Z690 AORUS MASTER (rev. 1.x)
Intel® Z690 Chipset
OVERVIEW
PERFORMANCE
DDR5
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
Key Feature
1
Q-FLASH PLUS Button
2
Intel® WIFI 6E 802.11ax 2T2R & BT 5 with AORUS Antenna
3
DisplayPort
4
Rear USB 3.2 Gen 2x2 Type-C®
5
AQUANTIA 10GbE
6
Advanced Thermal Design
- NanoCarbon Fins-Array III
- Direct-Touch Heatpipe II
- 9 W/mK Thermal Conductivity Pad
- 2X Copper PCB
- NanoCarbon Aluminum Backplate
7
Next Generation PCIe 5.0 Design
- 1x PCIe 5.0 x16 SMD Slot
- Ultra Durable™ SMD PCIe 5.0 Armor
8
Audio Solutions
- ESS SABRE Hi-Fi 9118 DAC
- ALC1220-VB Audio
- Audiophile Grade WIMA Capacitors
9
RGB FUSION 2.0
- 2 x Addressable LED Header
- 2 x RGB LED Header
10
Direct 19+1+2 Phases Digital Power Design
- 105A Power Stage*
- 8-Layer PCB
- PCIe 5.0 Ready Low-Loss
*Power Stage maximum current capacity is based on VCORE Phase.
11
Solid Pin Power Connectors with Metal Shielding
- 24 pin ATX Power Connector
- 8+8 pin CPU Power Connector
12
Support 12th Gen Intel® Core Processor
13
Dual Channel DDR5, 4 DIMMs with Ultra Durable SMD Memory Armor
14
Front USB 3.2 Gen 2x2 Type-C® for Connecting Devices
15
Thunderbolt™ Add-in Card Connector
16
5 x M.2 Connectors NVMe PCIe 4.0 x4
- M.2 Thermal Guard III
- Enlarged M.2 Thermal Guard
17
Multi-Key
- Multiple function set by BIOS
- Reset/RGB Switch/Direct to BIOS/Safe Mode
18
Noise Detection
Direct Digital VRM Design
PCIe 5.0 DESIGN
Hybrid Cores Optimization
OC GUIDE
Unparalleled Performance
With technology moving so fast, GIGABYTE still keep up with the
latest trends and provide our customers with
advanced features and latest technology. GIGABYTE Z690 Series motherboards come with
upgraded power solution, latest storage standards and outstanding connectivity to enable
optimize performance for gaming.
To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, GIGABYTE Z690 series equip the best VRM design ever built with the highest quality components.
To unleash full potential of multi-cores CPU performance
For CPU integrated GPU performance
Provide stable power for CPU integrated PCIe & Memory controller
The more advanced manufacturing process and the higher core count on the new
generation of
CPUs, requires motherboards to utilize a more sophisticated VRM design to
make CPUs run at their
full potential. GIGABYTE uses fully DIRECT VRM DESIGN, high quality
MOSFETs and tantalum polymer
capacitors to achieve higher efficiency, lower voltage ripple and lower
temperature than
traditional parallel VRM design.
GIGABYTE DIRECT VRM DESIGN
TRADITIONAL PARALLEL VRM
DESIGN
Tantalum Polymer Capacitor
- • Lower impedance than regular capacitor to reduce voltage ripple
- • Stable capacitance under high temperature
- • Mounted right under the CPU area to stabilize CPU voltage during heavy loading
With DIRECT VRM DESIGN and TANTALUM POLYMER CAPACITOR, Z690
motherboards transient response,
voltage ripple and stability is highly improved under overclocking and heavy
loading condition.
GIGABYTE get Z690 Motherboards ready to work with the upcoming PCIe 5.0 device which is expected to experience Twice bandwidth. To reach the high speed and maintain good signal integrity, Gigabyte R&D selects the low impedance PCB to make it work.
1.
PCIe 5.0 x16 SMD Slot
2.
8-Layer Low Signal Loss PCB
Ultra Durable™ SMD PCIe 5.0 Armor
GIGABYTE' exclusive stainless steel shielding design.
1. Double Locking Bracket
2. Signal Degradation
3. SMD Iron Claw
By means of multi-point stainless steel pins penetrating the PCB to increase the strength of the SMD slot to improve the Durability.
4. Tensile Strength
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS
profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and
voltage
policy.
