Z590 AORUS XTREME (rev. 1.0)
Intel® Z590 Chipset
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
KEY FEATURE
Overview
Performance
Thermal
Connectivity
1
DualBIOS with Q-Flash Plus
2
Intel® WiFi 6E 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
3
Intel® 2.5GbE LAN
4
AQUANTIA® 10GbE BASE-T LAN
5
Intel® Thunderbolt 4
6
Thermal Reactive Armor
7
3* M.2 Connectors
8
AMP-UP Audio with ESS
9
20+1 Phase True Power Design
10
MultiKey
11
Smart Fan 6
12
Supports 11th Gen. Intel® Core™ Processors
13
Solid Pin Power Connectors
14
RGB FUSION 2.0
15
Front USB 3.2 Gen2X2 Type-C®
16
ESSential USB DAC
17
AORUS PRO Gen4 AIC Adaptor
1
DualBIOS with Q-Flash Plus
2
20+1 Phase True Power Design
- 100A DrMOS
- 8-Layer PCB
- PCIe 4.0 Ready Low Loss PCB
- 2X Copper PCB
3
Supports 11th Gen. Intel® Core™ Processors
- Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
4
Full PCI Express 4.0 Design
- 1*PCIe 4.0 x16 / 2*PCIe 4.0 x8
- 1*PCIe 4.0 x4 M.2
5
MultiKey
- Multiple function set by BIOS
- Reset/RGB Switch/Direct to BIOS/Safe Mode
6
Solid Pin Power Connectors
- 24 Pin ATX Power Connector
- 8+8 Pin CPU Power Connector
1
Thermal Reactive Armor
- Fins-Array II with NanoCarbon Coating
- Direct–Touch Heatpipe II
- 7.5 W/mK LAIRD Thermal Conductivity Pad
- Aluminum Cover
2
NanoCarbon Baseplate
3
3X Enlarged M.2 Thermal Guard II
4
Right-Angled Connectors
5
Smart Fan 6
- 10 PWM/DC Fan Headers
- Dual Fan Curve Mode
1
Intel® WiFi 6E 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
2
Intel® 2.5GbE LAN
3
AQUANTIA® 10GbE BASE-T LAN
4
Intel® Thunderbolt 4
5
AMP-UP Audio with ESS
- ALC 1220-VB Audio Codec
- ESS 9018K2M SABRE DAC
- TI Burr-Brown™ OPA
- Auto Impedance Sensing
- Audiophile Grade Capacitors
- Anti-pop Relay
- Gold Plated Audio Jacks
- Front Audio with ESS 9218 DAC
6
RGB FUSION 2.0
- Addressable LED Header*2
- RGB LED Header*2
7
Front USB 3.2 Gen2X2 Type-C®
8
3* M.2 Connectors
- 1*PCIe 4.0 x4 NVME
- 2*PCIe 3.0 x4 NVME
9
6* SATA 6Gb/s
TRUE POWER DESIGN
XTREME MEMORY
PCIe 4.0 DESIGN
AORUS PRO Gen4 AIC Adaptor
UNPARALLELED PERFORMANCE
To unleash the full potential of the new Intel 11th Gen CPU, the motherboard requires the best CPU power, memory and IO
design. With the best quality components and GIGABYTE R&D design capability, Z590 AORUS XTREME is a true beast among
motherboards.
Digital PWM
Power Stages
Tantalum Capacitor
CPU Power Connector
1. Digital PWM
2. Power Stages
3. Tantalum Capacitor
4. CPU Power Connector
2. Power Stages
3. Tantalum Capacitor
4. CPU Power Connector
20*+1 PHASES TRUE POWER DESIGN
- Pure Digital PWM Architecture
- 100A DrMOS for Each Phase
- High Current Capacity Driver-MOSFET
- Tantalum Polymer Capacitors Array
- 8+8 Solid Pin CPU Power Connector
- Low Temperature
- Improved Transient
In order to unleash the full performance of the new high core count CPUs, GIGABYTE uses true
power phases, a fully load-balanced VRM design with doublers, and a tantalum polymer capacitor
array. By using
doublers, the power design
ensures that the high power draw of the CPU is fully balanced across all MOSFETs to achieve
better efficiency and lower
temperatures. In contrast, MOSFETs in competitors' traditional parallel power designs are not as
well
balanced which leads to lower
efficiency and higher temperatures. For sudden changes between idle and high load states from
the CPU, GIGABYTE utilizes
a tantalum polymer capacitor array directly under the CPU socket as a buffer to improve
transient response and stability
under high CPU frequencies.
