Intel® Z590 Chipset
OVERVIEW
POWER
PERFORMANCE
THERMAL
CONNECTIVITY
AUDIO
PERSONALIZATION
ULTRA DURABLE
SOFTWARE
Key Feature
1
Intel® WiFi 6 802.11ax 2T2R & BT 5 with AORUS Antenna
2
DisplayPort 1.2
3
Rear USB 3.2 Gen2x2 Type-C®
4
Intel® 2.5 GbE LAN
5
Advanced Thermal Design
- NanoCarbon Fins-Array II
- NanoCarbon Direct-Touch Heatpipe II
- 7.5 W/mK LAIRD Thermal Conductivity Pad
- 3X Enlarged M.2 Thermal Guard II
- 2x Copper PCB
6
AMP-UP Audio
- ALC4080 Audio
- Audiophile Grade WIMA Capacitors
7
3* M.2 Connectors with Thermal Guards
- NVMe PCIe 4.0/3.0 x4
8
RGB FUSION 2.0
- Addressable LED Header*2
- RGB LED Header*2
9
True 16+1 Phases Digital Power Design
- 90A Smart Power Stage
- 6 Layer PCB
- PCIe 4.0 Ready Mid-Loss PCB
10
Solid Pin Power Connectors with Metal Shielding
- 24 pin ATX Power Connector
- 8+8 pin CPU Power Connector
11
Supports 11th Gen. Intel® Core™ Processors
12
Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
13
Front USB3.2 Gen2 Type-C®
14
Ultra Durable PCIe Armor
- Running 1 x16 or 2 x8
15
Noise Detection
16
Q-FLASH Onboard Button
Power Design
VRM Architecture
Power Efficiency
Transient Response
EXTREME POWER DESIGN
To unleash the full potential of the latest Intel 11th Gen CPU, the motherboard requires the best CPU power design. With
the best quality components and GIGABYTE R&D design capability, Z590 AORUS ULTRA is a true beast among motherboards.
Digital PWM
Power Stages
Tantalum Capacitor
CPU Power Connector
1Digital PWM Controller
216 Phases 90A Smart Power Stages
3Tantalum Polymer Capacitors
48+8 Solid Pin CPU Power Connector with Metal
Shielding
- 90A Smart Power Stage for Each vCore Phase
- High Current Capacity MOSFET
- Tantalum Polymer Capacitors Array
- Lower Temperatures
- Improved Transient
In order to unleash the full performance of the new high core count CPUs, GIGABYTE uses true
power phases, a fully load-balanced VRM design with doublers, and a tantalum polymer
capacitor
array. By using
doublers, the power design
ensures that the high power draw of the CPU is fully balanced across all MOSFETs to achieve
better efficiency and lower
temperatures. In contrast, MOSFETs in competitors' traditional parallel power designs are
not as
well
balanced which leads to lower
efficiency and higher temperatures. For sudden changes between idle and high load states
from
the CPU, GIGABYTE utilizes
a tantalum polymer capacitor array directly under the CPU socket as a buffer to improve
transient response and stability
under high CPU frequencies.
GIGABYTE POWER DESIGN | True Power Design
TRADITIONAL PARALLEL POWER DESIGN | Parallel
Power Design
Power Design Efficiency
GIGABYTE Power Design with Doubler
Other's Traditional Parallel Design without Doubler
Other's Traditional Parallel Design without Doubler
Improved Transient Response
By using brand new VRM design and Tantalum Polymer Capacitor Array, Z590 AORUS motherboard
transient response and
stability is highly improved under overclocking and heavy loading condition.
XMP 5000+
PCIe 4.0 Hardware Design
3X PCIe 4.0/3.0 M.2 Slots
UNPARALLELED PERFORMANCE
GIGABYTE understands that our customer won't stop chasing better computer performance, and strive to deliver that in our
products. For the Z590 series, protective and optimized memory trace enhance the performance; faster read and write
speed save time and improve efficiency; and generous M.2 Storage with thermal guards ensure unthrottled read and write
performance. Future upgrades to the Z590 are made possible by the use of PCIe 4.0-ready components.
* XMP Profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.
