X570S AORUS MASTER (rev. 1.0)
AMD X570 Chipset
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
Key Feature
1
Q-Flash Plus Button
2
Intel® WiFi 6E 802.11ax 2T2R & BT 5 with AORUS Antenna
3
Rear USB 3.2 Gen 2x2 Type-C®
4
Intel® 2.5GbE LAN
5
Advanced Thermal Design
- NanoCarbon Fins-Array II
- NanoCarbon Direct-Touch Heatpipe II
- 9 W/mK Thermal Conductivity Pad
- 2x Copper PCB
- Aluminum Backplate
6
4* M.2 Connectors
- NVMe PCIe 4.0/3.0 x4
- 1X M.2 Thermal Guard III
- 3X M.2 Thermal Guard II
7
Audio Solutions
- ESS SABRE Hi-Fi 9118 DAC
- ALC1220-VB Audio
- Audiophile Grade WIMA Capacitors
8
RGB FUSION 2.0
- Addressable LED Header*2
- RGB LED Header*3
9
Direct 14+2 Phases Digital Power Design
- 70A Power Stage
- 6 Layer PCB
- PCIe 4.0 Ready Mid-Loss PCB
10
Multi-Key
- Multiple function set by BIOS
- Reset/RGB Switch/Direct to BIOS/Safe Mode
11
Noise Detection
12
Solid Pin Power Connectors
- 24 pin ATX Power Connector
- 8+8 pin CPU Power Connector
13
Supports AMD Ryzen™ Series Processors
- Supports Active OC Tuner*
* Only available on selected AMD Ryzen™ processors with P.B.O. function featured
14
Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
15
Front USB 3.2 Gen 2 Type-C®
16
Thunderbolt™ Add-in Card Connector
17
Ultra Durable PCIe Armor
- Running 1 x16 or 2 x8, x4 Bandwidth
- 3X PCIe 4.0 Slots
*Click here to view AM4 Overclocking Guidance
Direct Power Design
Active OC Tuner
XMP 5400+
PCIe 4.0 Design
UNPARALLELED PERFORMANCE
To unleash the full potential of the latest AMD Ryzen™ 5000 series processors, the motherboard requires the best CPU
power, memory and IO design. With the best quality components and GIGABYTE R&D design capability, X570S AORUS MASTER is
a true beast among motherboards.
GIGABYTE X570S Motherboards are equipped with best in class power solution to
release the full potential of the latest AMD
Ryzen™ 5000 Series CPUs. The VRM power design includes MOSFETs which Vcore and SOC
accompanied by digital PWM, premium
chokes and high quality capacitors to offer extraordinary stability and precision to the
high performance CPU. In
addition, Six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy
the extreme overclocking
performance without compromise.
Direct and Digital Power for CPU Vcore
Digital Power for CPU SOC
Power Design Efficiency
GIGABYTE Direct Power Design
Traditional Parallel Power Design
Traditional Parallel Power Design
GIGABYTE Active OC Tuner
With GIGABYTE's exclusive Active OC Tuner BIOS function, CPU* can work with AMD P.B.O. for gaming and other
light workload applications with the highest CPU boost clock, but when the applications require all CPU cores
horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU
cores.
ㆍActive OC Tuner switches profile based on user scenario automatically ㆍ5% performance increase
*Click here to view GIGABYTE Active OC Tuner Guidance
ㆍActive OC Tuner switches profile based on user scenario automatically ㆍ5% performance increase
* Only available on selected AMD Ryzen™ processors with P.B.O. function featured.
*Click here to view GIGABYTE Active OC Tuner Guidance
Active OC Tuner with Auto Switching
AMD P.B.O.
Manual
AMD P.B.O. mode for fewer cores with the
highest CPU boost clock, better for gaming.
Manual OC mode for all cores with high CPU
clock, better for content creation.
Memory Layout - Daisy Chain Design
With the optimized daisy-chain routing, GIGABYTE X570S motherboards provide a proven speed of up to DDR4-5400+ MHz with high
density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in
dual channel interleaving mode to hit higher memory frequencies, and provides professional gamers a denser and faster
system memory experience.
* Performance may vary in circumstances. Please refer to the QVL list for detail support information.
Support for DDR4 XMP Up to 5400MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.
* XMP Profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.
Please see the complete validated memory support list. Product features may vary by model.
