H274-S61- LAW1

High Density Server - Intel^® Xeon^® 6 Processors - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 DLC

# HPC # HCI # Hybrid/Private Cloud Server

Direct liquid cooling solution
2U 4-node rear access server system
Dual Intel^® Xeon^® 6 Processors per node, LGA 4710
8-Channel DDR5 RDIMM / MRDIMM, 16 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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Perbandingan

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SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 877

Motherboard

MS64-HD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6700E-Series Processors
- Intel^® Xeon^® 6700P-Series Processors (available Q1'25)
- Intel^® Xeon^® 6500P-Series Processors (available Q1'25)

Dual processor per node, TDP up to 350W at 35°C ambient

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

64 x DIMM slots
DDR5 memory supported
8-Channel memory per processor
MRDIMM supported^[1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8000 MT/s

^[1]MRDIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores.

LAN

Rear (I/O board - CLBH160 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe & SATA from CPU_1)

Optional internal M.2 (CMTP160 x 4):
4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key headers

PCIe Expansion Slots

Riser Card CRSH01R x 4:
- 4 x LP x16 (Gen5 x16), from CPU_0

4 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLBH160 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm

Packaging Content

1 x H274-S61-LAW1
8 x CoolIT CPU cold plate loops
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone w/ cold plates: 6NH274S61DR000LAW1*
- Barebone w/o cold plates: 6NH274S61DZ000LAW1*
- Motherboard: 9MS64HD0UR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-10000E-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000V-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP160: 9CMTP160NR-00*
- CoolIT leak sensor board: 6NH274S60S1000LAW10 (QPA:4)
- RMA packaging: 6NH274S61SR-RMA-L100

SUPPORT

Unduhan

Driver
BIOS
Utilitas
Firmware

Manual
Support List

Online Support

Driver

BIOS

Utilitas

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versi

Ukuran

Tanggal

Intel^® Chipset Driver

Version : 10.1.19975.8620

6.41 MB

Oct 08, 2024

H274-S61- LAW1 .svg-ArrowDownSolid-color { fill: #707070 }

SPECIFICATIONS

SUPPORT

RESOURCES

H274-S61-LAW1

H274-S61- LAW1