GIGABYTE POWER DESIGN | True Power Design
TRADITIONAL PARALLEL POWER DESIGN | Parallel Power Design
Improved Transient Response
By using brand new VRM design and Tantalum Polymer Capacitor Array, Z590 AORUS motherboard
transient response and
stability is highly improved under overclocking and heavy loading condition.
Power Design Efficiency
GIGABYTE Power Design with Doubler
Other's Traditional Parallel Design without Doubler
Other's Traditional Parallel Design without Doubler
* XMP Profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.
Please see the complete validated memory support list. Product features may vary by model.
XTREME MEMORY
Z590 AORUS XTREME uses revolutionary "XTREME MEMORY" technology, which includes Shielded Memory Routing, SMT DIMM, and
Tantalum Polymer Capacitors Array to minimize all noise and electrical interference and reach the highest memory clock.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from
external interference.
XTREME MEMORY
Z590 AORUS XTREME uses revolutionary "XTREME MEMORY" technology, which
includes
Shielded Memory
Routing, SMT DIMM, and
Tantalum Polymer Capacitors Array to minimize all noise and electrical interference and
reach the
highest memory
clock.
Tantalum Polymer Capacitors Array
Capacitors are placed directly underneath the memory DIMM to
improve transient response.
SMT DIMM
Less external interference and shorter memory routing compared to traditional DIP design.
1. 2X PCIe 4.0 Slot
Reinforced PCIe 4.0 x16 or x8/x8 with lower impedance.
2. PCIe 4.0 Turbo B-Clock
External clock generator for PCIe 4.0 overclocking.
3. PCIe 4.0 Active Switch
Switch PCIe 4.0 x16 into PCIe 4.0 x8/x8 with strengthened signal.
4. PCIe 4.0 M.2 Slot
M.2 PCIe 4.0 x4 slot with lower impedance.
- 2x PCIe 4.0/3.0 M.2 Slots
- Full PCIe 4.0 hardware design
- Passive thermal design
- Double-Side M.2 SSD heatsinks
* Actual support may vary by CPU.
** 3X PCIe 4.0 M.2 SSD RAID 0
VRM THERMAL DESIGN
M.2 THERMAL GUARD II
SMART FAN 6
THERMAL REACTIVE ARMOR
Z590 AORUS XTREME uses an unprecedented and innovative thermal design to ensure
the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming.
1. Fins-Array II with NanoCarbon Coating
Fins-Array II use a new louvered stacked-fins design which not
only increases surface area by 300% compared to
traditional heatsinks but also improves thermal efficiency with
better airflow and heat exchange.
2.
Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made from a new
manufacturing process that narrows the gap between the Heatpipe and
heatsink, the new Direct-Touch Heatpipe II greatly help
transfers heat on the MOSFET.
3. Aluminum
Cover
IO Cover is made from aluminum and is connected with Fins-Array
to help overall MOSFET heat dissipation.
4. 3X M.2
Thermal Guard II
Enlarged double-sided M.2 heatsink prevents high-speed, large
capacity PCIe 3.0 SSDs with double side flash from
throttling due to overheating.
5. LAIRD 7.5
W/mK Thermal Pad
By using 1.5mm thicker 7.5 W/mK thermal conductivity pads, it
can transfer 4x more heat compared to traditional thermal
pads in the same time.
6. NanoCarbon
Baseplate
A thin layer of NanoCarbon is coated on the baseplate through
electrostatic adhesion to enhance thermal radiation
capability.
7. Right
Angled Connectors
Over 90% of connectors on Z590 AORUS XTREME are specifically
designed to be right angled for easy cable management and
clean airflow in the chassis.