Please see the complete validated memory support list. Product features may vary by model.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer
to
protect from
external interference.
Non-shielded
Memory Layout - Daisy Chain Design
With the optimized daisy-chain routing, the Z590 AORUS
motherboard
provides a proven
speed of up to DDR4-5000+ MHz with
high-density Memory module*. Optimized daisy-chained routing eliminates the
stub
effect, pushes the
one DIMM per channel
in dual channel interleaving mode to hit higher memory frequencies,
providing
professional gamers a
denser and faster
system memory experience.
*Performance may vary in circumstances. Please refer to
the QVL
list for detail
support information.
Single 32GB Support
The maximum memory capacity on the Z590 motherboard is
128GB.
After Intel updated the
memory reference code, a single
slot can support up to 32GB. Therefore with populated 2 DIMM per channel
on both
channel, total
memory capacity is
128GB, which was only available on High End Desktop (HEDT) platforms.
For users
who always run out
of memory capacity,
there is more bandwidth now for memory-intensive application such as
rendering
and video editing.
1. 2X PCIe 4.0 Slot
Reinforced PCIe 4.0 x16 or x8/x8 with lower impedance.
2. Mid-Loss PCB
3. M.2 PCIe 4.0 Slot
M.2 PCIe 4.0 x4 slot with lower impedance.
4. PCIe 4.0 Active Switch
Switch PCIe 4.0 x16 into PCIe 4.0 x8/x8 with strengthened signal.
PCIe 4.0 M.2 Connectors with Thermal Guards
AORUS Gaming Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their
Systems' potential.
Fins-Array II
Direct Touch II
Thermal Guard II
Smart Fan 6
1. Direct-Touch
Heatpipe II
With an extra large 8mm heatpipe and made from a new manufacturing process that narrows the
gap between the heatpipe and
heatsink, the new Direct-Touch Heatpipe II greatly help transfers heat on the MOSFET.
2. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal
conductivity and low impedance.
3. Fins-Array II
Fins-Array II use a new louvered stacked-fins design which not only increases surface area
by 300% compared to
traditional heatsinks but also improves thermal efficiency with better airflow and heat
exchange.
4. 7.5 W/mK Thermal
Conductivity Pad
By using 1.5mm thicker 7.5 W/mK thermal conductivity pads, it can transfer 4x more heat
compared to traditional thermal
pads in the same time.
5. 3X M.2 Thermal
Guard II
Enlarged double-sided M.2 heatsink prevents high-speed, large capacity PCIe 3.0 SSDs with
double side flash from
throttling due to overheating.
aDVANCED THERMAL SOLUTION
Unthrottled performance is guaranteed by the enhanced thermal solution that incorporates Fins-Array II, Heatpipe II and
Thermal Guards II. The comprehensive solution delivers excellent heat dissipation. The Z590 AORUS ULTRA stays cool on
VRMs and M.2 SSD even on full loading, making it most suitable for enthusiasts, overclockers and professional gamers.
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is
usually only used
on industrial equipment that
need compact heat exchangers. It has a special secondary fins structure that
enhances
heat transfer performance.
Louver Directed Flow
Heat flow that goes through fins will enter from the leading edge of the
louver and is then directed by other louvers or
fins. This louver directed flow can greatly improve heat transfer
performance.
Fins-Array II
Traditional Stacked Fins
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is
usually only used
on
industrial equipment that need compact heat exchangers. It has a special
secondary fins
structure that enhances heat transfer performance.
Circulation Zone
Because of pressure difference and flow separation, a circulation zone
will be formed
between
louvered fins. This circulation will cause flow entrain and eject in the
vortice form
which
improves thermal efficiency.
* Flow simulation of louvered fins
NanoCarbon Coated Fin Array Heatsink
As CPUs get more powerful, VRM modules get hotter under ultra high
performance. Being
the first adopters among industry using NanoCarbon as coating material to
enhance
thermal radiation speed up heat dissipation. Nanocarbon is coated onto the
heatsink
through electrostatic adhesion. The coating material covers the entire
finned heatsink
with 200μm in thickness. In that way, heat is dissipated more quickly.
The tests show 10% cooler with the NanoCarbon coating.
