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Server motherboards for demanding applications come in form factors: EEB/E-ATX/ATX/microATX/mini-ITX.

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Compute, Storage, and Networking are possible in high density, multi-node servers at lower TCO and greater efficiency.

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Stand-alone chassis for customers to customize and expand as needs change.

Direct Liquid Cooling

Ensure peak performance in all configurations. Adopt direct-to-chip liquid cooling for the rising AI/HPC era.

Immersion Cooling

Address rising server heat with submerged cooling. Embrace next-gen liquid cooling for improved TCO and PUE.

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Based on OCP Open Rack Standards, barebone racks and nodes for datacenters.

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Arm architecture servers will compete in Cloud to Edge as they tackle compute-bound workloads.

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Processing power, large amounts of data, fast networking, and accelerators all bundle into a scale out ready HPC and/or AI server solution.

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Systems that do visual applications from computer graphics to computer animation rely on visual computing servers.

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