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- High Density Servers
- H252-Z10
- 2U 4-node rear access server system
- Single AMD EPYC™ 7002/7001 Series Processors per node
- 8-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 1 x CMC port
- 24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x LP PCIe Gen3 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Dual 2000W 80 PLUS Platinum redundant power supply
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
440 x 87.5 x 695
Motherboard
MZ12-HD0
CPU
AMD EPYC™ 7002 Series Processors
AMD EPYC™ 7001 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
AMD EPYC™ 7001 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200 MT/s
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
SAS
Depends on SAS add-in cards
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2000W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
System Management
Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.1.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP4 or later
SUSE Linux Enterprise Server 15 SP1 or later
Ubuntu 16.04.6 LTS or later
Ubuntu 18.04.3 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP4 or later
SUSE Linux Enterprise Server 15 SP1 or later
Ubuntu 16.04.6 LTS or later
Ubuntu 18.04.3 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25.2 kg
Gross Weight: 43.6 kg
Gross Weight: 43.6 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z10MR-00-1*
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SUPPORT
Driver
BIOS
Tiện ích
Firmware
QVL
- All
- All
- Windows Server 2019
- Windows Server 2016 64bit
Chipset
Chipset
Phiên bản
Kích cở
Ngày
AMD Chipset Driver
For AMD EPYC 7001/ 7002
For AMD EPYC 7001/ 7002
Version : 1.07.12.1102
17.05 MB
Aug 06, 2019
OS: Windows Server 2016 64bit,Windows Server 2019
LAN
LAN
Phiên bản
Kích cở
Ngày
Intel® LAN Driver and Utility
Version : 24.0
542.58 MB
Aug 06, 2019
OS: Windows Server 2016 64bit,Windows Server 2019
VGA
VGA
Phiên bản
Kích cở
Ngày
ASPEED Graphic Driver
Version : 1.06
1.78 MB
Aug 06, 2019
OS: Windows Server 2016 64bit,Windows Server 2019
BIOS
Mô tả
Phiên bản
Kích cở
Ngày
1. Added Redfish - System Inventory
2. Fixed non-persistent boot issue
3. Added Setup Flash
4. Updated SMBIOS Type130/131
2. Fixed non-persistent boot issue
3. Added Setup Flash
4. Updated SMBIOS Type130/131
Version : R20_F01
27.47 MB
Jul 23, 2021
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Cảnh báo:
Do việc flash BIOS chứa đựng rủi ro, nếu bạn không gặp vấn dề với BIOS cũ, bạn không nên flash BIOS. Để flash BIOS, hãy cẩn thận. Quá trình flash BIOS có thể dẫn đến trục trặc hệ thống.
Thế nào là BETA?
BETA là mô tả phiên bản mới đáng tin cậy, nhưng vẫn chưa đầy đủ các tính năng cuối cùng. Trong giai đoạn này chúng tôi xem trước các tính năng mới và thu thập ý kiến của khác hàng để đảm bảo sàn phẩm của chúng tôi, cung cấp những kinh nghiệm tốt nhất có thể.
Do việc flash BIOS chứa đựng rủi ro, nếu bạn không gặp vấn dề với BIOS cũ, bạn không nên flash BIOS. Để flash BIOS, hãy cẩn thận. Quá trình flash BIOS có thể dẫn đến trục trặc hệ thống.
Thế nào là BETA?
BETA là mô tả phiên bản mới đáng tin cậy, nhưng vẫn chưa đầy đủ các tính năng cuối cùng. Trong giai đoạn này chúng tôi xem trước các tính năng mới và thu thập ý kiến của khác hàng để đảm bảo sàn phẩm của chúng tôi, cung cấp những kinh nghiệm tốt nhất có thể.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Tiện ích
Mô tả
Phiên bản
Kích cở
Ngày
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Mô tả
Phiên bản
Kích cở
Ngày
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
Tiếng Anh
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
Tiếng Anh
Hướng dẫn
Mô tả
Phiên bản
Kích cở
Ngày
User Guide - GIGABYTE Management Console (AMI)
Version : 1.0
14.16 MB
Jun 10, 2020
Tiếng Anh
Mô tả
Phiên bản
Kích cở
Ngày
RESOURCES
Success Case
Articles
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By using GIGABYTE, Spain’s Institute for Cross-Disciplinary Physics and Complex Systems is pitting the world’s foremost server solutions against some of the world’s most pressing issues, including the effects of climate change, pollution, and COVID-19. GIGABYTE servers are up to the diverse and daunting tasks, because they are designed for high performance computing, intensive numerical simulations, AI development, and big data management.
