GV-NX86T256D

As a citizen of the global village, GIGABYTE exert ourselves to be a pioneer in environment care. Give the whole of Earth a promise that our products do not contain any of the restricted substances in concentrations and applications banned by the RoHS Directive, and are capable of being worked on at the higher temperatures required for lead free solder. One Earth and GIGABYTE Cares!

Delivers up to 2X the performance of a single GPU configuration for unparalleled gaming experiences by allowing two graphics cards to run in parallel. The must-have feature for performance PCI Express graphics, SLI dramatically scales performance on 60 top PC games.

PureVideo™ technology ensures support for new video formats, while its motion estimation engine (MEE) allows the card to record and play video files simultaneously without interrupting system performance. An added value PureVideo™ provides is its high-definition MPEG-2 and WMV HD hardware accelerator that take on much of the heavy lifting during playback of Hi-Def video. Other video playback enhancements include a unique color correction mechanism that will help to create a home theater from a PC.

Designed to run perfectly with the next-generation PCI Express bus architecture. This new bus doubles the bandwidth of AGP 8X delivering over 4 GB/sec. in both upstream and downstream data transfers.

Silent-Pipe II technology that generates natural airflow to provide more efficient cooling without the use of a heat sink or fan. This is achieved through a unique design that draws cool air in through a new proprietary front-flow thermal module to remove heat from the heat sink on the VGA card. GIGABYTE Silent-Pipe II Features and Benefits:
*Feature 1. Proprietary front-flow thermal module: the first Dual-slot heat pipe solution to utilize a convection slot at the back of the chassis to increase thermal dissipation.
*Feature 2. Natural convection design: Silent-Pipe II technology artfully uses the temperature difference between the inside and outside of chassis, creating natural system convection.
*Feature 3. High-precision die-casting process: uses the latest high-precision die forming technology to increase the thermal conductivity of the material that makes up the heat sink.
*Feature 4. SLI ready: designed for compatibility with dual card configurations.
*Feature 5. High performance heat pipe with sintered powder wicks: with the industry's best powder-style pure copper heat pipe for ultra efficient thermal conductivity.
*Feature 6. 3D performance ready: designed stability during demanding 3D applications.
*Feature 7. Integrated architecture design: heat pipe and GPU actually make contact to provide unequalled heat conductivity.

Delivers higher performance through blazing clock rates.