Single 32GB Support
With populated 4 DIMMs per channel on GIGABYTE X570 motherboards, the maximum memory capacity support is 128GB. For
users who always run out of memory capacity, they are able to enjoy more bandwidth now for memory-intensive application
such as rendering and video editing.
1. 3X PCIe 4.0
Slot
Reinforces PCIe 4.0 x16 or 2 x8, x4 bandwidth with lower impedance.
2. 4X M.2 PCIe 4.0 Slot
M.2 PCIe 4.0 x4 slot with lower impedance.
3. PCIe 4.0 Turbo B-Clock
External clock generator for PCIe 4.0 overclocking.
4. PCIe 4.0 Active Switch
Switch PCIe 4.0 x16 into PCIe 4.0 x8/x8 with strengthened signal.
5. Mid-Loss PCB
Fins-Array II
Direct Touch II
Thermal Guard III
Smart Fan 6
1. Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process which has narrowed down the gap between the
heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.
2. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
3. Fins-Array II
Fins-Array II uses brand new louvered stacked-fins design which not only increases surface area by 300% compared to
traditional heatsinks, but also improves thermal efficiency with better airflow and heat dissipation.
4. 9 W/mK Thermal Conductivity Pad
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can transfer 4x more of heat dissipation compared to
traditional thermal pads in same time.
5. M.2 Thermal Guard III
M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent
throttling and bottlenecks on high-speed/ large capacity of PCIe 4.0 M.2 SSDs.
ADVANCED THERMAL SOLUTION
X570S AORUS MASTER uses an unprecedented and innovative thermal design to ensure the best CPU, Chipset, SSD stability
and low temperatures under full loading application and gaming.
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is usually only used
on industrial equipment that
need compact heat exchangers. It has a special secondary fins structure that enhances
heat transfer performance.
Louver Directed Flow
Heat flow that goes through fins will enter from the leading edge of the
louver and is then directed by other louvers or
fins. This louver directed flow can greatly improve heat transfer
performance.
Fins-Array II
Traditional Stacked Fins
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is usually only used
on
industrial equipment that need compact heat exchangers. It has a special secondary fins
structure that enhances heat transfer performance.
Circulation Zone
Because of pressure difference and flow separation, a circulation zone will be formed
between
louvered fins. This circulation will cause flow entrain and eject in the vortice form
which
improves thermal efficiency.
* Flow simulation of louvered fins
NanoCarbon Coated Fins Array Heatsink
As CPUs get more powerful, VRM modules get hotter under ultra high performance. Being the first adopters among industry
using NanoCarbon as coating material to enhance thermal radiation speed up heat dissipation. Nanocarbon is coated onto
the heatsink through electrostatic adhesion. The coating material covers the entire finned heatsink with 200μm in
thickness. In that way, heat is dissipated more quickly. The tests show 10% cooler with the NanoCarbon coating.
Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process which has narrow down the gap between the
heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.
M.2 Thermal Guard III
Continuing the advantages of M.2 Thermal Guard II design which using the double-sided thermal pads to elevate the height of M.2 heatsink as increasing surface area to dissipate heats on M.2 SSDs. M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy workload.
1. Captive Screw
To prevent missing the M.2 heatsink screw.
2. Multi-cut
Design
To enhance airflow fluency and heat dispassion.
3. Thermal Guard III
2.6X Optimized heat dissipation surface area compared to traditional heatsink.
4. Heatsink + Thermal Pad (Top)
5. M.2 SSD
6. Heatsink + Thermal Pad (Bottom)
*The appearance design of M.2 Thermal III may affect the CPU tower cooler installation; therefore, it is recommend to use CPU liquid cooler.
M.2 Thermal Guard III
GIGABYTE motherboards promise the consistent cooling and high performance for the users to
avoid
throttling from the overheating.
Throttle-free Performance
*The result is based on internal lab test for reference only, real performance may vary.
Test conditions are under open
case, 25°C ambient temperature, no airflow, AIO Cooler and the latest Gen4 7000 SSD running IO meter for
two hours.
Smart Fan 6 contains several unique cooling features that ensure gaming PC
maintain its performance while staying cool
and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can
easily define each fan curve based on
different temperature sensors across the board via intuitive user interface.
