B660M AORUS PRO AX (rev. 1.x)
Intel® B660 Chipset
OVERVIEW
PERFORMANCE
DDR5
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
Key Feature
1
8+4 pin Solid Pin CPU Power Connector
2
WIFI 6 802.11ax
3
DisplayPort
4
HDMI
5
Rear USB 3.2 Gen 2x2 Type-C®
6
Intel® 2.5GbE LAN
7
Advanced Thermal Design
- Fully Covered MOSFET Heatsinks
- 5 W/mK Thermal Conductivity Pad
- Integrated IO Shield
- 2X Copper PCB
8
2 x M.2 Ultra Storage Performance Connectors
- 2 x PCIe 4.0 x4 M.2
- Thermal Guard
9
HI-FI Audio
- High-End Audio Capacitor
10
RGB FUSION 2.0
- Addressable LED Header*2
- RGB LED Header*2
11
12*+1+1 Twin Hybrid Phases Digital Power Design
- DrMOS 60A
- Premium Choke and Capacitor
- 6-Layer PCB
12
Support 12th Gen Intel Core Processor
13
Dual Channel DDR5, 4 DIMMs
14
Front USB 3.2 Gen2 Type-C® for Connecting devices
15
Ultra Durable PCIe Armor
- Running 1 x16
16
4 x SATA3
17
Q-FLASH Plus Onboard Button
* 6+6 phases parallel power design
TWIN HYBRID VRM DESIGN
2 x PCIe 4.0 x4 M.2
Hybrid Cores Optimization
Unparalleled Performance
With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with
advanced features and latest technology. GIGABYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.
To ensure maximum Turbo Boost and performance of Intel new generation CPU, GIGABYTE B660 equips the best VRM design we’ve ever built with the highest quality components.
To unleash full potential of multi-cores CPU performance
For CPU integrated GPU performance
Provide stable power for CPU integrated PCIe & Memory controller
* 6+6 phases parallel power designDual PCIe 4.0 x4 M.2
GIGABYTE B660 Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system's potential.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS
profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and
voltage
policy.
GAMING
- • Deactivate all E-Core
- • Zero compromise on gaming performance
- • Up to 20% lower CPU package power
- • Up to 5°C lower CPU temperature
Max Performance
- • Activate all P-Core and E-Core
- • Maximize full multi-cores performance
XMP 5600+
Unlock DDR5 Voltage
Shielded Memory Routing
XMP3.0
Support for DDR5 XMP Up to 5600MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with
profiles up to
5600MHz and beyond. All users need to do to attain this performance boost is to ensure that
their
memory module is XMP capable and that the XMP function is activated and enabled on their
AORUS
motherboard.
*XMP profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by
model.
Unlock DDR5 Voltage
DDR4
DDR4 voltage is managed by MB with wide range
Native DDR5
Secure Mode
MB provides fixed 5V to Native DDR5 memory and built-in PMIC outputs locked 1.1v to memory
IC.
GIGABYTE Exclusive DDR5 Circuit Design
Programmable Mode
GIGABYTE’s exclusive design unlocks Native DDR5 PMIC secure mode into programmable mode and
control
Native DDR5 voltage with wide range.
- • GIGABYTE exclusive circuit design unlocks Native DDR5 voltage control
- • Transforms Native DDR5 memory module to Overclocked DDR5 memory
- • Increases DDR5 memory overclocking performance and capability
- • Supports all PMIC vendors for maximum compatibility
* Memory overclocking capabiblity will vary based on users' hardware configuration
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect
from
external interference.
Non-shielded
Thermal Design
Fully Covered MOSFET Heatsink
M.2 Thermal Guard
2X Copper PCB
SMART FAN 6
ADVANCED THERMAL SOLUTION
GIGABYTE B660 Series Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming.
1. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
2. Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
3. M.2 Thermal Guard
The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
4. 5 W/mK Thermal Pad
By using 1.5mm thicker 5 W/mK thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time.
