Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
Motherboard
MZ62-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, cTDP up to 240W
- At 25°C ambient, cTDP up to 280W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
[Note] Contact our sales representatives or technical support for more details about supporting cTDP 240W-280W CPUs.
Socket
8 x LGA 4094
Socket SP3
Memory
64 x DIMM slots
DDR4 memory supported
8-Channel memory per processor
RDIMM/LRDIMM: Up to 3200 MT/s
LAN
Rear:
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video
Integrated in ASPEED® AST2500 x 4
- 4 x VGA ports
Storage
Front hot-swap:
8 x 2.5" Gen3 NVMe/SATA
- (NVMe from CPU_1)
- (SATA from CPU_0)
Internal M.2:
4 x M.2 (2242/2260/2280/22110), PCIe Gen3 x4, from CPU_0 [1]
4 x M.2 (2242/2260/2280/22110), PCIe Gen3 x4, from CPU_1 [1]
[1] CPU TDP is limited to 155W when using M.2 drives.
PCIe Expansion Slots
8 x LP x16 (Gen4 x16), from CPU_0
4 x OCP 2.0 mezzanine (Gen3 x16), from CPU_0 (Type1, P1, P2, P3, P4)
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
Rear I/O
8 x USB 3.0 ports (Type-A)
4 x VGA ports
8 x RJ45 ports
4 x MLAN ports
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply [1]
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
[1] The system power supply requires C19 power cord.
System Management
ASPEED
® AST2500 Baseboard Management Controller
ASPEED
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 47.63 kg
Gross Weight: 49.63 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-Z63
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262Z63MR-00-A*
- Motherboard: 9MZ62HD0NR-00*
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH080: 9CBPH080NR-00*
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00*
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z63SR-RMA-A100
* Semua bahan yang tersedia disini adalah hanya untuk referensi. GIGABYTE berhak merubah atau merevisi isi sewaktu-waktu tanpa pemberitahuan terlebih dahulu.
* Semua logo dan merek dagang adalah hak cipta dari masing-masing pemegangnya.
* Sehubungan dengan rancangan standar PC, sebagian jumlah memori dicadangkan untuk penggunaan sistem sehingga ukuran memori yang sesungguhnya lebih kecil dari yang disebutkan.
