- Home
- Enterprise
- High Density Servers
- H223-Z10-AAP1
High Density Server - AMD EPYC™ 9005/9004 - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe
- 2U 3-node front access server system
- Single AMD EPYC™ 9005/9004 Series Processors per node
- 12-Channel DDR5 RDIMM, 12 x DIMMs per node
- Dual ROM Architecture
- 2 x CMC ports
- 6 x 9.5mm E1.S Gen4 NVMe hot-swap bays
- 3 x FHHL PCIe Gen5 x16 slots
- 3 x LP PCIe Gen5 x16 slots
- 3 x OCP NIC 3.0 PCIe Gen5 x16 slots
- 2 x 3000W 80 PLUS Titanium redundant power supply
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 3-Node - Front access
447.8 x 87.5 x 500
447.8 x 87.5 x 500
Motherboard
MZ13-HD0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors
Single processor per node, cTDP up to 240W
- At ambient 30°C, cTDP up to 300W
[Note] cTDP supported up to 400W under limited thermal conditions. Please contact our sales representatives for more details.
AMD EPYC™ 9004 Series Processors
Single processor per node, cTDP up to 240W
- At ambient 30°C, cTDP up to 300W
[Note] cTDP supported up to 400W under limited thermal conditions. Please contact our sales representatives for more details.
Socket
3 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
36 x DIMM slots
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
12-Channel memory architecture
AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s
AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Front:
2 x Chassis Management LAN
2 x Chassis Management LAN
Video
Integrated in Aspeed® AST2600 x 3
- 3 x VGA ports
- 3 x VGA ports
Storage
Front hot-swap:
6 x 9.5mm E1.S Gen4 NVMe
Optional internal M.2 (CMTP192 x 3):
3 x M.2 (2280/22110), PCIe Gen4 x4
6 x 9.5mm E1.S Gen4 NVMe
Optional internal M.2 (CMTP192 x 3):
3 x M.2 (2280/22110), PCIe Gen4 x4
SAS
N/A
RAID
N/A
PCIe Expansion Slots
Riser Card CRSH01Q x 3:
- 3 x LP x16 (Gen5 x16)
Riser Card CRSH01R x 3:
- 3 x FHHL x16 (Gen5 x16)
3 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
- 3 x LP x16 (Gen5 x16)
Riser Card CRSH01R x 3:
- 3 x FHHL x16 (Gen5 x16)
3 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
6 x USB 3.2 Gen1 ports (Type-A)
3 x VGA ports
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
3 x VGA ports
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
PCIe Gen4 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
2 x 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS / BMC / CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H223-Z10-AAP1
3 x CPU heatsinks
1 x L-shape Rail kit
3 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH223Z10DR000ACP1*
- Motherboard: 9MZ13HD0UR-000-3*
- L-shape Rail kit: 25HB2-A86106-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Power supply: 25EP0-23000F-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH223Z10SR-RMA-A100
- Motherboard: 9MZ13HD0UR-000-3*
- L-shape Rail kit: 25HB2-A86106-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- LAN bridge board - CLSH13: 9CLSH13NR-00*
- Power supply: 25EP0-23000F-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- RMA packaging: 6NH223Z10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SUPPORT
Driver
BIOS
Utility
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Version
Size
Date
Chipset driver for AMD EPYC 9005/9004 series processors
Version : 6.10.07.747
2.82 MB
Oct 29, 2024
OS: Windows Server 2019,Windows Server 2022
AMD Chipset Windows Server PSHED Plug-in Device Driver
Version : 6.10.04.235
26.5 MB
Oct 29, 2024
OS: Windows Server 2019,Windows Server 2022
LAN
LAN
Version
Size
Date
Intel® LAN Driver and Utility
Version : 29.3.1
818.63 MB
Oct 29, 2024
OS: Windows Server 2019,Windows Server 2022
BIOS
Description
Version
Size
Date
Updated support for AMD EPYC™ 9005 series processors.
Version : R01_F22
44.33 MB
Oct 17, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utility
Description
Version
Size
Date
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Description
Version
Size
Date
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.09
123.77 MB
Sep 05, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
English
Manual
Description
Version
Size
Date
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
Description
Version
Size
Date
OS Support List
Version : R1
0.06 MB
Oct 15, 2024
AMD EPYC™ 9005/9004 Series Processors OS Support List
RESOURCES
Back to H223-Z10-AAP1
