H263-S64- AAW1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W

# HPC # HCI

2U 4-node rear access server system
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
Dual Intel^® Xeon^® CPU Max Series per node
8-Channel DDR5 RDIMM, 16 x DIMMs per node
Dual ROM Architecture
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MS63-HD1

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor per node, TDP up to 270W
- At 30°C ambient, TDP up to 350W
- With no OCP card at 35°C ambient, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

64 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s

LAN

Rear:
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN^[1]

^[1]Please refer to optional parts for ring topology support.

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x VGA ports

Storage

Front hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS^[1]
- (NVMe from CPU_1)

Optional internal M.2 (CMTP061 x 4):
4 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_1

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1
Onboard VROC key header

Support optional RAID add-in cards

PCIe Expansion Slots

Riser Card CRSH01U x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

8 x USB 3.2 Gen1 ports (Type-A)
4 x VGA ports
4 x MLAN ports
4 x ID buttons with LED
1 x CMC port

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Ubuntu 22.04 LTS
Windows Server 2022

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 49 kg
Gross Weight: 52.99 kg

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H263-S64-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH263S64DR000ABW1*
- Barebone package (4th Gen): 6NH263S64DR000AAW1*
- Motherboard: 9MS63HD1UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Power supply: 25EP0-23000L-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00*
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S64SR-RMA-A100

SUPPORT

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Chipset

バージョン

サイズ

日付

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

H263-S64- AAW1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

H263-S64-AAW1

H263-S64- AAW1