Headers & Sensors
10 PWM/DC Fan Headers
7 Internal Temperature Sensors
2 External Temperature Sensor Cables
1 Noise Detection Cable
Cooling Features
-
High Current SupportEach fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
-
Precision Control7 temperature/fan speed control points for precise fan curve
-
Dual Curve ModeSlope/Stair dual mode for different user scenario
-
Fan StopFan can stop completely below users' specified temperature point
Smart Fan 6 BIOS UI
1
Improve fan curve UI
We increase control points from 5 to 7 and larger fan speed graph for precise
and easier fan curve
control.
2
Slope/Stair dual graph mode
Fan curve can be quickly switch with Slope and Stair modes for different user
scenario. Slope is
traditional and
intuitive linear fan speed curve. With newly added Stair non-linear mode, fan
keeps at same speed
between specified
temperature interval.
3
Manual Input
For advanced users, we provide fan speed manual input for more precise control.
4
EZ Tuning
Use can place 4 EZ Tuning points at rough temperature/fan speed, and Smart Fan 6
can quickly generate a
fan curve.
5
Fan curve profile
Fan curve profile can be saved in BIOS ROM, profile will be kept after updating
BIOS.
Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.
Intelligent Fan Control Design
Noise Detection
With the new Noise Detection function, you can monitor noise level of
all devices including
fans,
CPU coolers, graphics
card, etc. in real time, and you can determine how fast your fan speed
needs to be. Our
bundled
Noise Detection cable
doesn’t include any sound recording function, it simply detects sound
pressure while
protecting your
privacy.
Intel® 2.5GbE LAN
Intel® WIFI 6E 802.11ax
USB 3.2 Gen 2x2 Type-C®
Hi-Fi Audio
NEXT GENERATION CONNECTIVITY
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570S AORUS
MASTER provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
First adopter on 2.5GbE LAN onboard
2X Faster than ever
ㆍAdoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster
transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online
gaming experience.
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
Intel® 802.11ax WIFI 6E
Intel® latest Wireless solution 802.11ax WIFI 6E with new dedicated 6GHz band, enables gigabit wireless performance,
provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover,
Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6E
- Dedicated spectrum in 6GHz band for less interference
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
WIFI 6E Advantage
Spectrum congestion is huge problem in current WIFI environment nowadays because too
many
devices all use
existing 2.4GHz and 5GHz spectrum, and it cause unreliable connection and slower
speed.
WIFI 6E is extended standard to WIFI 6, and it use dedicated 6GHz band that it
provides not only
brand new frequency to
transfer data,
but also spacious spectrum for future more devices. With WIFI 6E, users can enjoy
faster
connection and stronger signal
than before.
AORUS Antenna Supports Tri-Band with Better WIFI Signal
- All new antenna supported Tri-Band 802.11ax WIFI 2.4GHz, 5GHz and 6GHz better signal strength compared to traditional antenna design
- AORUS Antenna with smart antenna function for the best WIFI signal transmitting
- Multiple angle tilt and magnetic base for the best signal strength direction and location
Connecting the Future - USB 3.2 Gen 2x2 Type-C®
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.
-
ESS SABRE reference DAC
-
True High-Fidelity Music
-
Audiophile Grade Capacitors
-
Precision Audio Stream
-
Hi-Res Audio
-
DTS :X® Ultra
ESS SABRE reference DAC ES9118
ESS SABRE reference DAC (ESS 9118)
Hyperstream Dynamic Range (SNR 125dB)
High-Res music (32bit, 192KHz PCM)
Super low THD+N (THD+N -112db)
True High-Fidelity Music (Realtek ALC1220-VB)
ALC1220 120dB(A) SNR HD Audio with Smart Headphone Amp can automatically detect impedance of your head-worn audio device, to prevent issues such as low volume and distortion. With the new VB series audio controller, it can stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).
Audiophile Grade Capacitors (WIMA , Nichicon Fine Gold)
To ensure a studio-quality experience, WIMA and Nichicon Fine Gold capacitors are used to provide power to the overall system.
Precision Audio Stream (TXC OSCILLATOR)
Provides precise time triggers to Digital-Analog Converters. High resistance to corrosion and oxidation.
Hi-Res Audio
Hi-Res Audio certified, meaning that the product is capable of reproducing frequencies
up to 40kHz
or above which ensures user with the best audio quality at all times.
