H282-ZC1

Rev. A00

HCI Server - AMD EPYC™ 7003 - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA

Hardware-level root of trust support
2U 4-node front access server system
AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
8-Channel RDIMM/LRDIMM DDR4 per processor, 128 x DIMMs
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
2 x CMC ports
8 x 2.5" Gen4 NVMe/SATA hot-swappable bays
8 x M.2 slots with PCIe Gen4 x4 interface
4 x LP PCIe Gen4 x16 slots
4 x OCP 3.0 Gen4 x16 slots
Dual 3200W (240V) 80 PLUS Platinum redundant power supply

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* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
447 x 86.8 x 902

Motherboard

MZC2-LM0 Rev. 1.0

CPU

AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
CPU 200W fully supported at ambient 35°C

CPU 240W with conditional support at ambient 35°C, either PCIe slot or OCP 3.0 available per Node

CPU 280W with conditional support at ambient 25°C, either PCIe slot or OCP 3.0 available per Node

NOTE: If only one CPU is installed, some PCIe or memory functions might be unavailable

Compatible with AMD EPYC™ 7002 Series processors

Socket

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

Chipset

System on Chip

Memory

Per node:
32 x DIMM slots

Total:
128 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200*/2933 MHz

Note: Follow BIOS setting and memory QVL list if running 3200 Mhz with 2DPC

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0

Total:
8 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

Total:
4 x PCIe x16 (Gen4 x16) low-profile slots on front side, from CPU_0

4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2260/2280 cards
- CPU TDP is limited to 240W if using M.2 device

Internal I/O

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN

Rear I/O

2 x CMC ports

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 3200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 50-60Hz
- 200-208V~/ 16A, 50-60Hz
- 214-234V~/ 16A, 50-60Hz
- 220-240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1100W/ 100-127V~
- Max 2434W/ 200-208V~
- Max 2828W/ 214-234V~
- Max 3234W/ 240V~

NOTE: The system power supply requires C19 power cord

System Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage/Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 34.5 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H282-ZC1
8 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH282ZC1MR-00-A*
- Motherboard: 9MZC2LM0NR-00
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-423203-A0R/25ST1-44320J-A0R
- Backplane board - CBPH022: 9CBPH022NR-00
- Fan module: 25ST2-88382H-D0R/25ST2-88382I-D0R
- NVMe PCIe Card - CNV3152: 9CNV3152NR-00
- Power Supply: 25EP0-232001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH282ZC1SR-RMA-A100

SUPPORT

Downloads

Драйвер
BIOS
Utility
Firmware

Инструкции
Support List

Online Support

Драйвер

BIOS

Utility

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit

Chipset

Версия

Размер

Дата

AMD Chipset Driver
For AMD EPYC 7002/ 7003

Version : 2.10.09.156

17.22 MB

Mar 05, 2021

H282-ZC1

SPECIFICATIONS

SUPPORT

RESOURCES

H282-ZC1 (Rev. A00)