Direct-Touch Heatpipe II
With an extra large 8mm heat pipe and made from a new manufacturing
process to narrow the gap between the heat pipe and
heatsink, new Direct-Touch Heatpipe II greatly helps transfer heat on
MOSFETs.
AORUS M.2 Thermal Guard II
With durability in mind, GIGABYTE provides a new thermal solution for large
capacity M.2 SSD devices with double side
flash. The M.2 Thermal Guard II uses a double-sided heatsink design and
prevents throttling and bottlenecks on high
speed M.2 SSDs by dissipating heat before it becomes an issue.
1. Heatsink+ Thermal Pad(Up)
2. M.2 SSD
3. Heatsink+ Thermal Pad(Down)
Thermal Throttling
AsTemperature Rises
Smart Fan 6 contains several unique cooling features that ensure gaming
PC maintain its performance while staying cool
and quiet. Multiple fan headers can support PWM/DC fan and pump, and
users can easily define each fan curve based on
different temperature sensors across the board via intuitive user
interface.
Headers & Sensors
8 PWM/DC Fan Headers
8 Internal Temperature Sensors
2 External Temperature Sensor Cables
1 Noise Detection Cable
Cooling Features
-
High Current SupportEach fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
-
Precision ControlUp to 7 temperature/fan speed control points for precise fan curve
-
Dual Curve ModeSlope/Stair dual mode for different user scenario
-
Fan StopFan can stop completely below users' specified temperature point
Smart Fan 6 BIOS UI
1
Improve fan curve UI
We increase control points from 5 to 7 and larger fan speed graph for
precise
and easier fan curve
control.
2
Slope/Stair dual graph mode
Fan curve can be quickly switch with Slope and Stair modes for different
user
scenario. Slope is
traditional and
intuitive linear fan speed curve. With newly added Stair non-linear
mode, fan
keeps at same speed
between specified
temperature interval.
3
Manual Input
For advanced users, we provide fan speed manual input for more precise
control.
4
EZ Tuning
Use can place 4 EZ Tuning points at rough temperature/fan speed, and
Smart Fan 6
can quickly generate a
fan curve.
5
Fan curve profile
Fan curve profile can be saved in BIOS ROM, profile will be kept after
updating
BIOS.
Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.
Intelligent Fan Control Design
Noise Detection
With the new Noise Detection function, you can monitor noise level of
all devices including
fans,
CPU coolers, graphics
card, etc. in real time, and you can determine how fast your fan speed
needs to be. Our
bundled
Noise Detection cable
doesn’t include any sound recording function, it simply detects sound
pressure while
protecting your
privacy.
Intel 2.5GbE LAN
WIFI 6 802.11ax
AORUS Antenna
NEXT GENERATION CONNECTIVITY
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. Z590 AORUS ULTRA
provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
First Adopter on 2.5GbE LAN Onboard
2X Faster than ever
- Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
- Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 ethernet
New Introduce Intel® WiFi 6 802.11ax + BT 5 Module
Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better
gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT
4.2 and with faster transmission.
Benefit of WIFI 6 :
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
AORUS Antenna Supports Dual-Band with Better WIFI Signal
- All new antenna supported Dual-Band 802.11ax WIFI 6 2.4GHz &5GHz.
better signal strength compared to traditional antenna design - AORUS Antenna with smart antenna function for the best WIFI signal transmitting
- Multiple angle tilt and magnetic base for the best signal strength direction and location
Hi Fi Audio
DTS : X® Ultra
HI-FI AUDIO SYSTEM
For enthusiasts, sound quality is just as essential to the gaming experience. Z590 motherboards are equipped with high
quality audio components such as Hi-Fi grade WIMA FKP2 capacitors and Nichicon Fine Gold capacitors to provide a superb
audio experience. The exclusive AORUS AMP-UP Audio technology makes for the ideal onboard sound solution for the most
demanding audiophiles.
Hi-Res Audio
Hi-Res Audio certified, meaning that the product is capable of reproducing frequencies up to 40kHz or above which
ensures user with the best audio quality at all times.
Immersive Gaming ViBes
Realtek High-End HD Audio Codec
- Supports audio format up to 32-bit/384KHz and output SNR up to Rear/Front 120dB 110dB.
