B660 GAMING X AX DDR4 (rev. 1.0)

Intel® B660 Chipset
 
Intel® B660 GAMING Motherboard with 8+1+1 Phases Hybrid Digital VRM Design*, Fully Covered Thermal Design, 3 x PCIe 4.0/3.0 M.2 with Thermal Guard, 2.5GbE Gaming LAN, WIFI 6 802.11ax, Front USB 3.2 Gen 2 Type-C®, RGB FUSION 2.0, Q-Flash Plus​​

  • Supports Intel® Core™ 14th/ 13th /12th processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs​​
  • 8+1+1 Hybrid Digital VRM Design with DrMOS*​​
  • Fully Covered Thermal Design with High Coverage VRM Heatsinks​
  • WIFI 6 802.11ax 2T2R & BT5 with AERO Antenna​
  • Fast 2.5 GbE GAMING LAN with Bandwidth Management​​
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guard
  • SuperSpeed USB 3.2 Gen 2 Type-C® delivers up to 10Gb/s transfer speeds​
  • Pre-installed IO Shield for easy and quick installation​
  • High Quality Audio Capacitors and Audio Noise Guard​
  • RGB FUSION 2.0 supports Addressable LED & RGB LED Strips​​
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP​​
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card​​

*DrMOS adopted only on Vcore/Vgt phase counts. ​
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
1
Solid Pin Power Connectors
  1. 8 pin CPU Power Connector
2
WIFI 6E 802.11ax 2T2R & BT 5 with AERO Antenna
3
DisplayPort
4
HDMI
5
2.5 GbE LAN
6
Advanced Thermal Design
  1. Fully Covered MOSFET Heatsinks
  2. Thermal Conductivity Pad
  3. M.2 Connector with Thermal Guard
  4. Integrated IO Shield
7
3 x M.2 Ultra Storage Performance Connectors
  1. 2* PCIe 4.0 x4 M.2 Connectors
  2. 1* PCIe 3.0 x4 M.2 Connector
  3. 1* Thermal Guard
8
Audio Solutions
  1. 8-ch HD Audio
  2. Audio Noise Guard
  3. High-End Audio Capacitors
9
RGB FUSION 2.0
  1. Addressable LED Header*2
  2. RGB LED Header*2
10
8+1+1 Phases Hybrid Digital VRM Design
  1. 60A DrMOS*
  2. 2X Copper PCB
  3. PCIe 4.0 Ready PCB
  4. Premium Choke and Capacitor
    5. * DrMOS adopted only on Vcore / VGT.
11
Supports 12th Gen. Intel Core™ Processors
12
Dual Channel DDR4, 4 DIMMs
13
Front USB3.2 Gen2 Type-C® for Connecting Devices
14
Full PCI Express 4.0 Design
  1. 1*PCIe 4.0 x16 slot
  2. 2* PCIe 4.0 x4 M.2 Connectors
15
4*SATA 6Gb/s
16
Q-FLASH Plus Onboard Button
PERFORMANCE
Hybrid Digital VRM Design
PCIe 4.0 Design
DDR4 XMP
Hybrid Cores Optimization
UNPARALLELED PERFORMANCE
With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIAGBYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.
8+1+1 Phases Hybrid Digital VRM Design
Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.
  1. 8+1+1 Phases DrMOS*
  2. Solid capacitors to improve transient response and minimize oscillation
  3. 8-pin Solid Pin CPU Power Connector

    4. * DrMOS adopted only on Vcore / VGT.
1. PCIe 4.0 x16 slot
2. PCIe 4.0 M.2 Connector
3. PCIe 4.0 Ready PCB
GIGABYTE B660 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Support for DDR4 XMP Up to 4400MHz and Beyond*
GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 4400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE otherboard.
* XMP Profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new " CPU Upgrade " in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
GAMING
MAX PERFORMANCE
• Deactivate all E-Core
• Zero compromise on gaming performance
• Up to 20% lower CPU package power
• Up to 5°C lower CPU temperature
• Activate all P-Core and E-Core
• Maximize full multi-cores performance
THERMAL
Thermal Design
Fully Covered
MOSFET Heatsink
M.2 Thermal Guard
2X Copper PCB
Smart Fan 6
1. Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
2. M.2 Thermal Guard
The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
3. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
1. 2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
2. Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
3. Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Thermal Throttling As Temperature Rises
3% Cooler by implementing　　　　　　　
2x copper PCB Design
By adopting 2x copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.
CONNECTIVITY
3x PCIe 4.0 M.2 Slots
2.5 GbE LAN
802.11ax WIFI 6E
USB 3.2 Gen 2 Type-C
Hi-Fi Audio
NEXT GENERATION CONNECTIVITY
GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network, storage, and WIFI connectivity.
First adopter on 2.5 GbE LAN onboard

2X Faster than ever
  1. Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

  2. Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet


Connecting the Future - USB Type-C®
The World's Next Universal Connector
The USB Type-C® is a new reversible connector that is loaded with useful features such as USB 3.2 Gen 2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen 2 controller, this little port provides the best USB Type-C® experience possible.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
PERSONALIZATION
RGB FUSION
UEFI BIOS
EASY TUNE
System Information Viewer
DEFINITIVE AESTHETICS
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment.

System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.

ULTRA DURABLE
Q-Flash Plus
Solid Pin
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.
Solid Pin Power Connectors
B660 motherboards feature solid plated ATX 12V 8 pin power connectors to offer a stable power supply during CPU overloading.
Solid Pin Power connector advantages
  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan

* Terminy „HDMI” oraz „ HDMI High-Definition Multimedia Interface ”, charakterystyczny kształt produktów HDMI (HDMI trade dress) oraz Logo HDMI stanowią znaki towarowe lub zastrzeżone znaki towarowe spółki HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.