GAMING
- • Deactivate all E-Core
- • Zero compromise on gaming performance
- • Up to 20% lower CPU package power
- • Up to 5°C lower CPU temperature
Max Performance
- • Activate all P-Core and E-Core
- • Maximize full multi-cores performance
PDF DownloadXMP 6400+
Unlock DDR5 Voltage
Shielded Memory Routing
SMD DIMM
XMP3.0
XTREME MEMORY
GIGABYTE Z690 Motherboards feature the latest DDR5 architecture and
XMP 3.0 capability. The new DDR5 memory technology brings 50%
more bandwidth to the platform and increases the system performance
drastically by implementing Unlocked Native DDR5 Voltage,
Xtreme Memory Routing and reliable SMD slot. In addition to the hardware
upgrades, the user friendly UI provides full functionality to overclock higher
with exclusive DDR5 tuning capability.
DDR5 Comes with 50%
Performance Increase
DDR5 delivers 50% improvement compared to last generation. DDR5
massively elevates the system level performance. DDR5 provides more
bandwidth to keep up with the higher CPU core count bandwidth
requirement. The new memory architecture also reduces the power
consumption.
* USE AIDA64 to compare the write, read, and copy on DDR5 4800 vs
DDR4 3200.
Support for DDR5 XMP Up to 6400MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with
profiles up to
6400MHz and beyond. All users need to do to attain this performance boost is to ensure that
their
memory module is XMP capable and that the XMP function is activated and enabled on their
AORUS
motherboard.
*XMP profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by
model.
Unlock DDR5 Voltage
DDR4
DDR4 voltage is managed by MB with wide range
Native DDR5
Secure Mode
MB provides fixed 5V to Native DDR5 memory and built-in PMIC outputs locked 1.1v to memory
IC.
GIGABYTE Exclusive DDR5 Circuit Design
Programmable Mode
GIGABYTE’s exclusive design unlocks Native DDR5 PMIC secure mode into programmable mode and
control
Native DDR5 voltage with wide range.
- • GIGABYTE exclusive circuit design unlocks Native DDR5 voltage control
- • Transforms Native DDR5 memory module to Overclocked DDR5 memory
- • Increases DDR5 memory overclocking performance and capability
- • Supports all PMIC vendors for maximum compatibility
* Memory overclocking capabiblity will vary based on users' hardware configuration
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect
from
external interference.
Non-shielded
Ultra Durable™ SMD DDR5 Memory Armor
GIGABYTE's exclusive stainless steel shielding design.
Signal Degradation
SMD High Frequency
Anti-Plate
Bending 130%
Bending 130%
SMD Iron Claw
By means of multi-point stainless steel pins penetrating the PCB to
increase the strength of the SMD slot to improve the durability.
Support Plug / Unplug
5000+ times
* The result is based on internal lab test for reference only, real performance may vary.
** Photo for reference only.
** Photo for reference only.
DDR5 Auto Booster
Automatically Boost the Native DDR5 frequency to 5000MHz while the system is
under
heavy loading by a single click.
DDR5 Memory Upgrade
GIGABYTE BIOS offers pre-defined and retrievable profiles for users to get
higher
performance easily. The profiles are based on a database that is created by
checking
each memory IC and PMIC vendors to optimize the modules to unleash their
full
potential. This is a time saving feature to manually configure overclocked
DDR5
memory kits.
- • Instantly upgrade memory performance
- • Overclock Native and XMP 3.0 DDR5 memory to higher frequency easily
- • No need to input dozens of memory parameters such as clock, voltage and timings
- • Built-in wide variety pre-tuned profiles database for different memory IC vendors
*DDR5 MEMORY UPGRADE involves DDR5 memory overclocking,
overclocking capability depends on users’ hardware configuration
overclocking capability depends on users’ hardware configuration
XMP 3.0 User Profile
Define and create your own SPD profile into Native and XMP 3.0 memory modules or apply the pre-tuned profiles to XMP 3.0 User Profile. Two user-defined profiles can be saved, loaded either locally or from/to an external storage device.
- • Two empty SPD profiles can be defined by users and carry to next computer
- • Transfer DDR5 XMP Booster profiles into XMP 3.0 User Profiles
- • Quick memory performance simulation based on user input clock and timing parameters
- • Profile save and load function to share your memory parameters online
SPD Re-defined or retrieve from database
Performance Simulation
Save/Load Profile
Overclocked Performance
Profile Clearance
Thermal Design
Fins-Array III
2X Copper PCB
SMART FAN 6
THERMAL REACTIVE ARMOR
GIGABYTE Z690 Series Motherboards' Un-throttled performance is guaranteed by
innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and
low temperatures under full load application and gaming.
