TO23-H60

Rev. 100

ORv3 Compute Node - 3rd Gen Intel^® Xeon^® Scalable - 2OU 3-Node DP 4-Bay Gen4 NVMe/SATA/SAS

3rd Gen Intel^® Xeon^® Scalable Processors
Dual processor, LGA 4189
8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
1 x Dedicated management port
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
2 x LP PCIe Gen4 x16 slots
1 x OCP 3.0 Gen4 x16 slot
48V DC Bus Bar power solution

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2OU 3-Node
180 x 90 x 740

Open Rack Version

ORv3

Motherboard

MH62-HD2

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Memory

16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Front side:
1 x 10/100/1000 Management LAN

Storage

Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in card

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
NCSI function supported

Front I/O

2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Power Supply

Supports up to 1600W

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

System Fans

2 x 80x80x38mm (14,900rpm)

Packaging Dimensions

995 x 358 x 270 mm

Packaging Content

1 x TO23-H60
2 x CPU heatsinks

Part Numbers

- Barebone package: 6NTO23H60MR-00-1*
- Motherboard: 9MH62HD2NR-00
- CPU heatsink: 25ST1-35320C-C1R
- Front panel board - COFP212: 9COFP212NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-883825-S0S
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00

Optional parts:

- RMA packaging: 6NTO23H60SR-RMA-A100

No. of Bus Bars

1 x 48V Bus Bar

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

下載

驅動程式
BIOS
工具程式
Firmware

使用手冊
支援列表

Online Support

驅動程式

BIOS

工具程式

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

晶片組

版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18807.8279

3.29 MB

Apr 25, 2022

TO23-H60

SPECIFICATIONS

SUPPORT

RESOURCES

TO23-H60 (Rev. 100)