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Intel® H310 Chipset
- Supports 9th and 8th Generation Intel® Core™ Processors up to 65W
- Dual Channel DDR4 SO-DIMM, 2 DIMMs
- 2 x RS232/422/485, 2 x RS232, Digital I/O 4-in/4-out
- M.2 Socket 1 for PCIe WIFI co-lay with CNVI Hybird E key WIFI
- M.2 Socket 2260/80 Storage support PCIe/SATA Mode
- Mini-PCIe Slot Full size Support mSATA/PCIe mode
- VGA Header for legacy Monitor
- LVDS Header for System Integrated Flat Panel Display Support
- Rear Panel DisplayPort, HDMI 2.0 Ports & D-sub Header for Multi-Display Connection
- Amplified Speaker Header Able to Drive Up to 3W System Integrated Speaker
- Dual Intel® GbE LAN for WOL and PXE Support
- 4 USB 3.0 and 4 USB 2.0 Ports, USB 3.0 support OTG function
- OP 0~60 degree
- Thin Mini-ITX 170x170mm Form Factor with 12/19~24V DC-In Power Design
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Intel® H110 Chipset
- 支援第7代 / 第6代 Intel® Core™處理器
- 內建 2 組DDR4 SO-DIMM插槽，支援雙通道技術
- 2 組RS232/422/485 及 2 組RS232插座，支援4進/4出之數位I/O控制
- 1 組Mini-PCIe接口支援完整/半高之無線網卡
- 1 組雙模式Mini-PCIe 接口支援mSATA SSD 固態硬碟
- LVDS插座支援整機系統之內建平面顯示器
- 後窗DisplayPort, HDMI 1.4 連接埠和 D-sub插座支援多重顯示連接
- 內建音效接口支援3瓦系統揚聲器驅動
- 雙Intel® 網路接口支援WOL及PXE功能
- 搭載 4 USB 3.0和 4 USB 2.0 連接埠
- 技嘉 UEFI DualBIOS™ 技術
- Thin Mini-ITX 170x170mm 規格並搭載12/19~24V DC-In 電源供電設計
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