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HPC/AI Server - 3rd Gen Intel® Xeon® Scalable - 2U DP 8 x PCIe Gen4 GPUs Immersion
- Immersion Cooling Server
- Supports up to 8 x Dual slot Gen4 GPUs
- Dual 3rd Gen Intel® Xeon® Scalable Processors
- 8-Channel DDR4 RDIMM/LRDIMM, 24 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 4 x 2.5" SATA/SAS hot-swappable bays
- 8 x FHFL PCIe Gen4 x16 slots for GPUs
- 2 x LP PCIe Gen4 x16 slots for add-in cards
- Dual 3200W 80 PLUS Platinum redundant power supply
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 87.5 x 800
448 x 87.5 x 800
Motherboard
MG52-G20
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Dual processor, 10nm technology
TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4189
Socket P+
Socket P+
Chipset
Intel® C621A
Memory
24 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
LAN
Top side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Bottom side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)
SAS card is required for SAS devices support
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
Riser Card CRSG620 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG621 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG01A x 2:
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG621 x 2:
4 x PCIe x16 (Gen4 x16) FHFL slots, from PEX88048, for GPUs
Riser Card CRSG01A x 2:
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_0
1 x PCIe x16 (Gen4 x16) low-profile slot on the top side, from CPU_1
- Maximum limitation of GPU cards: 285mm (L) x 111.5mm (W) x 39.5mm (H).
- System is validated for population with a uniform GPU model.
- Support is not provided for mixed GPU populations.
Internal I/O
1 x TPM header
1 x VROC connector
1 x VROC connector
Top I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 50/60Hz
- 200-208V~/ 16A, 50/60Hz
- 214-234V~/ 16A, 50/60Hz
- 240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output: - Max 1106W/ 100-127V~
+12.3V/ 87A
+12Vsb/ 3A
- Max 2434W/ 200-208V~
+12.3V/ 195A
+12Vsb/ 3A
- Max 2828W/ 214-234V~
+12.3V/ 227A
+12Vsb/ 3A
- Max 3234W/ 240V~ or 240Vdc Input
+12.3V/ 260A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 14A, 50/60Hz
- 200-208V~/ 16A, 50/60Hz
- 214-234V~/ 16A, 50/60Hz
- 240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output: - Max 1106W/ 100-127V~
+12.3V/ 87A
+12Vsb/ 3A
- Max 2434W/ 200-208V~
+12.3V/ 195A
+12Vsb/ 3A
- Max 2828W/ 214-234V~
+12.3V/ 227A
+12Vsb/ 3A
- Max 3234W/ 240V~ or 240Vdc Input
+12.3V/ 260A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
Operating Properties
Operating coolant temperature: 25°C to 35°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1133 x 724 x 261 mm
Packaging Content
1 x G292-280-IAY1
2 x CPU heatsinks
2 x CPU heatsinks
Part Numbers
- Barebone package: 6NG292280DR000IAY1*
- Motherboard: 9MG52G20NR-00
- CPU heatsink: 25ST1-343203-M1R/25ST1-343204-M1R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card - CRSG620: 9CRSG620NR-00
- Riser card - CRSG621: 9CRSG621NR-00
- Riser card - CRSG01A: 9CRSG01ANR-00
- Power supply: 25EP0-230008-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG292280SR-RMA-I101
- Motherboard: 9MG52G20NR-00
- CPU heatsink: 25ST1-343203-M1R/25ST1-343204-M1R
- Backplane board - CBPG084: 9CBPG084NR-00
- Riser card - CRSG620: 9CRSG620NR-00
- Riser card - CRSG621: 9CRSG621NR-00
- Riser card - CRSG01A: 9CRSG01ANR-00
- Power supply: 25EP0-230008-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NG292280SR-RMA-I101
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SUPPORT
드라이버
BIOS
유틸리티
Firmware
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
- Linux
Chipset
LAN
LAN
버전
사이즈
날짜
Intel® LAN Driver and Utility
Version : 26.2
678.06 MB
Jun 10, 2021
OS: Windows Server 2016 64bit,Windows Server 2019
Intel® LAN Driver and Utility
Version : 27.0
714.97 MB
Apr 21, 2022
OS: Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
버전
사이즈
날짜
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.5.0.1991
4.17 MB
Sep 08, 2021
OS: Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.5.0.1991
23.93 MB
Sep 08, 2021
OS: Windows Server 2016 64bit,Windows Server 2019
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.7.0.1273
7.07 MB
Apr 25, 2022
OS: Windows Server 2022
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.7.0.1273
23.58 MB
Apr 25, 2022
OS: Windows Server 2022
BIOS
설명
버전
사이즈
날짜
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
경고:
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
유틸리티
설명
버전
사이즈
날짜
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
매뉴얼
설명
버전
사이즈
날짜
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
RESOURCES
Success Case
Articles
Solutions
Cooling
Modern Data Center Cooling Solution: Immersion Cooling
The scalable, faster, and energy-efficient way to cool your data center, immersion cooling can save more for your business and is overall more reliable.
Cooling
Single-phase Immersion Cooling with GIGABYTE
Complete single-phase immersion cooling solution under one roof.
Cooling
Single-Phase Immersion Cooling with Asperitas
GIGABYTE has joined forces with Asperitas to offer a Single-Phase Immersion Cooling solution, allowing customers to dramatically reduce their data center energy consumption and improve PUE, radically reducing operating costs and environmental impact.
Success Case | June 07, 2023
Japanese Telco Leader KDDI Invents Immersion Cooling Small Data Center with GIGABYTE
Japanese telco giant KDDI Corporation has invented a new class of data centers that are mobile and eco-friendly. These “container-type immersion cooling small data centers” employ “single-phase immersion cooling” to reduce power consumption by 43% and lower the PUE below 1.07. GIGABYTE Technology drew from its years of experience in the telco sector to provide the R282-Z93 and R182-Z91 Rack Servers for KDDI to use as the management and GPU computing nodes in the data center. KDDI benefits from the servers’ powerful 3rd Gen AMD EPYC™ CPUs, the scalable, high-density configuration of NVIDIA® GPUs in small form factors, and the servers’ optimized compatibility with the liquid-based data center cooling solution. GIGABYTE’s participation in KDDI’s project is in line with GIGABYTE’s long-term CSR and ESG efforts, which are focused on working with global industry leaders to “Upgrade Your Life” with high tech while building a greener, more sustainable environment for our future.
Video
News
News | November 07, 2023
GIGABYTE Extends Its Advanced Cooling Portfolio Ahead of SC23 for Improved Efficiency and Sustainability in Data Centers
Supporting the best CPU & GPU technologies with liquid cooling
eBrochure
Media Review
Others
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