H262-Z6B

Rev. ICU1 Rev. 100 Rev. A00 Rev. ICP1

High Density Server - AMD EPYC™ 7003/7002 - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA Immersion

# HCI # Hybrid/Private Cloud Server

Immersion Cooling Server
Hardware-level root of trust support
2U 4-node front access server system
Dual AMD EPYC™ 7003/7002 Series Processors per node
8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
8 x 1Gb/s LAN ports via Intel^® I350-AM2
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA hot-swappable bays
4 x M.2 slots with PCIe Gen4 x4 interface
8 x LP PCIe Gen4 x16 slots
4 x OCP 3.0 Gen4 x16 mezzanine slots
Dual 2200W 80 PLUS Platinum redundant power supply

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
440 x 87.5 x 840

Motherboard

MZ62-HD4 Rev. 3.0

CPU

AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 280W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

Chipset

System on Chip

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s

LAN

Per node:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Total:
8 x 1Gb/s LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management LAN
1 x CMC port

Video

Integrated in Aspeed^® AST2500
- 1 x Mini-DP

Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA hot-swappable bays, from CPU_1

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards

Total:
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

Riser Card CRSH01H x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards

Internal I/O

Per node:
1 x TPM header

Top I/O

Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x ID LED

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
4 x ID LEDs
*1 x CMC port
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC port, CMC status LED, and reset button per system.

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note: System power supply requires C19 power cord.

System Management

Aspeed^® AST2500 Baseboard Management Controller
Aspeed^® AST2520A2-GP Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Operating Properties

Operating coolant temperature: 25°C to 35°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-Z6B
8 x CPU heatsinks

Part Numbers

- Barebone package: 6NH262Z6BRR000ICU1*
- Motherboard: 9MZ62HD4NR-00
- CPU heatsink: 25ST1-443109-A3R/25ST1-44310A-A3R
- Backplane board: 9CBPH082NR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- Power supply: 25EP0-22200C-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP061: 9CMTP061NR-00
- Ring topology kit: 6NH262Z65SR-00-100

SUPPORT

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Online Support

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BIOS

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Firmware

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Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit

Chipset

バージョン

サイズ

日付

AMD Chipset Driver
For AMD EPYC 7002/ 7003

Version : 2.10.09.156

17.22 MB

Mar 05, 2021

H262-Z6B

SPECIFICATIONS

SUPPORT

RESOURCES

H262-Z6B (Rev. ICU1)