H282-Z60
HCI Server - AMD EPYC™ 7003 - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA
- Hardware-level root of trust support
- 2U 4-node front access server system
- AMD EPYC™ 7003 Series processors
- Dual processor per node, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 2 x CMC ports
- 8 x 2.5" 7mm Gen4 NVMe/SATA hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x OCP 3.0 Gen4 x16 slots
- Dual 2200W (240V) 80 PLUS Platinum redundant power supply
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Front access
447 x 86.8 x 902
447 x 86.8 x 902
Motherboard
MZ62-HD4 Rev. 2.0
CPU
AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
CPU 200W, fully supported at ambient 35°C
CPU 240W with conditional support at ambient 35°C, either PCIe slot or OCP 3.0 available per Node
CPU 280W with conditional support at ambient 25°C, either PCIe slot or OCP 3.0 available per Node
NOTE: If only one CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
CPU 200W, fully supported at ambient 35°C
CPU 240W with conditional support at ambient 35°C, either PCIe slot or OCP 3.0 available per Node
CPU 280W with conditional support at ambient 25°C, either PCIe slot or OCP 3.0 available per Node
NOTE: If only one CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200/2933 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200/2933 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0
Total:
8 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0
2 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0
Total:
8 x 2.5" 7mm slim type Gen4 NVMe/SATA hot-swappable bays, from CPU_0
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots on front side, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
1 x PCIe x16 (Gen4 x16) low-profile slot on front side, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots on front side, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Internal I/O
Per node:
1 x M.2 slot
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x M.2 slot
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
Rear I/O
2 x CMC ports
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s
PCIe Gen4 x4 or SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage/Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 33.3 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H282-Z60
8 x CPU heatsinks
1 x L-shape Rail kit
8 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH282Z60MR-00-A*
- Motherboard: 9MZ62HD4NR-00
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-423203-A0R/ 25ST1-44320J-A0R
- Backplane board - CBPH022: 9CBPH022NR-00
- Fan module: 25ST2-88382H-D0R/25ST2-88382I-D0R
- NVMe PCIe Card - CNV3152: 9CNV3152NR-00
- Power Supply: 25EP0-222006-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH282Z60SR-RMA-A100
- Motherboard: 9MZ62HD4NR-00
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-423203-A0R/ 25ST1-44320J-A0R
- Backplane board - CBPH022: 9CBPH022NR-00
- Fan module: 25ST2-88382H-D0R/25ST2-88382I-D0R
- NVMe PCIe Card - CNV3152: 9CNV3152NR-00
- Power Supply: 25EP0-222006-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH282Z60SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
晶片組
網路介面
BIOS
說明
版本
檔案大小
日期
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M21_R34
35.38 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.83.48
104.65 MB
Nov 15, 2023
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
說明
版本
檔案大小
日期
說明
版本
檔案大小
日期
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Tech Guide | October 27, 2022
Data Center Cooling: The Key to Green Computing and a Low-Carbon Transition
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In the era of cloud computing, just about everyone has heard of the terms “private cloud” and “public cloud”. Chances are, you are using one or both of them in your everyday life—but how much do you really know about them? If you had the chance, could you build a private cloud for yourself or your organization? GIGABYTE Technology, an industry leader in server solutions used by global cloud service providers, is pleased to present our latest Tech Guide. We will examine the difference between private and public clouds, introduce the private cloud’s advantages and limitations, and then introduce GIGABYTE products that may help you build and operate a private cloud of your own.
Tech Guide | March 16, 2022
What is Big Data, and How Can You Benefit from It?
You may be familiar with the term, “big data”, but how firm is your grasp of the concept? Have you heard of the “5 V’s” of big data? Can you recite the “Three Fundamental Steps” of how to use big data? Most importantly, do you know how to reap the benefits through the use of the right tools? GIGABYTE Technology, an industry leader in high-performance server solutions, is pleased to present our latest Tech Guide. We will walk you through the basics of big data, explain why it boasts unlimited potential, and finally delve into the GIGABYTE products that will help you ride high on the most exciting wave to sweep over the IT sector.
Tech Guide | February 11, 2022
The Advantages of ARM: From Smartphones to Supercomputers and Beyond
Processors based on the ARM architecture, an alternative to the mainstream x86 architecture, is gradually making the leap from mobile devices to servers and data centers. In this Tech Guide, GIGABYTE Technology, an industry leader in high-performance server solutions, recounts how ARM was developed. We also explain the various benefits of ARM processors and recommend ARM servers for different sectors and applications.
Tech Guide | January 11, 2022
Cluster Computing: An Advanced Form of Distributed Computing
Cluster computing is a form of distributed computing that is similar to parallel or grid computing, but categorized in a class of its own because of its many advantages, such as high availability, load balancing, and HPC. GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you learn about cluster computing. We also recommend GIGABYTE servers that can help you benefit from cluster computing.
Tech Guide | January 10, 2022
Setting the Record Straight: What is HPC? A Tech Guide by GIGABYTE
The term HPC, which stands for high performance computing, gets thrown around a lot nowadays, as server solutions become more and more ubiquitous. It is running the risk of becoming a catchall phrase: anything that is “HPC” must be the right choice for your computing needs. You may be wondering: what exactly are the benefits of HPC, and is HPC right for you? GIGABYTE Technology, an industry leader in high-performance servers, presents this tech guide to help you understand what HPC means on both a theoretical and a practical level. In doing so, we hope to help you evaluate if HPC is right for you, while demonstrating what GIGABYTE has to offer in the field of HPC.
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