G242-Z10

HPC/AI Server - AMD EPYC™ 7003/7002 - 2U UP 4 x PCIe Gen3 GPUs
  • Supports up to 4 x Dual slot Gen3 GPUs
  • NVIDIA® NGC™ Ready server
  • Single AMD EPYC™ 7003/7002 Series Processors
  • 8-Channel DDR4 RDIMM/LRDIMM, 8 x DIMMs
  • 2 x 1Gb/s LAN ports via Intel® I350-AM2
  • 4 x 3.5"/2.5" SATA hot-swappable bays
  • 2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays on the rear side
  • 1 x M.2 slot with PCIe Gen3 x4 interface
  • 4 x FHFL PCIe Gen3 x16 slots for GPUs
  • 2 x FHHL PCIe Gen3 x16 and x8 slots
  • 1 x OCP 2.0 Gen3 x16 mezzanine slot
  • Dual 1600W 80 PLUS Platinum redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
438 x 87.5 x 820
Motherboard
MZ12-HD1 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Single processor, 7nm technology
Up to 64 cores, 128 threads
cTDP up to 280W
Socket
1 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
8 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
LAN
Rear side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
- 1 x VGA port
Storage
Front side:
4 x 3.5"/2.5" SATA hot-swappable bays

SATA devices supported only

Rear side:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
N/A
Expansion Slots
4 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs

Riser Card CRSG027:
- 1 x PCIe x16 (Gen3 x16 or x8) FHHL slot
- 1 x PCIe x8 (Gen3 x0 or x8) FHHL slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4)
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 180W if using M.2 device

- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
Internal I/O
1 x TPM header
Front I/O
1 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Backplane Board
Speed and bandwidth:
Front side - CBPG041: SATA 6Gb/s
Rear side - CBP2021: PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A
System Management
Aspeed® AST2500 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage/Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
5 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note: Please contact Technical Support for more information about optimized GPU operating temperature.
Weight
Net Weight: 18.8 kg
Packaging Dimensions
1077 x 679 x 300 mm
Packaging Content
1 x G242-Z10
1 x CPU heatsink
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NG242Z10MR-00-A*
- Motherboard: 9MZ12HD1NR-00
- 2-Section Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-15320E-J1R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBPG041: 9CBPG041NR-00
- Backplane board - CBP2021: 9CBP2021NR-00
- Fan module: 25ST2-88382A-D0R
- Power supply: 25EP0-216007-L0S

Optional parts:

- RMA packaging: 6NG242Z10SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 64bit
網路介面
BIOS
說明
版本
檔案大小
日期
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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