- Automatically detects impedance of audio device, preventing low volume and distortion.
- Stream voice with up to 110dB(A) SNR via microphone.
DTS :X® Ultra
Recreates an authentic, spatially accurate 3D audio experience for
gaming
over any
headphones or speakers. Supports
channel-based, scene based and object-based audio. Provides out-of-the-box
calibration
for a range
of headphones and
speakers. Provides post-processing enhancements and device level tuning for
DTS®
codecs.
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
*DTS Sound Unbound needs the latest Windows fixes in the Windows 10, please
upgrade
your Windows 10 OS to Win10 Build 18898 or later versions.
DTS:X Ultra Technology Video
DTS:X Ultra Experience Video
RGB FUSION
RGB FUSION Software
DEFINITIVE AESTHETICS
Z590 AORUS ULTRA features RGB FUSION 2.0 and offers users the option to
control onboard, external light strips,
and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and
stylish.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to
represent their
lifestyle. With full
RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control
over the LEDs
which surround the
motherboard.
-
Cycle Color -
Static -
Pulse -
Flash -
Double Flash -
Music -
Random -
Game -
Digital A -
Digital B -
Digital C
Note: Lighting effects depicted are for demonstration purposes only. Actual lighting
effects may
vary by model.
With an integrated intuitive user interface, the RGB Fusion 2.0 provides
you a better
solution for customizing the lighting effects across all supported
devices. From
motherboards, graphics cards to the peripheral products, you can
personalize your gaming
rig with your own style and show off your build by sharing the profiles.
In addition,
the new gaming mode makes the lighting effects interactive with selected
games to bring
you the most immersive gaming experience.
Sync with one click
Individual control as you wish
3X PCIe Armor
4X Memory Armor
Solid Pin
Q-Flash Plus
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the
best components we can find for the GIGABYTE motherboard and reinforce every slot to make each of them solid and
durable.
Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from
GIGABYTE
reinforces
the PCIe connectors to provide the extra
strength required to support heavy graphics cards.
Ultra Durable™ Memory Armor
AORUS' exclusive one piece stainless steel shielding design prevents against PCB
distortion/twisting
and plate bending, in addition to preventing any possible ESD interference.
Solid Pin Power Connectors
AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 8pin power connectors
to offer a stable power
supply during CPU overloading.
Solid Pin Power connector advantages
- Larger contact area for electricity
- More metal quantity to sustain higher power and generated heat
- Ultra durable and longer lifespan
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and
graphics
card nor
enter the BIOS menu to flash
the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on
the USB
flash
drive, then press the
dedicated Q-Flash Plus button and you’re good to go!
GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. GIGABYTE motherboard bundled several
useful and
intuitive
software to help users to control every aspect of motherboard.
BIOS
APP Center
Easy Tune
System Information Viewer
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU
clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings
modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
APP CENTER
GIGABYTE APP CENTER is a useful portal of all GIGABYTE MB utilities and drivers, you
can choose any utility you want to install from APP CENTER and keep updated with the
latest utilities and drivers version.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to
fine-tune their system settings or adjust
system and memory clocks and voltages in a Windows environment. With Smart Quick
Boost, one click
is all it takes to automatically overclock your system, giving an added performance
boost when
you need it the most.
System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to
your current system status. Monitor components
such as the clocks and processor, set your preferred fan speed profile, create
alerts when temperatures
get too high or record your system's behavior; these are the possibilities of the
System Information
Viewer.
Key Feature
- Supports 11th and 10th Gen Intel® Core™ Processors
- Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
- Intel® Optane™ Memory Ready
- Direct 16+1 Phases Digital VRM Solution with 90A Smart Power Stage
- Shielded Memory Routing for Better Memory Overclocking
- NanoCarbon Fins-Array II Heatsink and Direct Touch Heatpipe II
- Onboard Intel® WiFi 6 802.11ax 2T2R & BT5 with AORUS Antenna
- AMP-UP Audio with ALC4080 and WIMA for Rear 120dB SNR
- Blazing Fast Intel® 2.5GbE LAN with cFosSpeed
- Triple Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guards II
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Actual support may vary by CPU.
* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.
