E162-220

Rev. 100

Edge Server - 3rd Gen Intel^® Xeon^® Scalable - 1U UP 1 x PCIe Gen4 GPU

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NVIDIA-Certified Systems™ - Data Center Servers
NVIDIA-Certified Systems™ - High-Density VDI Servers
NVIDIA-Certified Systems™ - Edge Systems
Supports up to 1 x Dual slot Gen4 GPU
Single 3rd Gen Intel^® Xeon^® Scalable Processors
8-Channel DDR4 RDIMM/LRDIMM, 16 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
2 x M.2 slots with PCIe Gen4 x4 interface
1 x M.2 slot with PCIe Gen3 x4 interface
1 x FHFL PCIe Gen4 x16 slot for GPUs
2 x LP PCIe Gen4 x16 slots
1 x OCP 3.0 Gen4 x16 slot
Dual 800W 80 PLUS Platinum hot-swap redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 500

Motherboard

ME62-GE0

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Single processor, 10nm technology
TDP up to 270W

Socket

1 x LGA 4189
Socket P+

Chipset

Intel^® C621A

Memory

16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s

LAN

Front side:
1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front side:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1

Expansion Slots

1 x PCIe x16 (Gen4 x16) FHFL slot, for GPUs
2 x PCIe x16 (Gen4 x16) low-profile slots

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth

2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU
- Supports 2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH
- Supports 2280/22110 cards

Internal I/O

2 x SATA ports
1 x TPM header

Front I/O

2 x USB 3.0
1 x Mini-DP
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 800W 80 PLUS Platinum hot-swap redundant power supply

AC Input:
- 100-240V~/ 10-5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 4A

DC Output:
- Max 800W
+12V/ 65A
+12Vsb/ 2.1A

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage/Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced Power Capping
LDAP/AD/RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

System Fans

6 x 40x40x56mm (29,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 9.4 kg

Packaging Dimensions

786 x 588 x 250 mm

Packaging Content

1 x E162-220
1 x CPU heatsink
1 x GPU power cable (CPU 8pin, 400mm)

*Rail kit not included. Please refer to optional parts for compatible rail kit.

Part Numbers

- Barebone package: 6NE162220MR-00-1*
- Motherboard: 9ME62GE0NR-00
- CPU heatsink: 25ST1-453213-M1R
- Backplane board - CBPE020: 9CBPE020NR-00
- Fan module: 25ST2-405628-S1R
- Riser card - CRSE010: 9CRSE010NR-00
- Riser card - CRSE011: 9CRSE011NR-00
- Riser card - CRSE012: 9CRSE012NR-00
- GPU power cable (CPU 8pin, 400mm): 25CRI-400100-Y4R
- Power supply: 25EP0-208007-F3S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2-Section Rail kit (385-480mm): 25HB2-3A0204-K0R (MOQ: 500)
- 2-Section Rail kit (660-840mm): 25HB2-3A0203-K0R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NE162220SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

E162-220

SPECIFICATIONS

SUPPORT

RESOURCES

E162-220 (Rev. 100)