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is usually only used
on industrial equipment that
need compact heat exchangers. It has a special secondary fins structure that enhances
heat transfer performance.
Louver Directed Flow
Heat flow that goes through fins will enter from the leading edge of the
louver and is then directed by other louvers or
fins. This louver directed flow can greatly improve heat transfer
performance.
Fins-Array II
Traditional Stacked Fins
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is usually only used on
industrial equipment that need compact heat exchangers. It has a special secondary fins
structure that enhances heat transfer performance.
Circulation Zone
Because of pressure difference and flow separation, a circulation zone will be formed between
louvered fins. This circulation will cause flow entrain and eject in the vortice form which
improves thermal efficiency.
* Flow simulation of louvered fins
NanoCarbon Coated Fin Array Heatsink
As CPUs get more powerful, VRM modules get hotter under ultra high performance. Being
the first adopters among industry using NanoCarbon as coating material to enhance
thermal radiation speed up heat dissipation. Nanocarbon is coated onto the heatsink
through electrostatic adhesion. The coating material covers the entire finned heatsink
with 200μm in thickness. In that way, heat is dissipated more quickly.
The tests show 10% cooler with the NanoCarbon coating.
Direct-Touch Heatpipe II
With an extra large 8mm heat pipe and made from a new manufacturing
process to narrow the gap between the heat pipe and
heatsink, new Direct-Touch Heatpipe II greatly helps transfer heat on
MOSFETs.
NanoCarbon Baseplate
- Base plate made of aluminum instead of traditional iron ensures 3X thermal conductivity.
- A thin layer of NanoCarbon is coated on the base plate through electrostatic adhesion to enhance thermal radiation capability.
- Transfer heat from the back side PCB to the base plate so the NanoCarbon base plate can dissipate heat passively.
- Effectively lowers backside PWM component temperature by 10%.
NanoCarbon Coating
This specialized nanostructure of carbon molecules has extraordinary thermal
conductivity.
Right-Angled Connectors
Z590 AORUS XTREME uses revolutionary Right-Angled Connectors design, 90% of pin
headers and
connectors on motherboard
are right-angled and relocated to one side of PCB. The never-seen-before design help
easier
cable
management and better
in-chassis air-flow when installing great amount of devices.
*Photo for reference only.
AORUS M.2 Thermal Guard II
With durability in mind, GIGABYTE provides a new thermal solution for large capacity
M.2 SSD devices with double side
flash. The M.2 Thermal Guard II uses a double-sided heatsink design and prevents
throttling and bottlenecks on high
speed M.2 SSDs by dissipating heat before it becomes an issue.
Thermal Throttling As
Temperature Rises
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance
while staying cool
and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan
curve based on
different temperature sensors across the board via intuitive user interface.
Headers & Sensors
10 PWM/DC Fan Headers
8 Internal Temperature Sensors
1 Noise Detection Cable
2 External Temperature Sensor Cables
Cooling Features
-
High Current SupportEach fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
-
Precision ControlUp to 7 temperature/fan speed control points for precise fan curve
-
Dual Curve ModeSlope/Stair dual mode for different user scenario
-
Fan StopFan can stop completely below users' specified temperature point
1
Improve fan curve UI
We increase control points from 5 to 7 and larger fan speed graph for precise and easier fan curve control.
2
Slope/Stair dual graph mode
Fan curve can be quickly switch with Slope and Stair modes for different user scenario. Slope is traditional and intuitive linear fan speed curve. With newly added Stair non-linear mode, fan keeps at same speed between specified temperature interval.
3
Manual Input
For advanced users, we provide fan speed manual input for more precise control.
4
EZ Tuning
Use can place 4 EZ Tuning points at rough temperature/fan speed, and Smart Fan 6 can quickly generate a fan curve.
5
Fan curve profile
Fan curve profile can be saved in BIOS ROM, profile will be kept after updating BIOS.
Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.
