Z590 AORUS TACHYON (rev. 1.0)

Intel® Z590 Chipset
 
Z590 AORUS TACHYON is the pinnacle of overclocking motherboard completely designed by and for overclockers, who are continuously seeking to break unimaginable performance limit. Its specialized VRM design, memory layout trace and built-in overclocking buttons and switches enable overclocking enthusiasts to unleash full potential of latest generation Intel Core processor.
CPU OC: 7314 MHz
Memory OC: 6870 MHz
* LN2 Overclocking
VRM Design
Memory
Connectivity
Overclocking
VRM Design
1Digital PWM Controller
2100A DrMOS
3Tantalum Capacitor Matrix
4Dual CPU Power Connectors
  • + Direct 12 Phases VRM Design
  • + 100A DrMOS for each vCore phase
  • + Tantalum Polymer Capacitors Matrix
  • + Lower Temperature
  • + Better Transient Response
Digital PWM Controller
VRM design uses Intersil ISL69269 PWM controller that directly drives 12 phase for the highest efficiency.
100A DrMOS
Each vcore VRM phase uses 100A Vishay SiC840 DrMOS for maximum current capacity under extreme overclocking.
Tantalum Capacitor Matrix
VRM design uses 100% full tantalum polymer capacitors for better transient response and less mechanical interference with extreme overclocking cooling device.
Dual CPU Power Connectors
Dual 8 pin CPU power connectors with metal shielding provide maximal current input to processor.
Power Architecture
Z590 AORUS TACHYON uses direct 12 phases VRM design with the highest 100A DrMOS and full tantalum polymer capacitors around VRM area, to maximize power efficiency and transient response, and eliminate voltage ripple during extreme high frequency overclocking.
Tantalum Polymer Capacitor Matrix
By using 100% tantalum polymer capacitors design, it's easier for professional overclockers to insulate VRM area and use LN2 pot to cool down CPU without mechanical interference.
Power Efficiency Comparison
Memory
XTREME MEMORY
With 2-DIMM daisy chain memory trace layout, Z590 AORUS TACHYON can achieve the shortest memory DIMM distance between CPU, therefore reach the highest memory clock and the lowest latency.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
Non-shielded
Connectivity
PCIe 4.0 M.2 Performance
Intel 2.5GbE LAN Onboard

2X Faster than ever
    Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least two times faster transfer speeds compared to general 1GbE networking. It’s perfectly suit for gamers and streamer with ultimate and smooth online experience. It also backward compatible with Multi-Gig(10/100/1000/2500Mbps) RJ-45 ethernet.


Intel 802.11ax WIFI 6E
Intel latest Wireless solution 802.11ax WIFI 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6E
  1. Dedicated spectrum in 6GHz band for less interference
  2. 5.5X throughput than 802.11ac 1x1*
  3. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
  4. Network efficiency increase for better user experience
WIFI 6E Advantage
Spectrum congestion is huge problem in current WIFI environment nowadays because too many devices all use existing 2.4GHz and 5GHz spectrum, and it cause unreliable connection and slower speed. WIFI 6E is extended standard to WIFI 6, and it use dedicated 6GHz band that it provides not only brand new frequency to transfer data, but also spacious spectrum for future more devices. With WIFI 6E, users can enjoy faster connection and stronger signal than before.
AORUS Antenna
  1. All new antenna supported 802.11ac 2.4GHz & 5GHz, 4dBi signal gain
  2. 2x signal strength compared to traditional antenna design
  3. Two antenna with smart antenna function for the best WIFI signal transmitting
  4. Multiple angle tilt and magnetic base for the best signal strength direction and location
USB 3.2 Gen2x2 TYPE-C®
Overclocking
Overclocking Kit
1
Power Button
Power On/Off system.
2
Reset Button
Reboot system.
3
LIMP Mode
Allows the system to automatically reboot with default or safe settings without having to clear CMOS settings first. This is useful in situations when users fail to boot up the system with their self-defined memory parameters.
4
Cold Reset Button
Use this button to force your system to reboot. This is usually used if a CPU crash or memory errors occur or warm reset doesn't work when tuning your system settings. Hitting this button to force the system to shutdown and boot again.
5
Clear CMOS
Clear BIOS setting.
6
CPU Ratio Switch
Raise or lower CPU ratio manually.
7
Profile Switch
Load Profile A & B preset in the BIOS on next boot.
8
Voltage Measurement
Use multimeter to contact those points to measure different voltage value.
9
OC Trigger Switch
This switch can be used to lower the CPU frequency to cool down the CPU temperature before running a benchmark without having to change any software settings. Instantly setting the TGR switch back to its default position when the benchmark begins will revert the CPU frequency to the original value.
10
Enhanced LN2 Mode
Dependent on the LN2 Mode Switch setting (unavailable if LN2_SW is set to 1). Enabling this switch will allow the CPU to boot up at a temperature as low as possible.
11
Reserved Switch
This switch is reserved for hardware expansion. A single phase power design is reserved for future use.
12
LN2 Mode Switch
Use this switch to enable or disable optimized LN2 mode. Enabling this switch will allow the CPU to effectively boot up at a lower temperature.
13
SB Switch
The SB switch allows enabling or disabling of the Dual BIOS function.
14
BIOS Switch
The BIOS switch (BIOS_SW) allows users to easily select a different BIOS for boot up or overclocking, helping to reduce BIOS failure during overclocking.
Key Feature
  • Supports 11th and 10th Gen Intel® Core™ Series Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 2 DIMMs
  • Direct 12 Phases Digital VRM Solution with 100A DrMOS and Tantalum Polymer Capacitors Matrix
  • XTREME MEMORY with 2-DIMM Design and Shielded Memory Routing
  • Exclusive onboard Overclocking Kit for extreme overclocking
  • Onboard Intel® WiFi 6E 802.11ax 2T2R & BT 5 with AORUS Antenna
  • Amp-Up Audio with ALC1220 and WIMA Audio Capacitors
  • Blazing Fast Intel® 2.5GbE LAN with cFosSpeed
  • Triple Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guards
  • SuperSpeed USB 3.2 Gen2x2 TYPE-C® delivers up to 20Gb/s transfer speeds
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card

* Actual support may vary by CPU.

* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.