1. 2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
2. Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
3. Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Thermal Throttling As Temperature Rises
3% Cooler by implementing
2X copper PCB Design
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3%
by
turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the
components effectively, due to it’s high thermal conductivity and lower impedance.
Intel 2.5GbE LAN
WIFI 6 802.11ax
USB 3.2 Gen 2x2 Type-C®
HI-FI Audio
CONNECTIVITY
GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network, storage, and WIFI connectivity.
First adopter on 2.5GbE LAN onboard
2X Faster than ever
ㆍAdoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster
transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online
gaming experience.
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
WIFI 6 802.11ax + BT 5 Module
Wireless solution 802.11ax WIFI 6 with new dedicated 6GHz band,
enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
Connecting the Future - USB 3.2 Gen 2x2 Type-C®
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.
High-End Audio Capacitors
AORUS motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
AORUS motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
RGB FUSION
UEFI BIOS
Easy Tune
System Information Viewer
Personalization
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
RGB FUSION 2.0
With B660 Motherboard, RGB Fusion 2.0 is even better with Addressable LEDs.* RGB Fusion 2.0 offers users the option to control onboard RGB and external RGB / Addressable LED light strips for their PC. Already feature filled with colors and patterns, RGB Fusion 2.0 on B660 Series Motherboards are now upgraded with Addressable LED support. With external Addressable LED strips*, where each LED is digitally addressable, users can experience even more patterns, styles, and illuminations.
With B660 Motherboard will support either 5v or 12v Addressable LED lighting strips and up to 300 LED lights. RGB Fusion 2.0 with Addressable LEDs comes with new patterns and various speed settings with more to come.
* Addressable LEDs are available only on select Motherboards, external LED Strips, Addressable LED Strips are not included with Motherboard purchase.
With B660 Motherboard will support either 5v or 12v Addressable LED lighting strips and up to 300 LED lights. RGB Fusion 2.0 with Addressable LEDs comes with new patterns and various speed settings with more to come.
* Addressable LEDs are available only on select Motherboards, external LED Strips, Addressable LED Strips are not included with Motherboard purchase.
New User Interface
All new EASY MODE shows important hardware information in one page including
CPU
clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2
interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall
settings
modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to
fine-tune
their system settings or adjust system and memory clocks and voltages in a Windows
environment.
System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to
your current system status. Monitor components
such as the clocks and processor, set your preferred fan speed profile, create
alerts when temperatures
get too high or record your system's behavior; these are the possibilities of the
System Information
Viewer.
Q-Flash Plus
Solid Pin
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and
graphics
card nor
enter the BIOS menu to flash
the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on
the USB
flash
drive, then press the
dedicated Q-Flash Plus button and you’re good to go!
Key Feature
Intel® B660 AORUS Motherboard with 12*+1+1 Twin Hybrid Phases Digital VRM Design , DDR5 MEMORY Design, Fully Covered Thermal Design , 2 x PCIe 4.0 M.2 with Thermal Guard, Intel® 2.5GbE LAN, WIFI 6 802.11ax, Rear USB 3.2 Gen 2x2 Type-C®, RGB FUSION 2.0, Q-Flash Plus
- Supports 12th Gen Intel® Core™ Series Processors
- Dual Channel Non-ECC Unbuffered DDR5, 4 DIMMs
- 12*+1+1 Twin Hybrid Digital VRM Design with 60A DrMOS
- DDR5 MEMORY Design with Shielded Memory Routing
- Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
- WIFI6 802.11ax 2T2R & BT5 with AORUS Antenna
- Blazing Fast Intel® 2.5GbE LAN with Bandwidth Management
- Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard
- SuperSpeed USB 3.2 Gen 2x2 Type-C® delivers up to 20Gb/s transfer speeds
- Pre-installed IO Shield for easy and quick installation
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Actual support may vary by CPU.
* 6+6 phases parallel power design
* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.