5-C4R
- CoolIT Switch cold plate loop: 25ST7-3000Z6-C4R
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- I/O board - CDCG120: 9CDCG120UR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG900: 9CPBG900NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-23000J-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
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- Windows Server 2022
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晶片組
晶片組
版本
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Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver
Version : 28.2.1
776.69 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
RAID
RAID
版本
檔案大小
日期
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
公用程式
BIOS
說明
版本
檔案大小
日期
Include AMI SA50248 (CWE-119), and multiple feature updates.
Version : R12
29.56 MB
May 15, 2024
Include INTEL-TA-01036 (CVE-2023-45745/CVE-2023-47855); AMI SA50232 (CVE-2023-45236/CVE-2023-45237), and multiple feature updates.
Version : R09
29.63 MB
Apr 12, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
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工具程式
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GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
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