Intelligent Fan Control Design
Noise Detection
With the new Noise Detection function, you can monitor noise level of
all devices including
fans,
CPU coolers, graphics
card, etc. in real time, and you can determine how fast your fan speed
needs to be. Our
bundled
Noise Detection cable
doesn’t include any sound recording function, it simply detects sound
pressure while
protecting your
privacy.
Intel Thunderbolt 4
10 GbE LAN
802.11ax WIFI 6E
Hi-Fi AUDIO
CONNECTIVITY
A Flagship product needs to be future-proofed so your system stays up-to-date with the latest technology. Z590 AORUS
XTREME provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
Next Generation Intel Thunderbolt™ 4
Dual Thunderbolt™ 4 – The fastest 40Gb/s single-wire connection
Powered by Intel's own Thunderbolt controller the new Thunderbolt™ 4 protocol, which is available over two USB Type-C® connectors on the back I/O of the GIGABYTE Z590 AORUS XTREME, brings an unprecedented single-wire bandwidth of up to 40 Gb/s -- twice more than USB3.2 Gen2x2! This incredible increase in bandwidth is also accompanied with support for different protocols such as DisplayPort 1.4a* and compliant with USB4 standard, which is backwards compatible with USB 3.2 Gen1 and USB 2.0, opening up a world of new possibilities.
Daisy-chain Multiple Devices
Support for DisplayPort 1.4 makes Thunderbolt™ 4 a must have for any enthusiast. The Z590 AORUS XTREME is able to support two displays in 4K resolution at 60 FPS or one display in 8K resolution. In addition, Thunderbolt™ 4 over USB Type-C® has revolutionary industry-first features such as Power Delivery 2.0, USB4 specification compliance, and the ability to daisy-chain up to 10 devices thanks to the Z590 AORUS XTREME's dual USB Type-C® ports.
AQUANTIA® 10GbE BASE-T Networking
Next Generation Multi-Gig Gaming
The AQUANTIA ® AQC107 is a high-performance, backward compatible with
10GBASE-T/
5GBASE-T/ 2.5GBASE-T/
1000BASE-T/ 100BASE-TX Ethernet Controller which is able to provide up to 10 GbE
network
connectivity,
with 10 times faster transfer speeds compared to general 1GbE networking and is
perfectly designed
for
media centers, workstations and gamers.
Multi-Gigabit Support
• Ultimate online gaming experience with faster connection speed
• Backward compatible with 5/2.5/1Gbps network
• No re-wiring needed
• Backward compatible with 5/2.5/1Gbps network
• No re-wiring needed
Intel 802.11ax WIFI 6E
Intel latest Wireless solution 802.11ax WIFI 6E with new dedicated 6GHz band, enables gigabit
wireless performance,
provides smooth video streaming, better gaming experience, few dropped connections and speeds up to
2.4Gbps*. Moreover,
Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI6E
- Dedicated spectrum in 6GHz band for less interference
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
WIFI 6E Advantage
Spectrum congestion is huge problem in current WIFI environment nowadays because too many
devices all use
existing 2.4GHz and 5GHz spectrum, and it cause unreliable connection and slower speed.
WIFI 6E is extended standard to WIFI 6, and it use dedicated 6GHz band that it provides not only
brand new frequency to
transfer data,
but also spacious spectrum for future more devices. With WIFI 6E, users can enjoy faster
connection and stronger signal
than before.
AORUS Antenna
- All new antenna supported 802.11ax WIFI 6E 2.4GHz, 5GHz & 6GHz, 4dBi signal gain
- 2x signal strength compared to traditional antenna design
- Two antenna with smart antenna function for the best WIFI signal transmitting
- Multiple angle tilt and magnetic base for the best signal strength direction and location
ESSential USB DAC
Complete Digital to Analog Signal processing on
front-access USB Type-C® ports gets rid
of any possibility of distortions
and provides superb sound stage recreation so users can
experience the
vocal cohesion. Enjoy the
depth of the music and
the immersive sound profile.
