H262-Z63

2U 4-Node - Rear access
440 x 87.5 x 840

MZ62-HD0 Rev. 3.0

AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 225W, cTDP up to 240W

Supports cTDP 280W at ambient 25°C

Note:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2) Contact GIGABYTE sales rep or technical support for more details about supporting 240W - 280W CPU.

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

System on Chip

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s

Per node:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management port

Total:
8 x 1Gb/s LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management ports
1 x CMC port

Integrated in Aspeed^® AST2500 x 4
- 4 x VGA ports

Per node:
2 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

Total:
8 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)

N/A

N/A

Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Per node:
1 x TPM header

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port

*Only one CMC port per system.

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note: System power supply requires C19 power cord.

Aspeed^® AST2500 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Net Weight: 47.63 kg
Gross Weight: 49.63 kg

1180 x 779 x 300 mm

1 x H262-Z63
8 x CPU heatsinks
1 x 3-Section Rail kit

- Barebone package: 6NH262Z63MR-00-A*
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z63SR-RMA-A100