1. Direct-Touch HeatpipeII
With an extra large 8mm heatpipe and made from a new manufacturing process that narrows the gap between
the heatpipe and heatsink, the new Direct-Touch Heatpipe II greatly help transfers heat on the MOSFET.
2. 2X COPPER PCB
2X COPPER PCBs design effectively lower the component temperature by its high thermal conductivity and
low impedance.
3. M.2 Thermal Guard III
M.2 Thermal Guard III constructed with 8X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent throttling and bottlenecks on high-speed/ large capacity of PCIe 4.0 M.2 SSDs.
4. Fins-Array III with
NanoCarbon Coating
Fins-Array III upgraded thermal performance by using new extended Irregular fins and louvered
stacked-fins design which not only increases surface area by incredible 900% compared to traditional
heatsinks but also improves thermal efficiency with better airflow and heat exchange.
5. 9 W/mK Thermal Pad
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can transfer 5x more heat compared to
traditional thermal pads at the same time.
6. Enlarged Thermal Guard
Enlarged double-sided M.2 heatsink prevents high-speed, large capacity PCIe 4.0/3.0 SSDs with double
side flash from throttling due to overheating.
Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process
which has
narrow down the gap between the
heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to
dissipate the
heat on MOSFETs.
M.2 Thermal Guard III
GIGABYTE Thermal Guard III ensures PCIe 4.0 SSD running at 7GB/s With No Throttling.
Throttle-free Performance
*The result is based on internal lab test for reference only, real performance may
vary.
Test conditions are under open
case, 25°C ambient temperature, no airflow, AIO Cooler and the latest Gen4 7000 SSD running IO
meter for
two hours.
M.2 Thermal Guard III
Continuing the advantages of M.2 Thermal Guard II design which using the double-sided thermal pads
to elevate the height of M.2 heatsink as increasing surface area to dissipate heats on M.2 SSDs. M.2
Thermal Guard III constructed with 8X optimized heat dissipation surface to prevent throttling and
bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy
workload.
1. Captive Screw
To prevent missing the M.2 heatsink screw.
2. Thermal Guard III
8X Optimized heat dissipation surface area compared to traditional heatsink.
3. Heatsink + Thermal Pad (Top)
4. M.2 SSD
5. Heatsink + Thermal Pad (Bottom)
*The appearance design of M.2 Thermal III may affect the CPU tower cooler installation; therefore,
it is recommend to use CPU liquid cooler.
1. NanoCarbon Baseplate
- Base plate made of aluminum instead of traditional iron ensures 3X thermal conductivity.
- A thin layer of NanoCarbon is coated on the base plate through electrostatic adhesion to enhance thermal radiation capability.
- Transfer heat from the back side PCB to the base plate so the NanoCarbon base plate can dissipate heat passively.
- Effectively lowers backside PWM component temperature by 10%.
2. NanoCarbon Coating
This specialized nanostructure of carbon molecules has extraordinary thermal
conductivity.
Fins-Array III
GIGABYTE new generation Fins-Array III delivers the ultimate thermal performance by using Extended Irregular fins to fill all available space and vastly increases surface area. A piece of Fins-Array III heatsink surface area is larger than 2 full size ATX motherboard PCB, therefore it tremendously boost thermal efficiency and heat exchange performance.
1. Advanced internal fins construction
- • 700% bigger surface.
- • Extended Irregular design used all available space to dissipate heat.
GIGABYTE Advanced Thermal Solution
Traditional heatsink
Fins-Array
Single Fin surface area: 520mm2 Increases total heatsink
surface area by 300%
Fins-Array II
Single Fin surface area: 898mm2 Louvered fins design
to improve airflow and heat
Fins-Array III
Single Fin surface area: 1678mm2 Extended Irregular fins
design to increase
more surface area
+900% total heatsink surface area
NanoCarbon Coated Fin Array Heatsink
As CPUs get more powerful, VRM modules get hotter under ultra high
performance. Being the first
adopters among industry using NanoCarbon as coating material
to enhance thermal radiation speed up heat dissipation. Nanocarbon is coated
onto the heatsink
through electrostatic adhesion. The coating material covers the entire
finned heatsink with
200μm in thickness. In that way, heat is dissipated more quickly. The tests
show 10% cooler with
the NanoCarbon coating.