- USB Type-C® for PC, Laptop and Android Devices
- Replace Ancient Front Audio Interfaces
- Powered by ESS SABRE HIFI DAC
- Premium Power Processing
- Left/Right Separation Routing
- Superior Sound Stage by WIMA Capacitors
Replace Ancient Front Audio Interfaces
ESSential USB DAC Components
1. EMI Absorbent
Material, Dual Grounding Protections
2. Premium WIMA Audio
Capacitors
3. HDI (High Density
Interconnect) PCB with layer separation L/R Routing
4. Ultra Low-Noise Linear
Power Design
5. High Precision Passive
Components
6. ESS SABRE HiFi
ES9280CPRO
| ESSential USB DAC | |
| Audio Format | Up To 32-bit/384KHz PCM data, DSD128 |
| Output | 2 Volts @ 300Ω / 1.4 Volts @ 32Ω |
| DAC Chip | ESS SABRE HiFi ES9280CPRO |
| Compatibility | Windows® 10 build 19021 (and later) Android 5.0 (and later) Apple OS Mojave 10.14.6 (and later) |
| Interface | Input: USB Type-C® Output: 3.5mm, support impedance sensing |
| SNR | Up to -131dB (A-Weighting) |
| DNR | Up to 118dB (A-Weighting) |
| THD+N | Up to -118dB (1.4Vrms@300Ω load) up to -109dB (34mW@32Ω load) |
| Frequency Response | 20Hz~40kHz |
-
Realtek ALC1220-VB
-
ESS9018K2M
-
L/R Channel Separation
-
TI Burr-Brown OP AMPs
-
Gold Plated Audio Jacks
True Hi-Fidelity Music (Digital Audio)
Provides surround sound audio and enables DSD music playback
ESS SABRE reference DAC (Digital / Analog Convert)
Hyperstream Dynamic Range (DNR 127dB)
High-Res music (32bit, 192KHz PCM)
World's best THD+N (THD+N -120db)
High-Res music (32bit, 192KHz PCM)
World's best THD+N (THD+N -120db)
L / R separation analog signal processing with
internally
balanced audio
design (L/R
Channel Signal Processing)
For maximum stereo sound quality and high-quality signal
transmission
TI Burr-Brown Audio OP Amps (Audio Signal
Amplification)
Low stereo cross talk, high operational power output
Gold Plated Audio Jacks (Crystal Sound Output)
High resistance to corrosion and oxidation
-
Auto Impedance Sensing
-
Precise TXC Oscillator
-
WIMA Capacitors
-
Independent Analog Power
-
Power Purifier
Auto Impedance Sensing
Auto detects headphone coils from 6 to 600 Ω and automatically
adjusts proper output
power
Precise TXC Oscillator
Provides precise time triggers to Digital-Analog Converters
Audiophile Grade Capacitors
Famous WIMA capacitors are used as feedback signal processing to
deliver crystal and
balanced sound
Independent Analog Power
Drives clean analog power for audio components to ensure minimal
noise
Power Purifier
Supplies undisturbed power to the Digital-Analog Converters
-
Anti-pop Circuit Design
Anti-pop Circuit Design
Prevents popping noise when plugging in and removing the audio jack
DTS :X® Ultra
Recreates an authentic, spatially accurate 3D audio experience for gaming over any
headphones or speakers. Supports
channel-based, scene based and object-based audio. Provides out-of-the-box calibration for a range
of headphones and
speakers. Provides post-processing enhancements and device level tuning for DTS®
codecs.
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
*DTS Sound Unbound needs the latest Windows fixes in the Windows 10, please upgrade
your Windows 10 OS to Win10 Build 18898 or later versions.
DTS:X Ultra Technology Video
DTS:X Ultra Experience Video
RGB FUSION
BIOS
MultiKey
EASY TUNE
PERSONALIZATION
Z590 AORUS XTREME provides full lighting effect and customization settings with outstanding aesthetics, enable
enthusiasts to build gaming PC differently.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their
PC to represent
their lifestyle. With full RGB
support and a redesigned RGB Fusion 2.0 application, the user has complete
control over the
LEDs which surround
the motherboard.
Note: Lighting effects depicted are for demonstration purposes only. Actual lighting effects may
vary by model.
