B660M AORUS PRO AX DDR4 (rev. 1.x)

B660M A PRO AX DDR4
 
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
Key Feature
B660M AORUS PRO AX DDR4
PERFORMANCE UNLEASHED
Rule supreme with the B660 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design, glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake's performance in all its gaming glory.
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
1
8+4 pin Solid Pin CPU Power Connector
2
WIFI 6 802.11ax
3
DisplayPort
4
HDMI
5
Rear USB 3.2 Gen 2x2 Type-C®
6
Intel® 2.5GbE LAN
7
Advanced Thermal Design
  1. Fully Covered MOSFET Heatsinks​
  2. 5 W/mK Thermal Conductivity Pad​
  3. Integrated IO Shield​
  4. 2X Copper PCB
8
2 x M.2 Ultra Storage Performance Connectors
  1. 2 x PCIe 4.0 x4 M.2
  2. Thermal Guard
9
HI-FI Audio​
  1. High-End Audio Capacitor​
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RGB FUSION 2.0
  1. Addressable LED Header*2
  2. RGB LED Header*2
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12*+1+1 Twin Hybrid Phases Digital Power Design
  1. DrMOS 60A
  2. Premium Choke and Capacitor
  3. 6-Layer PCB
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Support 12th Gen Intel Core Processor
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Dual Channel DDR4, 4 DIMMs
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Front USB 3.2 Gen2 Type-C® for Connecting devices
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Ultra Durable PCIe Armor
  1. Running 1 x16
16
4 x SATA3
17
Q-FLASH Plus Onboard Button
* 6+6 phases parallel power design
TWIN HYBRID VRM DESIGN
DDR4 XMP
2 x PCIe 4.0 x4 M.2
Hybrid Cores Optimization
Unparalleled Performance
With  technology  moving so  fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIGABYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.​

To ensure maximum Turbo Boost and performance of Intel new generation CPU, GIGABYTE B660 equips the best VRM design we’ve ever built with the highest quality components.

To unleash full potential of multi-cores CPU performance

For CPU integrated GPU performance

Provide stable power for CPU integrated PCIe & Memory controller

* 6+6 phases parallel power design
Dual PCIe 4.0 x4 M.2
GIGABYTE B660 Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system's potential.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
GAMING
  • • Deactivate all E-Core
  • • Zero compromise on gaming performance
  • • Up to 20% lower CPU package power
  • • Up to 5°C lower CPU temperature
Max Performance
  • • Activate all P-Core and E-Core
  • • Maximize full multi-cores performance
Thermal Design
Fully Covered MOSFET Heatsink
M.2 Thermal Guard​
2X Copper PCB
SMART FAN 6
ADVANCED THERMAL SOLUTION
GIGABYTE B660 Series Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming.
1. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
2. Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
3. M.2 Thermal Guard
The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
4. 5 W/mK Thermal Pad
By using 1.5mm thicker 5 W/mK thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time.
1. 2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
2. Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
3. Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Thermal Throttling As Temperature Rises
3% Cooler by implementing
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.
Intel 2.5GbE LAN
WIFI 6 802.11ax
USB 3.2 Gen 2x2 Type-C®
HI-FI Audio
CONNECTIVITY
GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network, storage, and WIFI connectivity.
First adopter on 2.5GbE LAN onboard
2X Faster than ever
ㆍAdoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
WIFI 6 802.11ax + BT 5 Module
Wireless solution 802.11ax WIFI 6 with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6
  1. 5.5X throughput than 802.11ac 1x1*
  2. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
  3. Network efficiency increase for better user experience
Connecting the Future - USB 3.2 Gen 2x2 Type-C®
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.
High-End Audio Capacitors
AORUS motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
AORUS motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
RGB FUSION
UEFI BIOS
Easy Tune
System Information Viewer
Personalization
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
RGB FUSION 2.0
With B660 Motherboard, RGB Fusion 2.0 is even better with Addressable LEDs.* RGB Fusion 2.0 offers users the option to control onboard RGB and external RGB / Addressable LED light strips for their PC. Already feature filled with colors and patterns, RGB Fusion 2.0 on B660 Series Motherboards are now upgraded with Addressable LED support. With external Addressable LED strips*, where each LED is digitally addressable, users can experience even more patterns, styles, and illuminations.
With B660 Motherboard will support either 5v or 12v Addressable LED lighting strips and up to 300 LED lights. RGB Fusion 2.0 with Addressable LEDs comes with new patterns and various speed settings with more to come.
* Addressable LEDs are available only on select Motherboards, external LED Strips, Addressable LED Strips are not included with Motherboard purchase.
  • Cycle Color
  • Static
  • Pulse
  • Flash
  • Double Flash
  • Music
  • Random
  • Game
  • Digital A
  • Digital B
  • Digital C
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment.
System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.
Q-Flash Plus
Solid Pin
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.​
Solid Pin Power Connectors
AORUS motherboards feature solid plated ATX 12V 8pin + 4pin power connectors to offer a stable power supply during CPU overloading.
Solid Pin Power connector advantages
  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan
Key Feature
Intel® B660 AORUS Motherboard with 12*+1+1 Twin Hybrid Phases Digital VRM Design, Fully Covered Thermal Design, 2 x PCIe 4.0 M.2 with Thermal Guard, Intel® 2.5GbE LAN, WIFI 6 802.11ax, Rear USB 3.2 Gen 2x2 Type-C®, RGB FUSION 2.0, Q-Flash Plus

  • Supports 12th Gen Intel® Core™ Series Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • 12*+1+1 Twin Hybrid Digital VRM Design with 60A DrMOS
  • Shielded Memory Routing for Better Memory Overclocking
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
  • WIFI 6 802.11ax 2T2R & BT5 with AORUS Antenna
  • Blazing Fast Intel® 2.5GbE LAN with Bandwidth Management
  • Dual Ultra-Fast NVMe PCIe 4.0* x4 M.2 with Thermal Guard
  • SuperSpeed USB 3.2 Gen 2x2 Type-C® delivers up to 20Gb/s transfer speeds
  • Pre-installed IO Shield for easy and quick installation
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card

    * Actual support may vary by CPU.
    * 6+6 phases parallel power design

* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.