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How to Pick a Cooling Solution for Your Servers? A Tech Guide by GIGABYTE
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Tech Guide | October 27, 2022
Data Center Cooling: The Key to Green Computing and a Low-Carbon Transition
Tech Guide | May 31, 2022
What is Private Cloud, and is it Right for You?
In the era of cloud computing, just about everyone has heard of the terms “private cloud” and “public cloud”. Chances are, you are using one or both of them in your everyday life—but how much do you really know about them? If you had the chance, could you build a private cloud for yourself or your organization? GIGABYTE Technology, an industry leader in server solutions used by global cloud service providers, is pleased to present our latest Tech Guide. We will examine the difference between private and public clouds, introduce the private cloud’s advantages and limitations, and then introduce GIGABYTE products that may help you build and operate a private cloud of your own.
Tech Guide | March 16, 2022
What is Big Data, and How Can You Benefit from It?
You may be familiar with the term, “big data”, but how firm is your grasp of the concept? Have you heard of the “5 V’s” of big data? Can you recite the “Three Fundamental Steps” of how to use big data? Most importantly, do you know how to reap the benefits through the use of the right tools? GIGABYTE Technology, an industry leader in high-performance server solutions, is pleased to present our latest Tech Guide. We will walk you through the basics of big data, explain why it boasts unlimited potential, and finally delve into the GIGABYTE products that will help you ride high on the most exciting wave to sweep over the IT sector.
Tech Guide | February 11, 2022
The Advantages of ARM: From Smartphones to Supercomputers and Beyond
Processors based on the ARM architecture, an alternative to the mainstream x86 architecture, is gradually making the leap from mobile devices to servers and data centers. In this Tech Guide, GIGABYTE Technology, an industry leader in high-performance server solutions, recounts how ARM was developed. We also explain the various benefits of ARM processors and recommend ARM servers for different sectors and applications.
Tech Guide | January 11, 2022
Cluster Computing: An Advanced Form of Distributed Computing
Cluster computing is a form of distributed computing that is similar to parallel or grid computing, but categorized in a class of its own because of its many advantages, such as high availability, load balancing, and HPC. GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you learn about cluster computing. We also recommend GIGABYTE servers that can help you benefit from cluster computing.
Tech Guide | January 10, 2022
Phân tích khái niệm: HPC là gì? Hướng dẫn kỹ thuật của GIGABYTE
Thuật ngữ HPC, viết tắt của máy tính hiệu suất cao, được sử dụng rất nhiều ngày nay, khi các giải pháp máy chủ ngày càng trở nên phổ biến hơn. Nó đang dần trở thành một cụm từ thông dụng: bất cứ thứ gì là “HPC” đều phải là lựa chọn phù hợp cho nhu cầu máy tính của bạn. Bạn có thể tự hỏi: chính xác thì lợi ích của HPC là gì và HPC có phù hợp với bạn không? GIGABYTE Technology, công ty hàng đầu trong ngành về máy chủ hiệu suất cao, trình bày hướng dẫn công nghệ này để giúp bạn hiểu ý nghĩa của HPC trên cả cấp độ lý thuyết và thực tế. Khi làm như vậy, chúng tôi hy vọng sẽ giúp bạn đánh giá xem HPC có phù hợp với bạn hay không, đồng thời chứng minh những gì GIGABYTE cung cấp trong lĩnh vực HPC.
Video
Video | July 28, 2021
Heroes Ascension
Over the past year or so, due to global warming and climate changes, all parts of the world have witnessed extreme weather events that are more severe than ...
Video | March 25, 2021
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News
News | January 05, 2022
GIGABYTE xây dựng nền tảng mới “INDUSTRY” để cập nhật các sản phẩm Máy chủ và công nghệ tiên tiến nhất
News | May 31, 2021
GIGABYTE is “Building Global Technology Ecosystems” with Its Partners at COMPUTEX 2021
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