With an integrated intuitive user interface, the RGB Fusion 2.0 provides
you a better
solution for customizing the lighting effects across all supported
devices. From
motherboards, graphics cards to the peripheral products, you can
personalize your gaming
rig with your own style and show off your build by sharing the profiles.
In addition,
the new gaming mode makes the lighting effects interactive with selected
games to bring
you the most immersive gaming experience.
Sync with one click
Individual control as you wish
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU
clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings
modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
MultiKey
A multi-function reset button that can be reconfigured to other function in BIOS for different user scenarios.
- RGB Switch
Turn off all lighting effect on motherboard. - Direct-To-BIOS
Boot into BIOS menu directly without pressing any keyboard button. - Safe Mode
Boot into BIOS safe mode to change specific option without losing other BIOS settings.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to
fine-tune their system settings or adjust
system and memory clocks and voltages in a Windows environment. With Smart Quick
Boost, one click
is all it takes to automatically overclock your system, giving an added performance
boost when
you need it the most.
Q-FLASH PLUS
3X PCIe ARMOR
4X MEMORY ARMOR
SOLID PINS
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the
best components we can find for the Z590 AORUS XTREME and reinforce every slot to make each of them solid and durable.
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and
graphics
card nor
enter the BIOS menu to flash
the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on
the USB
flash
drive, then press the
dedicated Q-Flash Plus button and you’re good to go!
Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from
GIGABYTE
reinforces
the PCIe connectors to provide the extra
strength required to support heavy graphics cards.
Ultra Durable™ Memory Armor
AORUS' exclusive one piece stainless steel shielding design prevents against PCB
distortion/twisting
and plate bending, in addition to preventing any possible ESD interference.
Solid Pin Power Connectors
Z590 AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 8pin power
connectors to offer a stable power supply
during CPU overloading.
Solid Pin Power connector advantages
- Larger contact area for electricity
- More metal quantity to sustain higher power and generated heat
- Ultra durable and longer lifespan
KEY FEATURE
Intel® Z590 AORUS Motherboard with 20+1 Phases Digital VRM, Fins-Array II Heatsink, Direct-Touch Heatpipe II ,NanoCarbon Baseplate, Intel® Thunderbolt 4, ESSential USB DAC, AORUS PRO Gen4 AIC Adaptor, Intel® WiFi 6E 802.11ax, AQUANTIA® 10GbE LAN
- Supports 11th and 10th Gen Intel® Core™ Series Processors
- Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
- 20+1 Phases Digital VRM Solution with 100A Smart Power Stage and Tantalum Polymer Capacitors Array
- XTREME MEMORY with SMT DIMM and Shielded Memory Routing
- Thermal Reactive Armor with Fins-Array II Heatsink, Direct Touch Heatpipe II and NanoCarbon Baseplate
- Intel® Thunderbolt™ 4 Onboard
- Onboard Intel® WiFi 6E 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
- Exclusively bundled ESSential USB DAC
- 127dB SNR AMP-UP Audio with High-End ESS SABRE 9018K2M DAC, LME 49720, OPA1622 and WIMA Audio Capacitors
- AQUANTIA® 10GbE BASE-T LAN and Intel® 2.5GbE LAN with cFosSpeed
- Exclusively bundled AORUS PRO Gen4 AIC Adaptor
- Triple Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guards II
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Termenii HDMI, HDMI High-Definition Multimedia Interface, Imaginea comercială HDMI și Siglele HDMI sunt mărci comerciale sau mărci comerciale înregistrate ale HDMI Licensing Administrator, Inc.
* Specificațiile produselor și aparența acestora poate varia de la țară la țară. Vă recomandăm să verificați cu comercianții locali despre specificațiile și aspectul produselor disponibile în țara dvs. Culorile produselor ar putea fi diferite din cauza variatiilor fotografice sau setări ale monitoarelor, deci ar putea exista variațiuni față de acest website. Deși facem eforturi pentru a prezenta cele mai precise și cuprinzătoare informații la momentul publicării, ne rezervăm dreptul de a face modificări fără notificare prealabilă.
