Intel® B660 GAMING Motherboard with 8+1+1 Phases Hybrid Digital VRM Design*, DDR5 XTREME MEMORY Design, Fully Covered Thermal Design, 2 x PCIe 4.0 M.2 with Thermal Guard, 2.5GbE LAN, USB 3.2 Gen 1 Type-C®, RGB FUSION 2.0, Q-Flash Plus​​

  • Supports Intel® Core™ 14th/ 13th /12th processors
  • Dual Channel Non-ECC Unbuffered DDR5, 4 DIMMs​​
  • 8+1+1 Hybrid Digital VRM Design with DrMOS*
  • DDR5 XTREME MEMORY Design with Shielded Memory Routing​
  • Fully Covered Thermal Design with High Coverage VRM Heatsinks​
  • Fast 2.5 GbE GAMING LAN with Bandwidth Management​​
  • Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard
  • USB 3.2 Gen 2 Type-C® for Fast and Versatile Connections​
  • Pre-installed IO Shield for easy and quick installation​
  • High Quality Audio Capacitors and Audio Noise Guard​
  • RGB FUSION 2.0 supports Addressable LED & RGB LED Strips​​
  • Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP​​
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card​​

*DrMOS adopted only on Vcore/Vgt phase counts.
OVERVIEW
PERFORMANCE
DDR5
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
OVERVIEW
PERFORMANCE
DDR5
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
1
Advanced Thermal Design
  1. Fully Covered MOSFET Heatsinks
  2. Thermal Conductivity Pad
  3. M.2 Connector with Thermal Guard
  4. Integrated IO Shield
2
DisplayPort
3
HDMI
4
2.5 GbE LAN
5
Full PCI Express 4.0 Design
  1. 1*PCIe 4.0 x16 slot
  2. 2*PCIe 4.0 x4 M.2 Connectors
6
Audio Solutions
  1. 8-ch HD Audio
  2. Audio Noise Guard
  3. High-End Audio Capacitors
7
RGB FUSION 2.0
  1. Addressable LED Header*2
  2. RGB LED Header*2
8
Solid Pin Power Connectors
  1. 8 pin CPU Power Connector
9
8+1+1 Phases Hybrid Digital VRM Design
  1. 60A DrMOS*
  2. 6-Layer & 2X Copper PCB
  3. PCIe 4.0 Ready PCB
  4. Premium Choke and Capacitor
    5. * DrMOS adopted only on Vcore / VGT.
10
Supports 12th Gen. Intel Core™ Processors
11
Dual Channel DDR5, 4 DIMMs
12
Front USB3.2 Gen2 Type-C® for Connecting Devices
13
4*SATA 6Gb/s
14
2 x M.2 Ultra Storage Performance Connectors
  1. 2* PCIe 4.0 x4 M.2 Connectors
  2. 1* Thermal Guard
15
Q-FLASH Plus Onboard Button
16
Reboot System Button
PERFORMANCE
Hybrid Digital VRM Design
PCIe 4.0 Design
Hybrid Cores Optimization
UNPARALLELED PERFORMANCE
With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIGABYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.
8+1+1 Phases Hybrid Digital VRM Design
Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.
  1. 8+1+1 Phases DrMOS*
  2. Solid capacitors to improve transient response and minimize oscillation
  3. 8-pin Solid Pin CPU Power Connector

    4. * DrMOS adopted only on Vcore / VGT.
1. PCIe 4.0 M.2 Connector
2. PCIe 4.0 x16 slot
3. PCIe 4.0 Ready PCB
GIGABYTE B660 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
GAMING
  • • Deactivate all E-Core
  • • Zero compromise on gaming performance
  • • Up to 20% lower CPU package power
  • • Up to 5°C lower CPU temperature
Max Performance
  • • Activate all P-Core and E-Core
  • • Maximize full multi-cores performance
DDR5
XMP 5600+
Unlock DDR5 Voltage
Shielded Memory Routing
XMP3.0
Support for DDR5 XMP Up to 5600MHz and Beyond*
GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 5600MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE motherboard.

*XMP profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.

Unlock DDR5 Voltage
DDR4
DDR4 voltage is managed by MB with wide range
Native DDR5
Secure Mode
MB provides fixed 5V to Native DDR5 memory and built-in PMIC outputs locked 1.1v to memory IC.
GIGABYTE Exclusive DDR5 Circuit Design
Programmable Mode
GIGABYTE’s exclusive design unlocks Native DDR5 PMIC secure mode into programmable mode and control Native DDR5 voltage with wide range.
  • • GIGABYTE exclusive circuit design unlocks Native DDR5 voltage control
  • • Transforms Native DDR5 memory module to Overclocked DDR5 memory
  • • Increases DDR5 memory overclocking performance and capability
  • • Supports all PMIC vendors for maximum compatibility
* Memory overclocking capabiblity will vary based on users' hardware configuration
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
Non-shielded
THERMAL
Thermal Design
Fully Covered MOSFET Heatsink
M.2 Thermal Guard
2X Copper PCB
SMART FAN 6
1. Fully Covered Thermal Design
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.
2. M.2 Thermal Guard
The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
3. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
1. 2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
2. Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
3. Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.
M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Thermal Throttling As Temperature Rises
3% Cooler by implementing
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.
CONNECTIVITY
2x PCIe 4.0 M.2 Slots
2.5 GbE LAN
USB 3.2 Gen 2 Type-C
Hi-Fi Audio
NEXT GENERATION CONNECTIVITY
GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network and storage connectivity.
First adopter on 2.5 GbE LAN onboard

2X Faster than ever
  1. Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

  2. Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet


Connecting the Future - USB Type-C®
The World's Next Universal Connector
The USB Type-C® is a new reversible connector that is loaded with useful features such as USB 3.2 Gen 2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen 2 controller, this little port provides the best USB Type-C® experience possible.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
PERSONALIZATION
RGB FUSION
UEFI BIOS
Easy Tune
System Information Viewer
DEFINITIVE AESTHETICS
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment.

System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.

ULTRA DURABLE
Q-Flash Plus
Solid Pin
ULTRA DURABLE
GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.
Solid Pin Power Connectors
B660 motherboards feature solid plated ATX 12V 8 pin power connectors to offer a stable power supply during CPU overloading.
Solid Pin Power connector advantages
  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan

* Les termes HDMI, interface multimédia haute définition HDMI et habillage commercial HDMI, et les logos HDMI sont des marques commerciales et des marques déposées de HDMI Licensing Administrator, Inc.
* Les spécifications et l'aspect du produit peuvent varier d'un pays à l'autre. Nous vous recommandons de contacter votre revendeur local pour connaître les spécifications et l'apparence des produits disponibles dans votre pays. Les couleurs des produits peuvent ne pas être parfaitement exacts en raison de variations causées par des variables photographiques ou les paramètres du moniteur et les images présentes sur notre site peuvent varier. Bien que nous nous efforçons de présenter des informations précises et complètes au moment de la publication, nous nous réservons le droit d'apporter des modifications sans préavis.