3% Cooler by implementing
2X copper PCB Design
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3%
by
turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the
components effectively, due to it’s high thermal conductivity and lower impedance.
Smart Fan 6 contains several unique cooling features that ensure gaming
PC
maintain its performance while staying cool
and quiet. Multiple fan headers can support PWM/DC fan and pump, and
users can
easily define each fan curve based on
different temperature sensors across the board via intuitive user
interface.
Headers & Sensors
10 PWM/DC Fan Headers
7 Internal Temperature Sensors
2 External Temperature Sensor Cables
1 Noise Detection Cable
Cooling Features
-
High Current SupportEach fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
-
Precision Control7 temperature/fan speed control points for precise fan curve
-
Dual Curve ModeSlope/Stair dual mode for different user scenario
-
Fan StopFan can stop completely below users' specified temperature point
Smart Fan 6 BIOS UI
1
Improve fan curve UI
We increase control points from 5 to 7 and larger fan speed graph for
precise
and easier fan curve
control.
2
Slope/Stair dual graph mode
Fan curve can be quickly switch with Slope and Stair modes for different
user
scenario. Slope is
traditional and
intuitive linear fan speed curve. With newly added Stair non-linear
mode, fan
keeps at same speed
between specified
temperature interval.
3
Manual Input
For advanced users, we provide fan speed manual input for more precise
control.
4
EZ Tuning
Use can place 4 EZ Tuning points at rough temperature/fan speed, and
Smart Fan 6
can quickly generate a
fan curve.
5
Fan curve profile
Fan curve profile can be saved in BIOS ROM, profile will be kept after
updating
BIOS.
Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.
Intelligent Fan Control Design
Noise Detection
With the new Noise Detection function, you can monitor noise level of
all devices including
fans,
CPU coolers, graphics
card, etc. in real time, and you can determine how fast your fan speed
needs to be. Our
bundled
Noise Detection cable
doesn’t include any sound recording function, it simply detects sound
pressure while
protecting your
privacy.
10 GbE LAN
802.11ax WIFI 6E
ESSential Audio
CONNECTIVITY
GIGABYTE Z690 Series Motherboards let you experience ultimate connection flexibility and
blazing data-transfer speed with next generation network, storage, and WIFI connectivity.
AQUANTIA® 10GbE BASE-T Networking
Next Generation Multi-Gig Gaming
The AQUANTIA® AQC113C is a high-performance, backward compatible with
10GBASE-T/ 5GBASE-T/
2.5GBASE-T/
1000BASE-T/
100BASE-TX Ethernet Controller which is able to provide up to 10 GbE network
connectivity, with 10 times
faster
transfer
speeds compared to general 1GbE networking and is perfectly designed for media centers,
workstations and
gamers.
Multi-Gigabit Support
- Ultimate online gaming experience with faster connection speed
- Backward compatible with 5/2.5/1Gbps network
- No re-wiring needed
Intel 802.11ax WIFI 6E
Intel latest Wireless solution 802.11ax WIFI 6E with new dedicated 6GHz
band, enables gigabit
wireless performance, provides smooth video streaming, better gaming
experience, few dropped
connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X
range over BT 4.2 and
with faster transmission.
Benefit of WIFI 6E
- Dedicated spectrum in 6GHz band for less interference
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
WIFI 6E Advantage
Spectrum congestion is huge problem in current WIFI environment nowadays
because too
many
devices all use
existing 2.4GHz and 5GHz spectrum, and it cause unreliable connection
and slower
speed.
WIFI 6E is extended standard to WIFI 6, and it use dedicated 6GHz band
that it
provides not only
brand new frequency to
transfer data,
but also spacious spectrum for future more devices. With WIFI 6E, users
can enjoy
faster
connection and stronger signal
than before.
-
ESS SABRE reference DAC
-
True High-Fidelity Music
-
Audiophile Grade Capacitors
-
Precision Audio Stream
-
Hi-Res Audio
-
DTS :X® Ultra
ESS SABRE reference DAC ES9118
ESS SABRE reference DAC (ESS 9118)
Hyperstream Dynamic Range (SNR 125dB)
High-Res music (32bit, 192KHz PCM)
Super low THD+N (THD+N -112db)
True High-Fidelity Music (Realtek ALC1220)
Paired with Realtek's latest ALC1220 Codec, playback for surround sound audio
and DSD enabled music are easier than ever.
