TO25-S11-AA01

ORv3 Compute Node - 5th/4th Gen Intel^® Xeon^® Scalable - 2OU 2-Node UP 10-Bay E1.S Gen4 NVMe

Single 5th/4th Gen Intel^® Xeon^® Scalable Processors
Single Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 8 x DIMMs
Dual ROM Architecture
10 x E1.S Gen4 NVMe hot-swap bays
1 x M.2 slot with SATA interface
2 x FHHL PCIe Gen5 x16 slots
1 x LP PCIe Gen5 x8 slot
48V DC Bus Bar power solution

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2OU 2-Node
262.7 x 90 x 740

Open Rack Version

ORv3

Motherboard

MS13-HD0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Single processor, TDP up to 350W

Memory

8 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s

LAN

Front:
1 x 10/100/1000 Mbps Management LAN

Storage

Front hot-swap:
10 x 9.5mm E1.S Gen4 NVMe

Internal M.2 (CFPH010):
1 x M.2 (2242/2260/2280/22110), SATA, from PCH

SAS

N/A

RAID

N/A

PCIe Expansion Slots

Riser Card CRSH02D:
- 2 x FHHL x16 (Gen5 x16)

Riser Card CRSH02E:
- 1 x LP x16 (Gen5 x16), occupied for E1.S
- 1 x LP x16 (Gen5 x8)

Front I/O

1 x MLAN
1 x ID button with LED

I/O board - CFPH010:
1 x USB 3.2 Gen1 port (Type-C)
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Supports up to 1600W

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022

System Fans

N/A

Packaging Dimensions

N/A

Packaging Content

1 x TO25-S11-AA01
1 x CPU heatsink
3 x Carriers

Part Numbers

- Barebone package (5th/4th Gen): 6NTO25S11DR000AB01*
- Barebone package (4th Gen): 6NTO25S11DR000AA01*
- Motherboard: 9MS13HD0UR-000*
- CPU heatsink: 25ST1-143102-C1R
- Front panel board - COFP111: 9COFP111NR-00*
- Re-driver card - CORC211: 9CORC211NR-00*
- Riser card - CRSH02D: 9CRSH02DNR-00*
- Riser card - CRSH02E: 9CRSH02ENR-00*
- EDSFF base board - COBP721: 9COBP721NR-00*
- EDSFF base board - COBP740: 9COBP740NR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00*

Optional parts:

- RMA packaging: 6NTO25S11SR-RMA-A100

No. of Bus Bars

1 x 48V Bus Bar

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

TO25-S11-AA01

SPECIFICATIONS

SUPPORT

RESOURCES

TO25-S11-AA01