DTS :X® Ultra
Recreates an authentic, spatially accurate 3D audio experience for gaming
over any
headphones or speakers. Supports
channel-based, scene based and object-based audio. Provides out-of-the-box calibration
for a range
of headphones and
speakers. Provides post-processing enhancements and device level tuning for
DTS®
codecs.
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
DTS Sound Unbound* leverage Microsoft Spatial, enabling the the most believable, 3D audio experience for games. Immersion through DTS Headphone:X means in the sonic landscape, stationary and moving sounds can be heard from above, below or around the listener. Sounds pass around the listener with amazing externalization and accurate localization.
Learn more about the immersive gaming sound experience powered by DTS Sound Unbound at https://dts.com/sound-unbound
*DTS Sound Unbound needs the latest Windows fixes in the Windows 10, please upgrade
your Windows 10 OS to Win10 Build 18898 or later versions.
DTS:X Ultra Technology Video
DTS:X Ultra Experience Video
RGB FUSION
BIOS
MultiKey
Easy Tune
DEFINITIVE AESTHETICS
X570S AORUS MASTER features RGB FUSION 2.0 to offer lighting effected options and customized settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their
lifestyle. With full
RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs
which surround the
motherboard.
-
Wave -
Cycle Color -
Static -
Pulse -
Flash -
Double Flash -
Music -
Random -
Game -
Digital A -
Digital B -
Digital C
Note: Lighting effects depicted are for demonstration purposes only. Actual lighting effects may
vary by model.
With an integrated intuitive user interface, the RGB Fusion 2.0 provides
you a better
solution for customizing the lighting effects across all supported
devices. From
motherboards, graphics cards to the peripheral products, you can
personalize your gaming
rig with your own style and show off your build by sharing the profiles.
In addition,
the new gaming mode makes the lighting effects interactive with selected
games to bring
you the most immersive gaming experience.
Sync with one click
Individual control as you wish
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU
clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings
modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
MultiKey
A multi-function reset button that can be reconfigured to other function in BIOS for different user
scenarios.
-
RGB SwitchTurn off all lighting effect on motherboard.
-
Direct-To-BIOSBoot into BIOS menu directly without pressing any keyboard button.
-
Safe ModeBoot into BIOS safe mode to change specific option without losing other BIOS settings.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to
fine-tune their system settings or adjust
system and memory clocks and voltages in a Windows environment. With Smart Quick
Boost, one click
is all it takes to automatically overclock your system, giving an added performance
boost when
you need it the most.
Q-Flash Plus
PCIe Armor
4X Memory Armor
Solid Pin
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the
best components we can find for the GIGABYTE Motherboard and reinforce every slot to make each of them solid and
durable.
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and
graphics
card nor
enter the BIOS menu to flash
the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on
the USB
flash
drive, then press the
dedicated Q-Flash Plus button and you’re good to go!
Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from
GIGABYTE
reinforces
the PCIe connectors to provide the extra
strength required to support heavy graphics cards.
Ultra Durable™ Memory Armor
AORUS' exclusive one piece stainless steel shielding design prevents against PCB
distortion/twisting
and plate bending, in addition to preventing any possible ESD interference.
Solid Pin Power Connectors
AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 4pin power connectors to offer a stable power
supply during CPU overloading.
Solid Pin Power connector advantages
- Larger contact area for electricity
- More metal quantity to sustain higher power and generated heat
- Ultra durable and longer lifespan
Key Feature
- Supports AMD Ryzen™ 5000 Series/ Ryzen™ 4000 G Series/ Ryzen™ 3000 Series/ Ryzen™ 3000 G Series/ Ryzen™ 2000 Series/ Ryzen™ 2000 G Series Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- Active OC Tuner features Dynamic Change Between P.B.O. and Manual OC Settings
- Direct 14+2 Phases Infineon Digital VRM Solution with 70A Power Stage
- Advanced Thermal Solution with Fins-Array II, Direct Touch Heatpipe II, M.2 Thermal Guard III and Thermal Backplate
- Intel® WiFi 6E 802.11ax & BT 5.2
- Quad Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
- Blazing Fast Intel® 2.5GbE LAN with cFosSpeed
- SuperSpeed USB 3.2 Gen 2x2 TYPE-C® delivers up to 20Gb/s transfer speeds
- 125dB SNR AMP-UP Audio with High-End ESS SABRE 9118 DAC, ALC1220-VB and WIMA Audio Capacitors
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.