Audiophile Grade Capacitors (WIMA , Nichicon Fine Gold)
To ensure a studio-quality experience, WIMA and Nichicon Fine Gold capacitors are used to provide power to the overall system.
Precision Audio Stream (TXC OSCILLATOR)
Provides precise time triggers to Digital-Analog Converters. High resistance to corrosion and oxidation.
Hi-Res Audio
Hi-Res Audio certified, meaning that the product is capable of reproducing
frequencies
up to 40kHz
or above which ensures user with the best audio quality at all times.
DTS :X® Ultra
Recreates an authentic, spatially accurate 3D audio
experience for gaming
over any
headphones or speakers. Supports
channel-based, scene based and object-based audio. Provides
out-of-the-box calibration
for a range
of headphones and
speakers. Provides post-processing enhancements and device level tuning
for
DTS®
codecs.
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
*DTS Sound Unbound needs the latest Windows fixes in the Windows 10,
please upgrade
your Windows 10 OS to Win10 Build 18898 or later versions.
DTS:X Ultra Technology Video
DTS:X Ultra Experience Video
RGB FUSION
UEFI BIOS
MultiKey
Easy Tune
Personalization
GIGABYTE motherboards bundle several useful and intuitive software to help
users to control every aspect of motherboard and provide customizable lighting effect with
outstanding aesthetics to fit your unique personality.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their
PC to represent their
lifestyle. With full
RGB support and a redesigned RGB Fusion 2.0 application, the user has
complete control over the LEDs
which surround the
motherboard. Note: Lighting effects depicted are for demonstration purposes only.
Actual lighting effects may
vary by model.
-
Wave -
Cycle Color -
Static -
Pulse -
Flash -
Double Flash -
Music -
Random -
Game -
Digital A -
Digital B -
Digital C
New User Interface
All new EASY MODE shows important hardware information in one page including
CPU
clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2
interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall
settings
modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
MultiKey
A multi-function reset button that can be reconfigured to other function in BIOS for
different user
scenarios.
-
RGB SwitchTurn off all lighting effect on motherboard.
-
Direct-To-BIOSBoot into BIOS menu directly without pressing any keyboard button.
-
Safe ModeBoot into BIOS safe mode to change specific option without losing other BIOS settings.
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to
fine-tune
their system settings or adjust system and memory clocks and voltages in a Windows
environment. With Smart Quick Boost, one click is all it takes to automatically
overclock
your system, giving an added performance boost when you need it the most.
Q-Flash Plus
Solid Pin
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing
process. GIGABYTE motherboards use the best components and reinforce every slots to make
each of them solid and durable.
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and
graphics
card nor
enter the BIOS menu to flash
the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on
the USB
flash
drive, then press the
dedicated Q-Flash Plus button and you’re good to go!
Solid Pin Power Connectors
AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 8pin power
connectors to offer a stable power supply during CPU overloading.
Solid Pin Power connector advantages
- Larger contact area for electricity
- More metal quantity to sustain higher power and generated heat
- Ultra durable and longer lifespan
Key Feature
Intel® Z690 AORUS Motherboard with Direct 19+1+2 Phases Digital VRM Design, DDR5 XTREME MEMORY Design, Fins-Array III Heatsink, Direct-Touch Heatpipe II, NanoCarbon Baseplate, M.2 Thermal Guard III, 125dB ESS Sabre Audio, Intel® WIFI 6E 802.11ax, AQUANTIA® 10GbE LAN
- Support 12th Gen Intel® Series Processors
- Dual Channel Non-ECC Unbuffered DDR5, 4 DIMMs
- Direct 19+1+2 Phases VRM Design with 105A Power Stage* and Tantalum Polymer Capacitor
- DDR5 XTREME MEMORY Design with SMD DIMM and Shielded Memory Routing
- Advanced Thermal Solution with NanoCarbon Fins-Array III Heatsink, Direct-Touch Heatpipe II and NanoCarbon Baseplate
- Intel® WIFI 6E 802.11ax 2T2R & BT5 with AORUS Antenna
- Audio Solution with ESS Sabre ES9118 125dB on Rear Audio
- AQUANTIA® 10GbE BASE-T LAN
- 5 x Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Power Stage maximum current capacity is based on VCORE Phase.
* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.
